公开(公告)号：US20140256072A1

公开(公告)日：2014-09-11

申请号：US14284940

申请日：2014-05-22

Applicant: Cree, Inc.

Inventor： Ban P. Loh ,  Nathaniel O. Cannon ,  Norbert Hiller ,  John Edmond ,  Mitch Jackson ,  Nicholas W. Medendorp, JR.

IPC: H01L33/52 ,  H01L33/62

CPC classification number: H01L33/52 ,  H01L24/97 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A submount for a light emitting device package includes a substrate with a first bond pad and a second bond pad on a first surface. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are on the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad.

Abstract translation: 用于发光器件封装的基座包括在第一表面上具有第一接合焊盘和第二接合焊盘的衬底。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘位于衬底的第二表面上。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。

公开(公告)号：US09195095B2

公开(公告)日：2015-11-24

申请号：US14030224

申请日：2013-09-18

Applicant: Cree, Inc.

Inventor： Nicholas W. Medendorp, Jr. ,  Norbert Hiller ,  Russell G. Villard

IPC: G02F1/29 ,  G02F1/1335 ,  F21V8/00

CPC classification number: G02F1/133615 ,  G02B6/0028 ,  G02B6/0038 ,  G02B6/0068 ,  G02B6/0076 ,  G02F1/133524 ,  G02F1/133603

Abstract: A LED lighting device includes at least one waveguide element and multiple light-emitting sources such as LEDs or LED packages, which may be optically coupled though different light entry regions to the at least one waveguide. Multiple light solid state sources may be arranged in strips. A waveguide system includes first and second body structures each positioned to illuminate at least a portion of a target surface. One or more waveguides may be arranged to illuminate a LCD panel.

Abstract translation: LED照明装置包括至少一个波导元件和诸如LED或LED封装的多个发光源，其可以通过不同的光入射区域光耦合到至少一个波导。 多个光固态光源可以排成条状。 波导系统包括第一和第二体结构，每个体结构被定位成照射目标表面的至少一部分。 可以布置一个或多个波导以照亮LCD面板。

公开(公告)号：US20140091332A1

公开(公告)日：2014-04-03

申请号：US14030224

申请日：2013-09-18

Applicant: CREE, INC.

Inventor： Nicholas W. Medendorp, JR. ,  Norbert Hiller ,  Russell G. Villard

IPC: G02F1/1335

CPC classification number: G02F1/133615 ,  G02B6/0028 ,  G02B6/0038 ,  G02B6/0068 ,  G02B6/0076 ,  G02F1/133524 ,  G02F1/133603

Abstract: A LED lighting device includes at least one waveguide element and multiple light-emitting sources such as LEDs or LED packages, which may be optically coupled though different light entry regions to the at least one waveguide. Multiple light solid state sources may be arranged in strips. A waveguide system includes first and second body structures each positioned to illuminate at least a portion of a target surface. One or more waveguides may be arranged to illuminate a LCD panel.

Abstract translation: LED照明装置包括至少一个波导元件和诸如LED或LED封装的多个发光源，其可以通过不同的光入射区域光耦合到至少一个波导。 多个光固态光源可以排成条状。 波导系统包括第一和第二体结构，每个体结构被定位成照射目标表面的至少一部分。 可以布置一个或多个波导以照亮LCD面板。