利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

30 条记录 (耗时 0.031 秒)

    Updating process controller based upon fault detection analysis
    1.
    发明授权
    Updating process controller based upon fault detection analysis 失效
    基于故障检测分析更新过程控制器

    公开(公告)号：US06871114B1

    公开(公告)日：2005-03-22

    申请号：US10231713

    申请日：2002-08-30

    申请人： Eric O. Green ,  Matthew A. Purdy ,  Elfido Coss, Jr. ,  Christopher A. Bode ,  Robert J. Chong ,  Gregory A. Cherry

    发明人： Eric O. Green ,  Matthew A. Purdy ,  Elfido Coss, Jr. ,  Christopher A. Bode ,  Robert J. Chong ,  Gregory A. Cherry

    IPC分类号： G05B19/404 ,  G06F19/00

    CPC分类号： G05B19/404 ,  G05B2219/37252 ,  G05B2219/37345 ,  G05B2219/45031

    摘要： A method and an apparatus for adjusting a process controller based upon a fault detection analysis. A process step upon a workpiece is performed using a processing tool. Manufacturing data relating to processing of the workpiece is acquired. The manufacturing data may include metrology data relating to the processed workpiece and/or tool state data relating to the tool state of a processing tool. A metrology/tool state data integration process is performed based upon the acquired manufacturing data. The metrology/tool state data integration process includes performing an assessment of a tool health related to the processing tool and adjusting an emphasis of the metrology data based upon the assessment of the tool health.

    摘要翻译： 一种基于故障检测分析调整过程控制器的方法和装置。 使用加工工具进行工件的加工步骤。 获取与工件的加工有关的制造数据。 制造数据可以包括与处理工具有关的计量学数据和/或与加工工具的工具状态有关的刀具状态数据。 基于获取的制造数据执行计量/工具状态数据集成处理。 计量/工具状态数据集成过程包括对与处理工具相关的工具健康进行评估，并且基于对工具健康的评估来调整计量数据的重点。

    Prioritizing an application of correction in a multi-input control system
    5.
    发明授权
    Prioritizing an application of correction in a multi-input control system 失效
    在多输入控制系统中确定校正的优先级

    公开(公告)号：US06912436B1

    公开(公告)日：2005-06-28

    申请号：US10261156

    申请日：2002-09-30

    申请人： Gary Jones ,  Christopher A. Bode ,  Richard D. Edwards ,  Matthew A. Purdy

    发明人： Gary Jones ,  Christopher A. Bode ,  Richard D. Edwards ,  Matthew A. Purdy

    IPC分类号： G05B13/04 ,  G06F19/00

    CPC分类号： G05B13/042

    摘要： A method and an apparatus for selectively applying correction to a process control. Manufacturing data relating to the processing of a workpiece is acquired. The manufacturing data includes metrology data relating to the processed workpiece. An adjustment for at least a first or a second control input parameter is determined based upon the manufacturing data. The first and second control input parameters are organized to isolate the first control input parameter from the second control input parameter for adjusting at least one of the first and the second control input parameters, using a controller.

    摘要翻译： 一种用于选择性地对过程控制应用校正的方法和装置。 获取与工件的处理有关的制造数据。 制造数据包括与加工的工件相关的计量数据。 基于制造数据确定至少第一或第二控制输入参数的调整。 组织第一和第二控制输入参数以将第一控制输入参数与第二控制输入参数隔离，以使用控制器调整第一和第二控制输入参数中的至少一个。

    Matching data related to multiple metrology tools
    6.
    发明授权
    Matching data related to multiple metrology tools 有权
    匹配与多个计量工具相关的数据

    公开(公告)号：US06978189B1

    公开(公告)日：2005-12-20

    申请号：US10156450

    申请日：2002-05-28

    申请人： Christopher A. Bode ,  Matthew A. Purdy ,  Alexander J. Pasadyn

    发明人： Christopher A. Bode ,  Matthew A. Purdy ,  Alexander J. Pasadyn

    IPC分类号： G06F19/00 ,  H01L21/00

    CPC分类号： H01L21/67288 ,  H01L21/67253

    摘要： A method and an apparatus for matching data related to an integrated metrology tool and a standalone metrology tool. At least one semiconductor wafer is processed. An integrated metrology tool and/or a standalone metrology tool is matched based upon a difference between metrology data relating to a processed semiconductor wafer acquired by the integrated metrology tool and metrology data acquired by the standalone metrology tool, using a controller.

    摘要翻译： 一种用于匹配与综合计量工具相关的数据的方法和装置以及独立计量工具。 至少一个半导体晶片被处理。 基于与由综合计量工具获得的经处理的半导体晶片相关的度量数据与使用控制器由独立计量工具获取的度量数据之间的差异进行匹配的综合计量工具和/或独立计量工具。

    Controlling cumulative wafer effects
    7.
    发明授权
    Controlling cumulative wafer effects 有权
    控制累积晶圆效应

    公开(公告)号：US07069103B1

    公开(公告)日：2006-06-27

    申请号：US10184814

    申请日：2002-06-28

    申请人： Christopher A. Bode ,  Matthew A. Purdy

    发明人： Christopher A. Bode ,  Matthew A. Purdy

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G05B2219/32198 ,  G05B2219/32201 ,  G05B2219/45031 ,  Y02P90/22

    摘要： A method and apparatus provided for controlling cumulative wafer effects. The method comprises processing a workpiece, determining a cumulative effect of the processing on the workpiece and comparing the determined cumulative effect to a reference target value. The method further comprises adjusting a downstream process of the workpiece based on comparing the determined cumulative effect to the reference target value.

    摘要翻译： 提供用于控制累积晶片效应的方法和装置。 该方法包括处理工件，确定处理对工件的累积效应，并将确定的累积效应与参考目标值进行比较。 该方法还包括基于将确定的累积效应与参考目标值进行比较来调整工件的下游过程。

    Method and apparatus for controlling a film formation process with multiple objectives
    8.
    发明授权
    Method and apparatus for controlling a film formation process with multiple objectives 有权
    用于控制具有多个目标的成膜过程的方法和装置

    公开(公告)号：US07473566B1

    公开(公告)日：2009-01-06

    申请号：US10770682

    申请日：2004-02-03

    申请人： Matthew A. Purdy ,  Robert J. Chong

    发明人： Matthew A. Purdy ,  Robert J. Chong

    IPC分类号： H01L21/66

    CPC分类号： G05B13/024

    摘要： A method includes defining a plurality of objectives for a film formation process and employing a control equation incorporating the plurality of objectives to generate at least one operating recipe parameter for the film formation process. A system includes a film formation unit and a process control unit. The film formation unit is adapted to perform a film formation process in accordance with an operating recipe. The process control unit is adapted to define a plurality of objectives for the film formation process and employ a control equation incorporating the plurality of objectives to generate at least one operating recipe parameter for the film formation process.

    摘要翻译： 一种方法包括为成膜过程定义多个目标，并采用结合多个目标的控制方程来生成用于成膜过程的至少一个操作配方参数。 系统包括成膜单元和过程控制单元。 成膜单元适于根据操作配方进行成膜处理。 过程控制单元适于限定用于成膜过程的多个目标，并采用并入多个目标的控制方程，以生成用于成膜过程的至少一个操作配方参数。

    Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
    9.
    发明授权
    Method and system for dynamically adjusting metrology sampling based upon available metrology capacity 失效
    基于可用计量能力动态调整计量抽样的方法和系统

    公开(公告)号：US07076321B2

    公开(公告)日：2006-07-11

    申请号：US10958891

    申请日：2004-10-05

    申请人： Matthew A. Purdy

    发明人： Matthew A. Purdy

    IPC分类号： G06F19/00 ,  G05B21/02

    CPC分类号： H01L22/20

    摘要： The present invention is generally directed to various methods and systems for dynamically adjusting metrology sampling based upon available metrology capacity. In one illustrative embodiment, the method comprises providing a metrology control unit that is adapted to determine a baseline metrology sampling rate for at least one metrology operation, determining available metrology capacity, and providing the determined available metrology capacity to the metrology control unit wherein the metrology control unit determines a new metrology sampling rate based upon the determined available metrology capacity.

    摘要翻译： 本发明一般涉及用于基于可用的测量能力来动态地调整计量取样的各种方法和系统。 在一个说明性实施例中，该方法包括提供一个度量控制单元，其适于确定用于至少一个测量操作的基准测量采样率，确定可用的测量能力，以及将所确定的可用测量能力提供给度量控制单元，其中计量学 控制单元基于确定的可用测量能力来确定新的测量采样率。

    Dynamic metrology sampling methods, and system for performing same
    10.
    发明授权
    Dynamic metrology sampling methods, and system for performing same 失效
    动态计量抽样方法和执行相同的系统

    公开(公告)号：US06988045B2

    公开(公告)日：2006-01-17

    申请号：US10634013

    申请日：2003-08-04

    申请人： Matthew A. Purdy

    发明人： Matthew A. Purdy

    IPC分类号： G06F19/00

    CPC分类号： H01L22/20 ,  H01L2924/0002 ,  Y02P90/14 ,  H01L2924/00

    摘要： The present invention is generally directed to various methods and systems for adaptive metrology sampling plans that may be employed to monitor various manufacturing processes. In one example, the method includes creating a plurality of metrology sampling rules, assigning each of the metrology sampling rules a sampling weight value, identifying at least one workpiece that satisfies at least one of the metrology sampling rules, assigning the sampling weight value for each of the satisfied metrology sampling rules with the identified workpieces that satisfy the rules, and indicating a metrology operation should be performed when a cumulative total of the sampling weight values is at least equal to a pre-established trigger value.

    摘要翻译： 本发明一般涉及可用于监测各种制造过程的自适应测量采样计划的各种方法和系统。 在一个示例中，该方法包括创建多个计量采样规则，将每个测量采样规则分配给采样权重值，识别满足至少一个计量采样规则的至少一个工件，为每个 满足计量采样规则的识别工件满足规则，并且当采样权重值的累积总和至少等于预先建立的触发值时，应当执行计量操作。