摘要:
A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life.
摘要:
A vertical memory device includes a substrate, a plurality of channels on the substrate and extending in a first direction that is vertical to a top surface of the substrate, a plurality of gate lines stacked on top of each other on the substrate, a plurality of wiring over the gate lines and electrically connected to the gate lines, and an identification pattern on the substrate at the same level as a level of at least one of the wirings. The gate lines surround the channels. The gate lines are spaced apart from each other along the first direction.
摘要:
Disclosed herein is a thin film thermoelectric module. the module includes high and low temperature part module substrates, unit thermoelectric devices, and lead wires. The high and low temperature part module substrates are arranged to face each other. The unit thermoelectric devices are located between the modules to transfer heat between the modules. The lead wires are connected to the electrodes of the unit thermoelectric devices. Each of the unit thermoelectric devices includes a pair of lower and upper substrates, electrodes, and a thermoelectric material. The pair of lower and upper substrates are arranged to face each other. The electrodes are formed on the upper surface of the lower substrate and the lower surface of the upper substrate. The thermoelectric material is disposed between the electrodes.
摘要:
A semiconductor memory device which includes an internal voltage generator circuit for adjusting an external power supply voltage and generating first and second internal power supply voltages. The first internal power supply voltage is supplied to a memory cell array via a first power supply line, and the second internal power supply voltage is supplied to a peripheral circuit via a second power supply line. A control circuit controls the internal voltage generator circuit so that the levels of the first and second internal power supply voltages vary depending on a mode of operation.
摘要:
A non-volatile memory device and a method for manufacturing the same are disclosed. A non-volatile memory device comprises a semiconductor substrate having active areas which extend in a first direction and are repeatedly arranged in a second direction orthogonal to the first direction, a plurality of word lines formed on the semiconductor substrate which extending in the second direction while being repeatedly arranged in the first direction, string select lines adjacent to a first word line and extending in the second direction, ground select lines adjacent to a last word line and extending in the second direction, a first insulating interlayer formed on the resultant structure and comprising a first opening exposing the active area between the ground select lines and a second opening exposing the active area between the string select lines, a bit line contact pad formed in the second opening. A sidewall of the contact pad comprises a negative slope in the first direction and a positive slope in the second direction. A hard mask layer pattern, having the same pattern size as the active area, is formed on the contact pad and the first insulating interlayer. A second insulating interlayer is formed on the hard mask layer pattern and the first insulating interlayer. The second insulating interlayer has a bit line contact hole on the contact pad and thus the process margin is sufficiently achieved.
摘要:
A compound for an organic optoelectronic device, an organic light emitting diode, and a display device, the compound including moieties represented by the following Chemical Formula 1; Chemical Formula 4; and one of Chemical Formulae 2 and 3;
摘要:
A vertical memory device includes a substrate, a plurality of channels on the substrate and extending in a first direction that is vertical to a top surface of the substrate, a plurality of gate lines stacked on top of each other on the substrate, a plurality of wiring over the gate lines and electrically connected to the gate lines, and an identification pattern on the substrate at the same level as a level of at least one of the wirings. The gate lines surround the channels. The gate lines are spaced apart from each other along the first direction.
摘要:
A compound for an organic optoelectronic device, an organic light emitting diode, and a display device, the compound including moieties represented by the following Chemical Formula 1; Chemical Formula 4; and one of Chemical Formulae 2 and 3;
摘要:
A network correction security system. The network correction security system connected between a network node and a security-related external system, detects attacks on the network node, corrects weak parts of the performance of the network node, collects information for improving the security performance of the network node from a security-related external system, analyzes the information, monitors principal resources of the network node to detect a fault, and removes the fault according to a measure corresponding to a grade of the fault. The network correction security system carries out a recovery process when the fault has not been corrected, and recovers the functions of the network node according to a recovery mechanism when the fault has not been removed after the recovery process.
摘要:
The present invention discloses a mixer circuit for mixing two input signals by source-coupled MOS transistors and outputting a mixed result. A duty cycle controlling MOS transistor is connected to a source of each source-coupled MOS transistor in series. A duty cycle controlling pulse is applied to a gate of the duty cycle controlling MOS transistor. The duty cycle controlling pulse has a phase shift of −90 degrees with respect to a controlling pulse applied to the gate of the source-coupled MOS transistor connected with the duty cycle controlling MOS transistor in series. An AND-combination of the duty cycles of the two controlling pulses applied to the gates of the two MOS transistors connected in series can be controlled at 25%. Comparing to the conventional mixer circuit having a switch control duty cycle of 50%, the present invention achieves the effects of increasing the gain and reducing the noise figure.