公开(公告)号：US20180352660A1

公开(公告)日：2018-12-06

申请号：US15778369

申请日：2016-12-06

申请人： DIC Corporation

发明人： Koji HAYASHI ,  Sumio SHIMOOKA ,  Shota TANII ,  Akinori MORINO

IPC分类号： H05K3/38 ,  H05K1/02 ,  H05K3/46 ,  C09J7/21 ,  C09J7/20 ,  C09J7/28 ,  C09J7/35 ,  C09J11/04 ,  C09J7/25 ,  C09J5/06

CPC分类号： H05K3/386 ,  C08K2201/001 ,  C09J5/06 ,  C09J7/205 ,  C09J7/21 ,  C09J7/255 ,  C09J7/28 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/16 ,  C09J2400/163 ,  C09J2463/00 ,  C09J2467/005 ,  C09J2467/006 ,  H05K1/028 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/4644 ,  H05K2203/1105

摘要： An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 μm or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 μm or less thickness.