公开(公告)号：US09922906B2

公开(公告)日：2018-03-20

申请号：US14283446

申请日：2014-05-21

Applicant: DENSO CORPORATION

Inventor： Toshihiro Nagaya ,  Nobuhiko Okada ,  Hiromasa Hayashi

IPC: H01R9/00 ,  H05K1/11 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/8385 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/1305 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.

公开(公告)号：US12033922B2

公开(公告)日：2024-07-09

申请号：US17557138

申请日：2021-12-21

Applicant: DENSO CORPORATION

Inventor： Akihiro Fukatsu ,  Noboru Nagase ,  Toshihiro Nagaya

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07 ,  H01L25/16 ,  H02M1/08 ,  H02M7/537 ,  H02P27/06 ,  H05K1/18

CPC classification number: H01L23/49537 ,  H01L23/49575 ,  H01L25/072 ,  H01L25/162 ,  H02M1/08 ,  H02M7/537 ,  H05K1/181 ,  H01L23/3121 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/3716 ,  H01L2224/40175 ,  H01L2224/40499 ,  H01L2224/48245 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1433 ,  H02P27/06 ,  H05K2201/10015 ,  H05K2201/10166

Abstract: A semiconductor device includes: first and second semiconductor elements each having two electrodes respectively disposed on two surfaces; two first terminals respectively connected to the two electrodes of the first semiconductor element and arranged side by side in one direction; two second terminals respectively connected to the two electrodes of the second semiconductor element, and arranged side by side in the one direction to be adjacent to the two first terminals; and a sealing resin portion covering the first and second semiconductor elements and the first and second terminals in a state where facing surfaces of the first and second terminals are exposed from the sealing resin portion. The facing surfaces of the two first terminals have different area ratios, the facing surfaces of the two second terminals have different area ratios, and one of the first terminals is arranged adjacent to both the two second terminals.

公开(公告)号：US10109557B2

公开(公告)日：2018-10-23

申请号：US15527740

申请日：2015-12-11

Applicant: DENSO CORPORATION

Inventor： Tetsuto Yamagishi ,  Toshihiro Nagaya ,  Masayuki Takenaka ,  Shinji Hiramitsu

IPC: H01L23/40 ,  H01L23/28 ,  H05K1/02 ,  H01L23/367

Abstract: An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.

公开(公告)号：US09832872B2

公开(公告)日：2017-11-28

申请号：US15318695

申请日：2015-09-14

Applicant: DENSO CORPORATION

Inventor： Tetsuto Yamagishi ,  Masayuki Takenaka ,  Toshihiro Nagaya ,  Shinji Hiramitsu

IPC: H05K1/00 ,  H05K1/11 ,  B29C43/18 ,  H05K3/28 ,  B29C70/78 ,  H05K1/18 ,  H01L21/56 ,  B29C70/88 ,  B29L31/34 ,  H01L23/31

CPC classification number: H05K1/115 ,  B29C43/18 ,  B29C70/78 ,  B29C70/88 ,  B29L2031/3425 ,  H01L21/565 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/28 ,  H01L2924/00

Abstract: A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.