摘要:
In a cleaning composition, a method of cleaning a semiconductor substrate and a method of manufacturing a semiconductor device, the cleaning composition includes about 0.5 to about 5% by weight of an organic ammonium hydroxide compound, about 0.1 to about 3% by weight of a fluoride compound, about 0.1 to about 3% by weight of a buffering agent, about 0.5 to about 5% by weight of an etching accelerant, and a remainder of water.
摘要:
An air purifying apparatus includes an air flow generating device for generating a flow of air, a nozzle spraying water to the air flowing through the air flow generating device, a plasma module performing a plasma reaction on the air containing the water sprayed from the nozzle, and oxidizing NOx in the air and converting it into NO3, an eliminator eliminating the NO3 converted in the plasma module and the water contained in the air and passing pure air through the eliminator and out of the air purifying apparatus and a water tank storing the water received from the eliminator, thereby heightening the removal efficiency of NOx from the air.
摘要:
Provided is an apparatus and method for analyzing contaminants on a wafer. The apparatus includes: a wafer holder for supporting a wafer on which contaminants to be analyzed are located, a laser ablation device for irradiating a laser to the wafer to extract a discrete specimen from the wafer, an analysis cell for collecting a discrete specimen from the surface of the wafer by irradiating the laser, and an analysis device connected to the analysis cell for analyzing contaminants from the collected discrete specimen.
摘要:
An apparatus for cleaning semiconductor substrates includes a chamber having a cleaning room and a drying room disposed over the cleaning room. The cleaning room and the drying room are separated or placed in communication with one another by a separation plate. An exhaust path is formed at a central portion of the separation plate. As de-ionized water (DI water) filling the cleaning room is drained during a dry process, the inside of the drying room is decompressed, and a drying fluid in the drying room flows from the drying room to the cleaning room along the exhaust path.
摘要:
Disclosed is an embodiment of an apparatus and method for manufacturing semiconductor devices. A photolithography process may be carried out after cleaning the backside of a wafer by means of an apparatus that includes an illumination module for conducting an optical illumination operation of photolithography to the front side of the wafer, and a cleaning module for conducting a cleaning operation on the wafer backside. Providing the capability of removing particles from the wafer backside and eliminating defocusing effects due to wafer chucking errors, these and other embodiments improve reliability of the photolithography process, as well as productivity and yields for the semiconductor devices.
摘要:
Provided are a supporter and a substrate cleaning apparatus including the supporter, and a method for cleaning substrates. In the apparatus, a guide plate is provided close to an outer surface of an outermost substrate among substrates arranged in a cleaning process. The guide plate is shaped such that cleaning liquid injected toward a lower edge of the outermost substrate flows to an upper edge of the outermost substrate in a substantially vertical direction.
摘要:
An apparatus for drying a substrate is provided. In one embodiment, the apparatus includes a drying room in which a support member for supporting a plurality of wafers is disposed. The apparatus further includes a drying gas-supply element for supplying a drying gas to the substrates supported by the support member. The drying gas-supply element includes nozzles located within the drying room and arranged in a plurality of groups, and supply pipes for supplying a drying gas to the nozzles. Nozzles belonging to a first group are formed such that the density of the openings in a spray port is higher in a front region than in other regions, and nozzles belonging to a second group are formed such that density of openings in a spray port is higher in a rear region than in other regions. Different supply pipes can be connected to nozzles belonging to different groups, and a flow control valve can be installed in each of the supply pipes.