摘要:
A method includes receiving a first set of parameters associated with a plurality of die. A first die performance metric associated with a selected die is determined based on the first set of parameters. At least one neighborhood die performance metric associated with a set comprised of a plurality of die that neighbor the selected die is determined based on the first set of parameters. A second die performance metric is determined for the selected die based on the first die performance metric and the neighborhood die performance metric.
摘要:
A method includes receiving a first set of parameters associated with a subset of a plurality of die on a wafer subjected to testing. The first set of data is expanded to generate estimated values for the first set of parameters for at least one untested die not included in the subset. A die health metric is determined for at least a portion of the plurality of die based on the first set of parameters including the estimated values.
摘要:
A method includes receiving a first set of parameters associated with a particular die. A health metric for a particular die is determined using a multivariate analysis of the first set of parameters. The health metric incorporates at least one performance metric. At least one of a market segment designator or a testing plan associated with the particular die is determined based on the health metric.
摘要:
A method includes receiving a first set of parameters associated with a plurality of die. A first die performance metric associated with a selected die is determined based on the first set of parameters. At least one neighborhood die performance metric associated with a set comprised of a plurality of die that neighbor the selected die is determined based on the first set of parameters. A second die performance metric is determined for the selected die based on the first die performance metric and the neighborhood die performance metric.
摘要:
The present invention provides a method and apparatus for multivariate fault identification and classification. The method includes accessing data indicative of a plurality of physical parameters associated with a plurality of processed semiconductor wafers and providing at least one summary report including information indicative of at least one univariate representation of the accessed data and at least one multivariate representation of the accessed data.
摘要:
A method for identifying faults in a semiconductor fabrication process includes storing measurements for a plurality of parameters of a wafer in the semiconductor fabrication process. A first subset of the parameters is selected. The subset is associated with a feature formed on the wafer. A principal component analysis model is applied to the first subset to generate a performance metric. A fault condition with the wafer is identified based on the performance metric. A system includes a data store and a fault monitor. The data store is adapted to store measurements for a plurality of parameters of a wafer in a semiconductor fabrication process. The fault monitor is adapted to select a first subset of the parameters, the subset being associated with a feature formed on the wafer, apply a principal component analysis model to the first subset to generate a performance metric, and identify a fault condition with the wafer based on the performance metric.
摘要:
A method includes defining a model of a process for manufacturing a device, the process including a plurality of steps. A plurality of inline process targets are defined for at least a subset of the process steps. The model relates the inline process targets to a plurality of process output parameters. A first set of probabilistic constraints for the inline process targets is defined. A second set of probabilistic constraints for the process output parameters is defined. An objective function is defined based on the model and the plurality of process output parameters. A trajectory of the process output parameters is determined by optimizing the objective function subject to the first and second sets of probabilistic constraints for each process step to determine values for the inline process targets at each process step, the optimization being iterated after completion of each process step for the remaining process steps.
摘要:
A method and apparatus is provided for fault detection and classification based on calculating distances between data points. The method comprises receiving a data sample representative of measurements of one or more variables associated with a process operation, determining a distance between the data sample and one or more data points of a history data of the process operation and detecting a fault associated with the process operation based on the distance between the data sample and the one or more data points of the history data.
摘要:
A method and an apparatus are provided for adjusting a sampling protocol in an adaptive control process. The method comprises determining a performance value based on a measurement associated with at least one or more previously processed workpieces, adjusting a sampling protocol for one or more processed workpieces based on the determined performance value, and measuring the one or more processed workpieces according to the sampling protocol to provide one or more measurements. The method further comprises adjusting at least one of a process model and a control parameter based on at least a portion of the one or more measurements.
摘要:
A method and an apparatus for adjusting a process controller based upon a fault detection analysis. A process step upon a workpiece is performed using a processing tool. Manufacturing data relating to processing of the workpiece is acquired. The manufacturing data may include metrology data relating to the processed workpiece and/or tool state data relating to the tool state of a processing tool. A metrology/tool state data integration process is performed based upon the acquired manufacturing data. The metrology/tool state data integration process includes performing an assessment of a tool health related to the processing tool and adjusting an emphasis of the metrology data based upon the assessment of the tool health.