摘要:
An integral combination magnetic transducer and suspension assembly suitable for use in both contact recording and in winchester-type applications. A generally rectangular elongated flat suspension member includes a vertical-type inductive read/write transducer formed integrally with the suspension member and is embedded in one end of the suspension member. The vertical inductive transducer is suitable for vertical recording applications. The transducer vertical magnetic pole tip and magnetic yoke structure are formed at one end of the suspension member with the vertical pole tip extending to and exposed at an air bearing surface formed on the lower surface of a slider-shaped protrusion extending from the lower surface of the end of the suspension member. The integral transducer/suspension assembly can be adapted for either flying above the recording media or for use in continuous contact with the recording media. The air bearing surface is formed on the lower surface of a wear pad. The fabrication of the transducer/suspension assembly is adapted to be performed at the wafer level.
摘要:
An integral combination magnetic transducer and suspension assembly suitable for use in both contact recording and in winchester-type applications is described. A generally rectangular elongated flat suspension member includes a vertical-type inductive read/write transducer formed integrally with the suspension member and is embedded in one end of the suspension member. The vertical inductive transducer is suitable for vertical recording applications. The transducer vertical magnetic pole tip and magnetic yoke structure are formed at one end of the suspension member with the vertical pole tip extending to and exposed at a air bearing surface formed on the lower surface of a slider-shaped protrusion extending from the lower surface of the end of the suspension member. The integral transducer/suspension assembly can be adapted for either flying above the recording media or for use in continuous contact with the recording media. The air bearing surface is formed on the lower surface of a wear pad. The fabrication of the transducer/suspension assembly is adapted to be performed at the wafer level.
摘要:
A method and apparatus for oxidizing conductive redeposition in TMR sensors is disclosed. A TMR barrier layer is etched. Redeposition material is oxidized and the barrier is healed using an oxidizing agent selected from the group consisting of ozone and water vapor.
摘要:
The back end of an MR sensor and a flux guide are joined by a contiguous self-aligned junction so that a predictable overlap of the flux guide on the back end of the MR sensor can be achieved for optimizing signal flux density in the MR sensor. Lead/longitudinal bias layers for the MR sensor are also joined by a contiguous self-aligned junction to the flux guide for stabilizing the flux guide. By employing a single lift off resist mask the MR sensor and the lead/longitudinal bias layers can be patterned followed by deposition of the flux guide. The flux guide is a bilayer of an insulation material layer and a flux guide material layer. The insulation material layer is sandwiched between the MR sensor and the flux guide material layer and between the lead/longitudinal bias layers and the flux guide material layer. A heat guide or combined flux guide and heat guide may be substituted for the aforementioned flux guide.
摘要:
An assembly is provided which has integrated suspension and actuator arm regions. At least one actuator coil layer is located in the actuator arm region. The actuator coil layer is mounted to at least one homogeneous support layer which extends between terminal ends of the assembly for supporting all layers. A hole is provided through all layers in the actuator region at a pivot point for receiving an actuator spindle. In some embodiments of the invention, a transducer coil layer may be integrated in the suspension region and may be located in substantially a common plane with the actuator coil layer. The actuator region may be provided with a silicon base which contains integrated processing circuits which are connected to the transducer coil layer. A device may be carried by the assembly for bending the suspension region with respect to the actuator arm region. A method is provided for fabricating multiple integrated assemblies substantially entirely at the wafer level, each integrated assembly having a longitudinal recording magnetic head which has a close tolerance gap.
摘要:
Magnetic memories and methods are disclosed. A magnetic memory as described herein includes a plurality of stacked data storage layers to form a three-dimensional magnetic memory. Bits may be written to a data storage layer in the form of magnetic domains. The bits can then be transferred between the stacked data storage layers by heating a neighboring data storage layer, which allows the magnetic fields from the magnetic domains to imprint the magnetic domains in the neighboring data storage layer. By imprinting the magnetic domains into the neighboring data storage layer, the bits are copied from one data storage layer to another.
摘要:
Magnetic sensing chips and methods of fabricating the magnetic sensing chips are disclosed. A magnetic sensing chip as described herein includes an EMR sensor formed on a substrate from multiple semiconductor layers. One or more of the semiconductor layers form a quantum well comprising a two-dimensional electron gas (2DEG) or hole gas (2DHG). The magnetic sensing chip also includes one or more transistors formed on the substrate from the multiple semiconductor layers. The transistor(s) likewise include a quantum well comprising a 2DEG or 2DHG. The EMR sensor and the transistor(s) are connected by one or more connections so that the transistor(s) amplifies data signals from the EMR sensor.
摘要:
The magnetic head of the present invention, includes a second magnetic pole (P2 pole) that is fabricated upon a write gap layer that is deposited upon a flat surface. To achieve the flat surface, a P1 pole pedestal is formed upon the P1 pole layer with a sufficient thickness that the induction coil structure can be fabricated beneath the write gap layer. In the preferred embodiment, an etch stop layer is formed upon the P1 pole layer and an ion etching process is utilized to form the induction coil trenches in an etchable material that is deposited upon the etch stop layer. Following the fabrication of the induction coil structure a CMP process is conducted to obtain a polished flat surface upon which to deposit the write gap layer, and the P2 pole is then fabricated upon the flat write gap layer.The magnetic head of the present invention can be reliably fabricated with a more narrow P2 pole tip base width, such that data tracks written by the magnetic head are likewise narrower. A hard disk drive including the magnetic head of the present invention therefore possesses narrower written data tracks, such that the areal data storage density of the hard disk drive is increased.
摘要:
A magnetoresistive (MR) sensor having passive end regions separated by a central active region in which an MR sensing element is formed over substantially only the central active region. The MR sensor is defined by forming a resist pattern over both the end regions and the MR sensing element followed by an etching step where the duration of the etching is controlled by the time it takes to remove the exposed end regions' material and not by the time it takes to remove the excess MR material in the center active region. This creates an MR sensor having planar sides along the circumference of the end regions where the planar sides have no thinned edges or shoulders. The MR sensor further has no remnant MR material along the inner planar side of the end regions behind the MR sensor's trackwidth edge and adjacent to the MR sensor's back side.
摘要:
A method is provided for making an assembly that has an integrated suspension, actuator arm and actuator coil. At least one actuator coil layer is located in the actuator arm region. The actuator coil layer is mounted to at least one homogeneous support layer which extends between terminal ends of the assembly for supporting all layers. A hole is provided through all layers in the actuator region at a pivot point for receiving an actuator spindle. In some embodiments of the invention, a transducer coil layer may be integrated in the suspension region and may be located in substantially a common plane with the actuator coil layer. The actuator region may be provided with a silicon base which contains integrated processing circuits which are connected to the transducer coil layer. A device may be carried by the assembly for bending the suspension region with respect to the actuator arm region. A method is provided for fabricating multiple integrated assemblies substantially entirely at the wafer level, each integrated assembly having a longitudinal recording magnetic head which has a close tolerance gap.