公开(公告)号：US20160215183A1

公开(公告)日：2016-07-28

申请号：US15025143

申请日：2014-09-25

Applicant: DAICEL CORPORATION

Inventor： Hiroki TANAKA ,  Katsuhiro NAKAGUCHI ,  Kiyoharu TSUTSUMI ,  Yousuke ITO ,  Naoko TSUJI

IPC: C09J163/00 ,  C09J7/02 ,  H01L23/00

CPC classification number: C09J163/00 ,  C08G59/68 ,  C09J7/35 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/293 ,  H01L24/83 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/83855 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the cationic-polymerization initiator (B1) and 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate. The anionic-polymerization initiator (B2) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the anionic-polymerization initiator (B2) and 100 parts by weight of bisphenol-A diglycidyl ether.

Abstract translation: 提供了一种用于多层半导体的粘合剂组合物。 粘合剂组合物通过加热施加和干燥时，在低于50℃的温度下具有大致无粘合性的粘合剂层，但是当在较低温度下加热以致对半导体芯片造成损害时，提供粘合性和 此后迅速治愈。 该多层半导体用粘合剂组合物包含聚合性化合物（A），阳离子聚合引发剂（B1）和阴离子聚合引发剂（B2）中的至少一种和溶剂（C）。 可聚合化合物（A）含有80重量％以上的软化点或熔点为50℃以上的环氧化物。 阳离子聚合引发剂（B1）在130℃下得到热固化时间为3.5分钟以上的组合物，其中组合物含有1重量份的阳离子聚合引发剂（B1）和100重量份的 3,4-环氧环己基甲基（3,4-环氧）环己烷羧酸酯。 阴离子聚合引发剂（B2）在130℃下得到热固化时间为3.5分钟以上的组合物，其中组合物含有1重量份的阴离子聚合引发剂（B2）和100重量份的 双酚A二缩水甘油醚。

公开(公告)号：US20230249219A1

公开(公告)日：2023-08-10

申请号：US18014560

申请日：2021-07-05

Applicant: DAICEL CORPORATION

Inventor： Yousuke ITO

IPC: B05D7/00 ,  C08K9/04 ,  C09D11/102 ,  C09D171/12 ,  C08K5/17 ,  H05K3/10 ,  B22F1/102 ,  B22F1/054

CPC classification number: B05D7/54 ,  C08K9/04 ,  C09D11/102 ,  C09D171/12 ,  C08K5/17 ,  H05K3/10 ,  B22F1/102 ,  B22F1/054 ,  C08K2003/0806

Abstract: An object of the present disclosure is to provide a method for manufacturing a conductive laminate having an excellent steady contact between a conductive layer and an overcoat layer. The present disclosure provides a method for manufacturing a conductive laminate 10 including a substrate 11, a conductive layer 12, and an overcoat layer 13 being laminated, the method including the following Steps: Step A: forming the conductive layer 12 on the substrate 11 using a conductive ink containing a metal nanoparticle and a first ink resin; and Step B: forming the overcoat layer 13 on the conductive layer 12 using an overcoat layer-forming composition, the overcoat layer-forming composition containing an overcoat layer resin and an overcoat layer solvent, the overcoat layer solvent having an SP value, where a difference between the SP value and an SP value of the first ink resin is 1.0 or less in absolute value.

公开(公告)号：US20230272237A1

公开(公告)日：2023-08-31

申请号：US18014883

申请日：2021-07-05

Applicant: DAICEL CORPORATION

Inventor： Yousuke ITO

IPC: C09D11/52 ,  C09D11/36 ,  C09D11/38 ,  B41M5/00

CPC classification number: C09D11/52 ,  C09D11/36 ,  C09D11/38 ,  B41M5/007

Abstract: An object of the present disclosure is to provide an electrically conductive ink which can form a wire or the like on a substrate by printing and has excellent adhesion to the substrate. An electrically conductive ink of the present disclosure contains Components (A), (B), (C), and (D) below, and has a ratio of Component (C) to Component (D) (Component (C)/Component (D)) of 1 or greater: Component (A): a surface-modified metal nanoparticle having a configuration in which a surface of metal nanoparticle (Component a-1) is coated with an organic protective agent (Component a-2); Component (B): a solvent; Component (C): polyvinyl acetate; and Component (D): polyvinyl acetal.

公开(公告)号：US20160264822A1

公开(公告)日：2016-09-15

申请号：US15028147

申请日：2014-10-06

Applicant: DAICEL CORPORATION

Inventor： Yousuke ITO ,  Hiroki TANAKA ,  Kiyoharu TSUTSUMI

IPC: C09J5/06 ,  C09J125/08 ,  C09J133/06 ,  C09J4/00 ,  C09J125/18

Abstract: Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows: