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公开(公告)号：USD641719S1
公开(公告)日：2011-07-19
申请号：US29338186
申请日：2009-06-05
CPC分类号： H01L2224/48247 , H01L2224/48465 , H01L2224/49113 , H01L2924/00
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公开(公告)号：USD635527S1
公开(公告)日：2011-04-05
申请号：US29353652
申请日：2010-01-12
-
公开(公告)号：USD621799S1
公开(公告)日：2010-08-17
申请号：US29330657
申请日：2009-01-12
-
公开(公告)号：USD608307S1
公开(公告)日：2010-01-19
申请号：US29323659
申请日：2008-08-28
-
公开(公告)号：USD659657S1
公开(公告)日：2012-05-15
申请号：US29401692
申请日：2011-09-14
CPC分类号： H01L2224/48247 , H01L2224/48465 , H01L2224/49113 , H01L2924/00
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公开(公告)号：USD648686S1
公开(公告)日：2011-11-15
申请号：US29360791
申请日：2010-04-30
CPC分类号： H01L2224/48247 , H01L2224/48465 , H01L2224/49113 , H01L2924/00
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公开(公告)号：USD614592S1
公开(公告)日：2010-04-27
申请号：US29342451
申请日：2009-08-25
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公开(公告)号：US11101408B2
公开(公告)日：2021-08-24
申请号：US13367929
申请日：2012-02-07
摘要： Components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include inner walls forming a recess defining an opening such that surface area outside of the opening of the recess is less than or equal to a threshold ratio of overall surface area. In one aspect, the light emitter device component can include a ceramic body mounted directly or indirectly on the ceramic body. Components disclosed herein can result in improved light extraction and thermal management.
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公开(公告)号：US09831220B2
公开(公告)日：2017-11-28
申请号：US13424699
申请日：2012-03-20
IPC分类号： H01L25/075 , H01L33/50 , H01L33/62 , H01L33/20
CPC分类号： H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An electronic device may include a packaging substrate having a packaging face, and the packaging substrate may include positive and negative electrically conductive pads on the packaging face. A plurality of light emitting diodes may be electrically and mechanically coupled to the packaging face of the packaging substrate, with the plurality of light emitting diodes being electrically coupled between the positive and negative electrically conductive pads on the packaging face. A continuous optical coating may be provided on the plurality of light emitting diodes and on the packaging face of the packaging substrate so that the plurality of light emitting diodes are between the optical coating and the packaging substrate.
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10.发明授权公开(公告)号：US08895998B2
公开(公告)日：2014-11-25
申请号：US13436247
申请日：2012-03-30
IPC分类号： H01L29/18
CPC分类号： H01L25/0753 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/73265 , H01L2924/181 , Y10T29/49002 , Y10T29/4913 , Y10T29/49227 , H01L2924/00014 , H01L2924/00012
摘要： Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management.
摘要翻译： 公开了包含一个或多个发光器件（例如发光二极管（LED）或LED芯片）的器件，部件和方法。 在一个方面，光发射器件部件可以包括具有顶表面的陶瓷体，直接或间接安装在顶表面上的一个或多个发光器件，以及安装在顶表面上并电耦合到 一个或多个光发射器件，其中一个或多个电气部件可以通过一个或多个非金属层与陶瓷体间隔开。 本文公开的组件可以导致改进的光提取和热管理。
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