Non-volatile memory device having a bit line contact pad and method for manufacturing the same

    公开(公告)号:US06593190B2

    公开(公告)日:2003-07-15

    申请号:US10072577

    申请日:2002-02-06

    IPC分类号: H01L21336

    摘要: A non-volatile memory device and a method for manufacturing the same are disclosed. A non-volatile memory device comprises a semiconductor substrate having active areas which extend in a first direction and are repeatedly arranged in a second direction orthogonal to the first direction, a plurality of word lines formed on the semiconductor substrate which extending in the second direction while being repeatedly arranged in the first direction, string select lines adjacent to a first word line and extending in the second direction, ground select lines adjacent to a last word line and extending in the second direction, a first insulating interlayer formed on the resultant structure and comprising a first opening exposing the active area between the ground select lines and a second opening exposing the active area between the string select lines, a bit line contact pad formed in the second opening. A sidewall of the contact pad comprises a negative slope in the first direction and a positive slope in the second direction. A hard mask layer pattern, having the same pattern size as the active area, is formed on the contact pad and the first insulating interlayer. A second insulating interlayer is formed on the hard mask layer pattern and the first insulating interlayer. The second insulating interlayer has a bit line contact hole on the contact pad and thus the process margin is sufficiently achieved.

    Non-volatile memory device having a bit line contact pad and method for manufacturing the same
    2.
    发明授权
    Non-volatile memory device having a bit line contact pad and method for manufacturing the same 有权
    具有位线接触焊盘的非易失性存储器件及其制造方法

    公开(公告)号:US06744096B2

    公开(公告)日:2004-06-01

    申请号:US10453943

    申请日:2003-06-04

    IPC分类号: H01L29788

    摘要: A non-volatile memory device and a method for manufacturing the same are disclosed. A non-volatile memory device comprises a semiconductor substrate having active areas which extend in a first direction and are repeatedly arranged in a second direction orthogonal to the first direction, a plurality of word lines formed on the semiconductor substrate which extending in the second direction while being repeatedly arranged in the first direction, string select lines adjacent to a first word line and extending in the second direction, ground select lines adjacent to a last word line and extending in the second direction, a first insulating interlayer formed on the resultant structure and comprising a first opening exposing the active area between the ground select lines and a second opening exposing the active area between the string select lines, a bit line contact pad formed in the second opening. A sidewall of the contact pad comprises a negative slope in the first direction and a positive slope in the second direction. A hard mask layer pattern, having the same pattern size as the active area, is formed on the contact pad and the first insulating interlayer. A second insulating interlayer is formed on the hard mask layer pattern and the first insulating interlayer. The second insulating interlayer has a bit line contact hole on the contact pad and thus the process margin is sufficiently achieved.

    摘要翻译: 公开了一种非易失性存储器件及其制造方法。 一种非易失性存储器件包括:半导体衬底,其具有沿第一方向延伸并且沿与第一方向正交的第二方向重复布置的有源区;多个字线,形成在半导体衬底上,沿第二方向延伸,同时 沿着第一方向重复地布置,与第一字线相邻并且在第二方向上延伸的串选择线,与最后字线相邻并在第二方向上延伸的接地选择线,在所得结构上形成的第一绝缘夹层, 包括暴露所述接地选择线之间的有源区域的第一开口和暴露所述串选择线之间的有源区域的第二开口,形成在所述第二开口中的位线接触焊盘。 接触垫的侧壁包括在第一方向上的负斜率和在第二方向上的正斜率。 在接触焊盘和第一绝缘中间层上形成具有与有源区相同的图案尺寸的硬掩模层图案。 在硬掩模层图案和第一绝缘中间层上形成第二绝缘中间层。 第二绝缘中间层在接触焊盘上具有位线接触孔,因此充分实现了工艺余量。

    Composition and Treatment Methods for Coronary Artery Disease
    3.
    发明申请
    Composition and Treatment Methods for Coronary Artery Disease 审中-公开
    冠状动脉疾病的组成和治疗方法

    公开(公告)号:US20080207503A1

    公开(公告)日:2008-08-28

    申请号:US11722664

    申请日:2005-12-22

    IPC分类号: A61K38/12 A61K31/685 A61P9/10

    CPC分类号: A61K38/12 A61K31/685

    摘要: The present disclosure demonstrates that cholesterol-free discoidal reconstituted HDL (R-HDL), phosphatidyl-choline (PC) and PC liposomes effectively released cholesterol from ICP. Native HDL and its apolipoproteins were not able to release cholesterol from ICP. The release of ICP cholesterol by R-HDL was dose-dependent and accompanied by the transfer of >8× more PC in the reverse direction (i.e., from R-HDL to ICP), resulting in a marked enrichment of ICP with PC. The enrichment of ICP with PC resulted in the dissolution of cholesterol crystals on ICP and allowed the removal of ICP cholesterol by apo HDL and plasma. The present disclosure provides a method of treatment for removal of cholesterol from ICP in vivo and compositions for use in such method of treatment. Such methods may be used in the treatment and/or prevention of atherosclerosis, coronary artery disease, and related disease states and conditions.

    摘要翻译: 本公开内容表明,无胆固醇的盘状重组HDL(R-HDL),磷脂酰胆碱(PC)和PC脂质体有效地从ICP中释放胆固醇。 天然HDL及其载脂蛋白不能从ICP中释放胆固醇。 通过R-HDL释放ICP胆固醇是剂量依赖性的,并且伴随着相反方向(即,从R-HDL到ICP)转移> 8x个更多的PC,导致ICP与PC的显着浓缩。 ICP与PC的富集导致胆固醇晶体在ICP上的溶解,并允许通过载脂蛋白HDL和血浆去除ICP胆固醇。 本公开提供了一种用于从体内从ICP中除去胆固醇的方法和用于这种治疗方法的组合物。 这些方法可用于治疗和/或预防动脉粥样硬化,冠状动脉疾病和相关疾病状态和病症。

    Nonvolatile memory device and method of manufacturing the same
    4.
    发明申请
    Nonvolatile memory device and method of manufacturing the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US20070111441A1

    公开(公告)日:2007-05-17

    申请号:US11594808

    申请日:2006-11-09

    IPC分类号: H01L21/336 H01L29/76

    摘要: Provided are a nonvolatile memory device and a method of manufacturing the same. A floating gate electrode of the nonvolatile memory device may have a cross-shaped section as taken along a direction extending along a control gate electrode. The floating gate electrode may have an inverse T-shaped section as taken along a direction extending along an active region perpendicular to the control gate electrode. The floating gate electrode may include a lower gate pattern, a middle gate pattern and an upper gate pattern sequentially disposed on a gate insulation layer, in which the middle gate pattern is larger in width than the lower gate pattern and the upper gate pattern. A boundary between the middle gate pattern and the upper gate pattern may have a rounded corner.

    摘要翻译: 提供一种非易失性存储器件及其制造方法。 非易失性存储器件的浮置栅极可以沿着沿着控制栅电极延伸的方向截取十字形截面。 浮置栅极可以具有沿着垂直于控制栅电极的有源区延伸的方向的T形截面。 浮栅电极可以包括顺序地设置在栅绝缘层上的下栅极图案,中栅极图案和上栅极图案,其中中间栅极图案的宽度大于下栅极图案和上栅极图案。 中间栅极图案和上部栅极图案之间的边界可以具有圆角。

    Method of fabricating nonvolatile memory device
    5.
    发明授权
    Method of fabricating nonvolatile memory device 有权
    制造非易失性存储器件的方法

    公开(公告)号:US08642458B2

    公开(公告)日:2014-02-04

    申请号:US13414085

    申请日:2012-03-07

    IPC分类号: H01L21/4763

    摘要: A method of fabricating a nonvolatile memory device includes providing an intermediate structure in which a floating gate and an isolation film are disposed adjacent to each other on a semiconductor substrate and a gate insulating film is disposed on the floating gate and the isolation film, forming a conductive film on the gate insulating film, and annealing the conductive film so that part of the conductive film on an upper portion of the floating gate flows down onto a lower portion of the floating gate and an upper portion of the isolation film.

    摘要翻译: 一种制造非易失性存储器件的方法包括提供一种中间结构,其中在半导体衬底上相邻设置浮置栅极和隔离膜,并且栅极绝缘膜设置在浮置栅极和隔离膜上,形成 导电膜,并且使导电膜退火,使得浮栅的上部的导电膜的一部分向下流到浮栅的下部和隔离膜的上部。

    Method of manufacturing a semiconductor device
    8.
    发明申请
    Method of manufacturing a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US20090004826A1

    公开(公告)日:2009-01-01

    申请号:US12214019

    申请日:2008-06-16

    IPC分类号: H01L21/20

    摘要: In a method of manufacturing a semiconductor device, a first substrate and a second substrate, which include a plurality of memory cells and selection transistors, respectively, are provided. A first insulating interlayer and a second insulating interlayer are formed on the first substrate and the second substrate, respectively, to cover the memory cells and the selection transistors. A lower surface of the second substrate is partially removed to reduce a thickness of the second substrate. The lower surface of the second substrate is attached to the first insulating interlayer. Plugs are formed through the second insulating interlayer, the second substrate and the first insulating interlayer to electrically connect the selection transistors in the first substrate and the second substrate to the plugs. Thus, impurity ions in the first substrate will not diffuse during a thermal treatment process.

    摘要翻译: 在制造半导体器件的方法中,提供分别包括多个存储单元和选择晶体管的第一衬底和第二衬底。 分别在第一基板和第二基板上形成第一绝缘层和第二绝缘中间层,以覆盖存储单元和选择晶体管。 部分地去除第二基板的下表面以减小第二基板的厚度。 第二基板的下表面附接到第一绝缘中间层。 插塞通过第二绝缘中间层,第二基板和第一绝缘夹层形成,以将第一基板和第二基板中的选择晶体管电连接到插头。 因此,在热处理过程中,第一衬底中的杂质离子将不会扩散。

    Dual gate oxide structure in semiconductor device and method thereof
    9.
    发明授权
    Dual gate oxide structure in semiconductor device and method thereof 失效
    半导体器件中的双栅极氧化物结构及其方法

    公开(公告)号:US07250346B2

    公开(公告)日:2007-07-31

    申请号:US10876277

    申请日:2004-06-23

    IPC分类号: H01L21/336

    摘要: In the method of manufacturing a dual gate oxide layer of a semiconductor device, which has first and second active regions operating at mutually different voltages on a semiconductor substrate, the first and second active regions having a device isolation layer of STI (Shallow Trench Isolation) structure; the method of manufacturing the dual gate insulation layer includes, forming the device isolation layer so that an uppermost part thereof is positioned lower than an upper surface of the first and second active regions, before forming a gate insulation layer corresponding to each of the first and second active regions. Whereby, it is be effective till a portion of trench sidewall utilized as the active region, to increase a cell current of the active region and to prevent a stringer caused by a stepped coverage between the active region and a field region and a dent caused on a boundary face between the active region and the field region.

    摘要翻译: 在制造半导体器件的双栅氧化层的方法中,其具有在半导体衬底上以相互不同的电压工作的第一和第二有源区,所述第一和第二有源区具有STI(浅沟槽隔离)的器件隔离层, 结构体; 制造双栅极绝缘层的方法包括:在形成与第一和第二有源区的上表面相对应的栅绝缘层之前,形成器件隔离层,使其最上部位于第一和第二有源区的上表面下方, 第二活跃区域。 由此,直到用作有源区域的沟槽侧壁的一部分为止,增加有源区域的单元电流并且防止由有源区域和场区域之间的阶梯式覆盖引起的桁条以及由 活动区域和场区域之间的边界面。

    Method of forming semiconductor device containing oxide/nitride/oxide dielectric layer
    10.
    发明授权
    Method of forming semiconductor device containing oxide/nitride/oxide dielectric layer 有权
    形成含有氧化物/氮化物/氧化物介电层的半导体器件的方法

    公开(公告)号:US06914013B2

    公开(公告)日:2005-07-05

    申请号:US10431609

    申请日:2003-05-08

    申请人: Byung-Hong Chung

    发明人: Byung-Hong Chung

    摘要: A semiconductor device and a method of forming the semiconductor device are disclosed. The semiconductor device includes: a semiconductor substrate; a patterned floating gate formed on the semiconductor substrate, the patterned floating gate having upper and side parts and corners; and a dielectric layer containing a first oxide layer, a nitride layer and a second oxide layer deposited over the semiconductor substrate and the floating gate. The ratio of the thickness of the first oxide layer in the upper and side parts of the patterned floating gate to the thickness of the first oxide layer in the corners of the patterned floating gate does not exceed 1.4. The semiconductor device has an improved coupling coefficient, and reduced leakage current.

    摘要翻译: 公开了半导体器件和形成半导体器件的方法。 半导体器件包括:半导体衬底; 形成在所述半导体衬底上的图案化浮栅,所述图案化浮栅具有上部和侧部和拐角; 以及包含沉积在半导体衬底和浮动栅极上的第一氧化物层,氮化物层和第二氧化物层的电介质层。 图案化浮栅的上部和侧部中的第一氧化物层的厚度与图案化浮栅的角部中的第一氧化物层的厚度之比不超过1.4。 该半导体器件具有改善的耦合系数,并减少漏电流。