公开(公告)号：US12160144B2

公开(公告)日：2024-12-03

申请号：US17660001

申请日：2022-04-20

Applicant: DENSO CORPORATION

Inventor： Syuhei Miyachi ,  Atsushi Saitou ,  Toshihiro Fujita ,  Noboru Nagase

IPC: H05K1/18 ,  H02K9/22 ,  H02K11/33 ,  B62D5/04

Abstract: An electronic device includes: a wiring board; an electric connection wiring connected to a power supply; motor connection wirings arranged on a peripheral side of the wiring board and connected to the electric motor; and semiconductor modules having semiconductor elements and a resin mold. The semiconductor modules are arranged at a position on the electric connection wiring or on the peripheral side of the electric connection wiring and on a center side of the motor connection wiring. At least a part of electrodes of the plurality of semiconductor modules is mounted on the electric connection wiring.

公开(公告)号：US09821651B2

公开(公告)日：2017-11-21

申请号：US15125978

申请日：2015-03-26

Applicant: DENSO CORPORATION

Inventor： Tatsuya Kakehi ,  Noboru Nagase ,  Kiyoshi Nagata ,  Akihiro Konno

IPC: H02G3/04 ,  B60K15/035 ,  F02M37/10 ,  F02D33/00 ,  B60K15/05 ,  F02M37/00 ,  H02K5/22 ,  F02M25/08 ,  F02M37/08 ,  B60K15/03 ,  B60K15/04

CPC classification number: B60K15/035 ,  B60K15/05 ,  B60K2015/03236 ,  B60K2015/0458 ,  F02D33/003 ,  F02M25/08 ,  F02M37/0076 ,  F02M37/0082 ,  F02M37/08 ,  F02M37/10 ,  F02M37/103 ,  F02M2037/082 ,  F02M2037/085 ,  H02K5/225

Abstract: A fuel tank lid includes a lid part and a terminal. The lid part includes an inserted part inserted into an opening of a fuel tank, and a storage part storing a drive circuit. The terminal has a central portion covered by the inserted part and the storage part, a first end connected to a pump, and a second end connected to the drive circuit. The storage part includes a side wall that has a first opening and a second opening, an upper closure part that closes the first opening, and a lower closure part that closes the second opening. The fuel tank lid further includes a discharge structure positioned vertically lower than the upper closure part and discharging a fuel vapor that has travelled along an interface between the terminal and the lid part and entered a hollow space of the storage part, to an external atmosphere.

公开(公告)号：US12033922B2

公开(公告)日：2024-07-09

申请号：US17557138

申请日：2021-12-21

Applicant: DENSO CORPORATION

Inventor： Akihiro Fukatsu ,  Noboru Nagase ,  Toshihiro Nagaya

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07 ,  H01L25/16 ,  H02M1/08 ,  H02M7/537 ,  H02P27/06 ,  H05K1/18

CPC classification number: H01L23/49537 ,  H01L23/49575 ,  H01L25/072 ,  H01L25/162 ,  H02M1/08 ,  H02M7/537 ,  H05K1/181 ,  H01L23/3121 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/3716 ,  H01L2224/40175 ,  H01L2224/40499 ,  H01L2224/48245 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1433 ,  H02P27/06 ,  H05K2201/10015 ,  H05K2201/10166

Abstract: A semiconductor device includes: first and second semiconductor elements each having two electrodes respectively disposed on two surfaces; two first terminals respectively connected to the two electrodes of the first semiconductor element and arranged side by side in one direction; two second terminals respectively connected to the two electrodes of the second semiconductor element, and arranged side by side in the one direction to be adjacent to the two first terminals; and a sealing resin portion covering the first and second semiconductor elements and the first and second terminals in a state where facing surfaces of the first and second terminals are exposed from the sealing resin portion. The facing surfaces of the two first terminals have different area ratios, the facing surfaces of the two second terminals have different area ratios, and one of the first terminals is arranged adjacent to both the two second terminals.

公开(公告)号：US10961963B2

公开(公告)日：2021-03-30

申请号：US16382549

申请日：2019-04-12

Applicant: DENSO CORPORATION

Inventor： Masashi Inaba ,  Noboru Nagase ,  Taichi Watanabe

IPC: F02M59/46 ,  H03K17/082

Abstract: An injection control device controls a drive of a solenoid in a high pressure pump for pressurizing fuel to an internal combustion engine. The injection control device includes a transistor on an upstream side of a power supply path from a direct current power supply line to the solenoid and a transistor provided on a downstream side of the power supply path. The injection control device further includes a diode at a position between an upstream terminal of the solenoid and ground, a transistor arranged in parallel with the diode, and a drive controller. The drive controller drives the solenoid to an open position by switching ON the transistors on the upstream and downstream sides of the power supply path.

公开(公告)号：US10957474B2

公开(公告)日：2021-03-23

申请号：US16382438

申请日：2019-04-12

Applicant: DENSO CORPORATION

Inventor： Masashi Inaba ,  Noboru Nagase ,  Taichi Watanabe

IPC: H01F7/06 ,  F02M51/00 ,  B05B1/30

Abstract: An injection control device controls a solenoid in a fuel injection valve. The injection control device includes a transistor on an upstream side of a first power supply path to the solenoid, and a transistor on an upstream side of a second power supply path to the solenoid. The injection control device has another transistor with a body diode arranged in parallel at a position between an upstream terminal of the solenoid and ground. The injection control device also includes a transistor on the downstream side of the first and second power supply paths. A drive controller in the injection control device drives the solenoid to an open position by switching ON the transistor on the downstream side and one of the transistors on the upstream side power supply paths.