摘要:
An integral combination magnetic transducer and suspension assembly suitable for use in both contact recording and in winchester-type applications. A generally rectangular elongated flat suspension member includes a vertical-type inductive read/write transducer formed integrally with the suspension member and is embedded in one end of the suspension member. The vertical inductive transducer is suitable for vertical recording applications. The transducer vertical magnetic pole tip and magnetic yoke structure are formed at one end of the suspension member with the vertical pole tip extending to and exposed at an air bearing surface formed on the lower surface of a slider-shaped protrusion extending from the lower surface of the end of the suspension member. The integral transducer/suspension assembly can be adapted for either flying above the recording media or for use in continuous contact with the recording media. The air bearing surface is formed on the lower surface of a wear pad. The fabrication of the transducer/suspension assembly is adapted to be performed at the wafer level.
摘要:
An integral combination magnetic transducer and suspension assembly suitable for use in both contact recording and in winchester-type applications is described. A generally rectangular elongate flat suspension member includes a ring-type inductive read/write transducer formed integrally with the suspension member and is embedded in one end of the suspension member. The ring-type inductive transducer is suitable for horizontal recording applications. The transducer magnetic poletips and magnetic gap are formed and positioned such that the poletips and gap are essentially co-planar with the air bearing surface of a slider-shaped protrusion extending from the lower surface of the end of the suspension member adjacent a moving media during operation. The air bearing surface presented to the disk has most of its area covered with a wear layer to minimize wear of the slider surface and poletips.
摘要:
A single point bonding tool for use in ultrasonically bonding a fine or ultrafine wire to another electrical conductor, has a thin film resistor integrally formed thereon. The thin film resistor is integrally formed on the bonding tip by standard photolithographic techniques applied to the bonding tool. The tool combines ultrasonic energy and thermal energy provided by the resistor to provide required bonding energy that may be localized both in space and in time. The result offers optimized energy transfer to the selected workpieces and minimizes risk of damage to adjacent, heat sensitive devices.
摘要:
The positioner comprises a fixed frame (1) from which extends a first pair of parallel piezoelectric benders ("bimorphs") (2, 3) which carry an intermediate frame (4). Actuation of the bimorphs (2, 3) causes lateral translation of the intermediate frame (4) with respect to the fixed frame with the bimorphs (2, 3) forming the flexible sides of a parallelogram.Attached to the intermediate frame (4) is a second pair of bimorphs (12, 13) which extend in a direction orthogonal to the direction of the first pair of bimorphs (2, 3) thus permitting a support frame (14) to exercise a deflection in a direction orthogonal with respect to the movement of the intermediate frame (4).The bimorphs used consist of one or two piezoelectric elements carrying two or more electrodes on either side the proper actuation of which causes the benders to bend with parallel end surfaces at all times.
摘要:
A read-write head is provided with a plurality of piezoelectric transducers which produce signals related to its movement as it flies over an adjacently rotating recording disk. By filtering these signals to determine their spectral components in low, medium and high ranges, hard contacts between the head and disk, disk wear or roughness and head movement can be determined.
摘要:
The present invention provides a prebent ceramic suspension which includes a ceramic load beam which is bent by a stress patch. With thin film techniques the stress patch is formed on top of the load beam. In the preferred embodiment the patch is amorphous hydrogenated diamond-like carbon. When the suspension is on a wafer the carbon patch exerts a compressive stress on a top surface of the load beam just under the patch. When the suspension is released from the wafer the compressive patch exerts tensile forces on the top surface of the load beam causing an end of the load beam to bend toward the wafer. The amount of bending of the suspension can be accurately controlled by the cross sections of the load beam and the patch as well as the lateral dimensions of the patch. Further control can be achieved by controlling the hydrogen, nitrogen and other additive components of the carbon patch. After fabrication bending can be lessened by machining portions of the patch with a laser beam to effectively negate the stress of these portions. Still further, the patch can be laterally configured so that the suspension forms an arc when preloaded on a disk. During fabrication various layers can be formed by thin film deposition to form an integrated magnetic head-slider-suspension. A pair of prebent ceramic suspensions can be preloaded on adjacent magnetic disks by a single actuator arm.
摘要:
Controlled current pulses applied to a shaped resistive heating element formed on the bonding surface of a base or substrate component provide sufficient heat to the bonding interface formed between a chip and the base bonding surface to produce a high bonding temperature at the bonding interface while maintaining an opposite surface of the chip at or below a relatively low temperature critical for components formed or mounted on the chip surface. A layer of a thermally setting thin-film bonding agent is applied over a serpentine-shaped resistive heating element having a relatively narrow linewidth formed on the base component bonding surface. The chip to be bonded is retained in a desired position against the bonding surface over the heating element and bonding agent layer while a current pulse is applied to the heating element via contact pads. The current pulse magnitude and duration are controlled to produce sufficient local heating at the bonding interface to effect the desired bonding without excessive heating of any critical components at some predetermined distance from the bonding site.
摘要:
The present invention provides a prebent ceramic suspension which includes a ceramic load beam which is bent by a stress patch. With thin film techniques the stress patch is formed on top of the load beam. In the preferred embodiment the patch is amorphous hydrogenated diamond-like carbon. When the suspension is on a wafer the carbon patch exerts a compressive stress on a top surface of the load beam just under the patch. When the suspension is released from the wafer the compressive patch exerts tensile forces on the top surface of the load beam causing an end of the load beam to bend toward the wafer. The amount of bending of the suspension can be accurately controlled by the cross sections of the load beam and the patch as well as the lateral dimensions of the patch. Further control can be achieved by controlling the hydrogen, nitrogen and other additive components of the carbon patch. After fabrication bending can be lessened by machining portions of the patch with a laser beam to effectively negate the stress of these portions. Still further, the patch can be laterally configured so that the suspension forms an arc when preloaded on a disk During fabrication various layers can be formed by thin film deposition to form an integrated magnetic head-slider-suspension. A pair of prebent ceramic suspensions can be preloaded on adjacent magnetic disks by a single actuator arm.
摘要:
The present invention provides a prebent ceramic suspension which includes a ceramic load beam which is bent by a stress patch. With thin film techniques the stress patch is formed on top of the load beam. In the preferred embodiment the patch is amorphous hydrogenated diamond-like carbon. When the suspension is on a wafer the carbon patch exerts a compressive stress on a top surface of the load beam just under the patch. When the suspension is released from the wafer the compressive patch exerts tensile forces on the top surface of the load beam causing an end of the load beam to bend toward the wafer. The amount of bending of the suspension can be accurately controlled by the cross sections of the load beam and the patch as well as the lateral dimensions of the patch. Further control can be achieved by controlling the hydrogen, nitrogen and other additive components of the carbon patch. After fabrication bending can be lessened by machining portions of the patch with a laser beam to effectively negate the stress of these portions. Still further, the patch can be laterally configured so that the suspension forms an arc when preloaded on a disk. During fabrication various layers can be formed by thin film deposition to form an integrated magnetic head-slider-suspension. A pair of prebent ceramic suspensions can be preloaded on adjacent magnetic disks by a single actuator arm.
摘要:
An integral combination magnetic transducer and suspension assembly suitable for use in both contact recording and in winchester-type applications is described. A generally rectangular elongated flat suspension member includes a vertical-type inductive read/write transducer formed integrally with the suspension member and is embedded in one end of the suspension member. The vertical inductive transducer is suitable for vertical recording applications. The transducer vertical magnetic pole tip and magnetic yoke structure are formed at one end of the suspension member with the vertical pole tip extending to and exposed at a air bearing surface formed on the lower surface of a slider-shaped protrusion extending from the lower surface of the end of the suspension member. The integral transducer/suspension assembly can be adapted for either flying above the recording media or for use in continuous contact with the recording media. The air bearing surface is formed on the lower surface of a wear pad. The fabrication of the transducer/suspension assembly is adapted to be performed at the wafer level.