公开(公告)号：US20050118393A1

公开(公告)日：2005-06-02

申请号：US10974365

申请日：2004-10-27

申请人： Craig Corcoran ,  William Jaecklein ,  Robert Pricone ,  W. Theilman ,  Cindy Chiu ,  David Chen

发明人： Craig Corcoran ,  William Jaecklein ,  Robert Pricone ,  W. Theilman ,  Cindy Chiu ,  David Chen

IPC分类号： B26F1/24 ,  B29C59/02 ,  B32B3/10

CPC分类号： B26F1/24 ,  B26F2001/4418 ,  B26F2210/08 ,  B29C59/022 ,  B29C2059/023 ,  Y10T428/24273

摘要： A sheet (20) for use in microfluidic, microelectronic, micromechanical, and/or microoptical applications requiring through-flow, through-conductivity, through-transmission, and/or other through patterns. The sheet (20) includes micro-sized architecture including at least one via (22) extending through the thickness of the layer of thermoplastic material. The via-defining walls in the thermoplastic layer are formed by the thermoplastic material flowing around a projection and then solidifying around the projection.

摘要翻译： 一种用于微流体，微电子，微机械和/或微光学应用的片材（20），其需要贯流，贯通导电，透射和/或其它通过图案。 片材（20）包括微尺寸结构，其包括延伸穿过热塑性材料层的厚度的至少一个通孔（22）。 热塑性层中的通孔限定壁由围绕突起流动的热塑性材料形成，然后围绕突起固化。

公开(公告)号：US20050008821A1

公开(公告)日：2005-01-13

申请号：US10883869

申请日：2004-07-02

申请人： Robert Pricone

发明人： Robert Pricone

IPC分类号： B29C33/42 ,  B29C39/14 ,  B29C43/02 ,  B29C43/22 ,  B29C43/48 ,  B32B27/08 ,  B81C99/00 ,  C08J7/04 ,  B32B3/10

CPC分类号： B29C33/424 ,  B29C39/148 ,  B29C43/222 ,  B29C43/48 ,  B29L2011/0016 ,  B32B27/08 ,  B81C99/009 ,  C08J7/047 ,  Y10T428/24273 ,  Y10T428/24355 ,  Y10T428/24479 ,  Y10T428/24612

摘要： There is disclosed a method and apparatus for producing a polymeric film that accurately replicates a complex mold surface at least a portion of which surface has microstructured or nano-structured dimensions. A polymeric powder is electrodeposited on an underlying mold surface. Then the powder is cured to create a polymeric film. Finally the film is removed from the mold surface.

摘要翻译： 公开了一种用于制造聚合物膜的方法和装置，其精确复制复合模具表面，其中至少一部分表面具有微结构或纳米结构尺寸。 将聚合物粉末电沉积在下面的模具表面上。 然后将粉末固化以产生聚合物膜。 最后将膜从模具表面上取出。

公开(公告)号：US20070056404A1

公开(公告)日：2007-03-15

申请号：US11227798

申请日：2005-09-14

申请人： Robert Pricone

发明人： Robert Pricone

IPC分类号： B23D63/00

CPC分类号： B26B21/225 ,  B26B21/56 ,  B26B21/58 ,  C25D1/00 ,  C25D1/10 ,  C25D1/20

摘要： A supported cutting device is provided that includes a base and at least one cutting element having a cutting edge. The at least one cutting element extends outwardly from the base and has a geometry that permits the supported cutting device to be separated from a mold along parting lines. The base and the at least one cutting element are integrally formed of a metallic material applied by a deposition process. A method of making a supported cutting device is also provided. The method includes the steps of: 1) providing a template having at least one cutting element with a cutting edge; 2) forming a mold using at least a portion of the template that includes the at least one cutting element; 3) depositing a metallic material onto the mold to form a supported cutting device that includes a base and at least one cutting element; and 4) separating the supported cutting device from the mold.

摘要翻译： 提供了一种支撑的切割装置，其包括基部和至少一个具有切割边缘的切割元件。 所述至少一个切割元件从所述基座向外延伸并且具有允许所述支撑的切割装置沿着分型线与模具分离的几何形状。 基底和至少一个切割元件由通过沉积工艺施加的金属材料整体形成。 还提供了制造支撑切割装置的方法。 该方法包括以下步骤：1）提供具有切割边缘的至少一个切割元件的模板; 2）使用包括所述至少一个切割元件的所述模板的至少一部分来形成模具; 3）将金属材料沉积到模具上以形成支撑的切割装置，其包括基部和至少一个切割元件; 以及4）将支撑的切割装置与模具分离。

公开(公告)号：US20060210769A1

公开(公告)日：2006-09-21

申请号：US11409632

申请日：2006-04-24

申请人： Susan Swindlehurst ,  Mark Hadley ,  Gordon Craig ,  Eng-Pi Chang ,  Philip Chu ,  Dong-Tsai Hseih ,  Robert Pricone ,  Scott Thielman

发明人： Susan Swindlehurst ,  Mark Hadley ,  Gordon Craig ,  Eng-Pi Chang ,  Philip Chu ,  Dong-Tsai Hseih ,  Robert Pricone ,  Scott Thielman

IPC分类号： G11B5/64

CPC分类号： H01L24/97 ,  G02F1/133305 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L25/50 ,  H01L51/52 ,  H01L2221/68354 ,  H01L2224/13022 ,  H01L2224/24227 ,  H01L2224/7665 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/1579 ,  Y10T428/24355 ,  Y10T428/24479 ,  Y10T428/24612 ,  H01L2224/82 ,  H01L2924/00

摘要： A substrate has embossed thereon a plurality of shaped recesses of a predetermined precise geometric profile, each recess having a flat bottom surface having a major dimension of about 1000 μm or less, the substrate being capable of undergoing a thermal cycle of about one hour at about 150° C. while maintaining about ±10 μm or less dimensional stability of the embossed shaped indentations, and wherein the substrate comprises an amorphous thermoplastic material. During the thermal cycle the substrate has an elastic modulus greater than about 1010 dynes/cm2 and a viscoelastic index of less than about 0.1.

摘要翻译： 衬底上已经在其上压印了多个具有预定精确​​几何轮廓的成形凹槽，每个凹槽具有一个主要尺寸为大约1000μm或更小的平坦底表面，该基底能够在约约1小时的时间内经历约1小时的热循环 同时保持压花成形凹陷的约±10μm或更小的尺寸稳定性，并且其中所述基底包括无定形热塑性材料。 在热循环期间，基底的弹性模量大于约10/10达因/厘米2，粘弹性指数小于约0.1。