公开(公告)号：US09543192B2

公开(公告)日：2017-01-10

申请号：US14715538

申请日：2015-05-18

申请人： GLOBALFOUNDRIES Singapore Pte. Ltd.

发明人： Wei Shao ,  Juan Boon Tan ,  Wei Liu ,  Wanbing Yi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/76 ,  H01L21/768 ,  H01L23/528

CPC分类号： H01L27/0203 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76801 ,  H01L21/76838 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/24137 ,  H01L2224/82895 ,  H01L2924/14

摘要： A stitched device is disclosed. The stitched device includes first and second base devices having first and second stitched interconnects electrically coupled in a stitching level. This enables a single substrate of the stitched device to have electrically coupled first and second base devices.

摘要翻译： 公开了一种缝合装置。 缝合装置包括第一和第二基底装置，其具有以缝合水平电耦合的第一和第二缝合互连。 这使得缝合装置的单个基板具有电耦合的第一和第二基本装置。

公开(公告)号：US20160343610A1

公开(公告)日：2016-11-24

申请号：US14715538

申请日：2015-05-18

申请人： GLOBALFOUNDRIES Singapore pte. Ltd.

发明人： Wei SHAO ,  Juan Boon TAN ,  Wei LIU ,  Wanbing YI

IPC分类号： H01L21/768 ,  H01L23/528

CPC分类号： H01L27/0203 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76801 ,  H01L21/76838 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/24137 ,  H01L2224/82895 ,  H01L2924/14

摘要： A stitched device is disclosed. The stitched device includes first and second base devices having first and second stitched interconnects electrically coupled in a stitching level. This enables a single substrate of the stitched device to have electrically coupled first and second base devices.

摘要翻译： 公开了一种缝合装置。 缝合装置包括第一和第二基底装置，其具有以缝合水平电耦合的第一和第二缝合互连。 这使得缝合装置的单个基板具有电耦合的第一和第二基本装置。

公开(公告)号：US20180359874A1

公开(公告)日：2018-12-13

申请号：US15993935

申请日：2018-05-31

申请人： DYCONEX AG

发明人： Marc Hauer ,  Eckardt Bihler ,  Jochen Held

IPC分类号： H05K5/06 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/30 ,  H05K3/40 ,  H05K3/28

CPC分类号： H01L24/82 ,  A61N1/3752 ,  A61N1/3754 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/80203 ,  H01L2224/80385 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81898 ,  H01L2224/821 ,  H01L2224/82138 ,  H01L2224/82203 ,  H01L2224/8236 ,  H01L2224/82895 ,  H01L2224/9212 ,  H01L2224/92124 ,  H01L2224/92144 ,  H05K3/4661 ,  H01L2224/80001 ,  H01L2224/82

摘要： An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.

公开(公告)号：US20170125396A1

公开(公告)日：2017-05-04

申请号：US15402166

申请日：2017-01-09

申请人： GLOBALFOUNDRIES Singapore Pte. Ltd.

发明人： Wei SHAO ,  Juan Boon TAN ,  Wei LIU ,  Wanbing YI

IPC分类号： H01L27/02 ,  H01L21/48 ,  H01L23/00 ,  H01L23/522 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/528

CPC分类号： H01L27/0203 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76801 ,  H01L21/76838 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/24137 ,  H01L2224/82895 ,  H01L2924/14

摘要： A stitched device is disclosed. The stitched device includes first and second base devices having first and second stitched interconnects electrically coupled in a stitching level. This enables a single substrate of the stitched device to have electrically coupled first and second base devices.