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    Thermally stable dual metal coated laminate products made from textured polyimide film
    2.
    发明授权
    Thermally stable dual metal coated laminate products made from textured polyimide film 失效
    耐热稳定的双金属涂层层压制品由纹理聚酰亚胺薄膜制成

    公开(公告)号：US4894124A

    公开(公告)日：1990-01-16

    申请号：US268246

    申请日：1988-10-31

    申请人： Daniel P. Walsh ,  Philip D. Knudsen

    发明人： Daniel P. Walsh ,  Philip D. Knudsen

    IPC分类号： C23C18/22 ,  C25D5/56 ,  H05K1/03 ,  H05K3/38

    CPC分类号： H05K3/38 ,  C23C18/22 ,  C25D5/56 ,  H05K1/0346 ,  H05K2203/122 ,  Y10S205/926

    摘要： Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.

    摘要翻译： 均匀且完全织构化的聚酰亚胺片的两个表面涂覆有一层无电镍或钴，以及随后的电解铜层，产生用于生产电子电路的无粘合层压板。 铜和镍或钴层牢固地结合到织构化的聚酰亚胺片材上，以达到层压板超过粘结强度要求的程度，如通过目前的初始和后期互连与封装电子电路研究所（IPC）的标准剥离强度试验测量的。 焊料浮渣粘附，以及IPC测试2.4.9方法E对耐热循环的修改。

    Thermally stable dual metal coated laminate products made from polyimide film
    3.
    发明授权
    Thermally stable dual metal coated laminate products made from polyimide film 失效
    由聚酰亚胺膜制成的耐热稳定双金属涂层叠层产品

    公开(公告)号：US4992144A

    公开(公告)日：1991-02-12

    申请号：US413309

    申请日：1989-09-27

    申请人： Daniel P. Walsh ,  Philip D. Knudsen

    发明人： Daniel P. Walsh ,  Philip D. Knudsen

    IPC分类号： C23C18/22 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38

    CPC分类号： H05K3/381 ,  C23C18/22 ,  H05K3/181 ,  H05K3/38 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022

    摘要： Both surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt and can also be coated with a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which serves the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating the porous metal layer.

    摘要翻译： 聚酰亚胺薄片的两个表面涂覆有一层无电镍或钴，并且还可以在Ni上涂覆薄的无电镀铜层。 或Co.这种顽固粘合的涂层随后以这样的方式进行处理，以增加其渗透性或孔隙率，而基本上不改变其电阻性质。 诱导的孔隙率允许除去电介质聚酰亚胺片中捕获的水和其它挥发物，同时金属层的保持的电连续性足以支持电解铜电镀，其用于提供用于随后生产电子的铜厚度的双重目的 电路并且通过永久地密封或涂覆多孔金属层来防止水再次吸收到介质芯中。

    Process for coating at least one surface of a polyimide sheet with copper
    4.
    发明授权
    Process for coating at least one surface of a polyimide sheet with copper 失效
    用铜涂覆聚酰亚胺片材的至少一个表面的方法

    公开(公告)号：US4832799A

    公开(公告)日：1989-05-23

    申请号：US79532

    申请日：1987-07-30

    申请人： Philip D. Knudsen ,  Daniel P. Walsh

    发明人： Philip D. Knudsen ,  Daniel P. Walsh

    IPC分类号： H05K3/02 ,  H05K3/18 ,  H05K3/38

    CPC分类号： H05K3/381 ,  H05K3/181 ,  H05K3/38 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10S205/926

    摘要： At least one surface of a polyimide sheet surface is coated with copper in the absence of an adhesive. The polyimide surface is treated with a one phase aqueous solution comprising an alkylene diamine; an alkali metal hydroxide and a water miscible alcohol to render the surface uniformly and substantially completely textured. The treated surface then is treated with a catalyst, coated with cobalt or nickel and then coated with copper. The laminate produced passes the IPC tests for peel strength and solder float.

    摘要翻译： 在不存在粘合剂的情况下，聚酰亚胺片表面的至少一个表面涂覆有铜。 聚酰亚胺表面用包含亚烷基二胺的单相水溶液处理; 碱金属氢氧化物和水混溶性醇，以使表面均匀且基本上完全纹理化。 然后用催化剂处理经处理的表面，用钴或镍涂覆，然后用铜涂覆。 生产的层压板通过IPC测试剥离强度和焊料浮渣。

    Thermally stable dual metal coated laminate products made from polyimide film
    6.
    发明授权
    Thermally stable dual metal coated laminate products made from polyimide film 失效
    由聚酰亚胺膜制成的耐热稳定双金属涂层叠层产品

    公开(公告)号：US4950553A

    公开(公告)日：1990-08-21

    申请号：US300044

    申请日：1989-01-23

    申请人： Daniel P. Walsh ,  Philip D. Knudsen

    发明人： Daniel P. Walsh ,  Philip D. Knudsen

    IPC分类号： C23C18/22 ,  C25D5/56 ,  H05K1/03 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38

    CPC分类号： H05K3/38 ,  C23C18/22 ,  C25D5/56 ,  H05K3/181 ,  H05K3/381 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12944

    摘要： Bath surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt which can also include a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which services the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating said porous metal layer.

    摘要翻译： 聚酰亚胺片的表面涂覆有一层无电镀镍或钴，它还可以在Ni上包含一层薄的无电镀铜层。 或Co.这种顽固粘合的涂层随后以这样的方式进行处理，以增加其渗透性或孔隙率，而基本上不改变其电阻性质。 诱导的孔隙率允许除去电介质聚酰亚胺片中捕获的水和其它挥发物，同时金属层的保持的电连续性足以支持电解铜电镀，其提供用于随后生产电子的铜厚度的双重目的 电路并且通过永久地密封或涂覆所述多孔金属层来防止水再次吸收到介质芯中。

    Thermally stable dual metal coated laminate products made from textured polyimide film
    7.
    发明授权
    Thermally stable dual metal coated laminate products made from textured polyimide film 失效
    耐热稳定的双金属涂层层压制品由纹理聚酰亚胺薄膜制成

    公开(公告)号：US4868071A

    公开(公告)日：1989-09-19

    申请号：US155897

    申请日：1988-02-16

    申请人： Daniel P. Walsh ,  Philip D. Knudsen

    发明人： Daniel P. Walsh ,  Philip D. Knudsen

    IPC分类号： C23C18/22 ,  C25D5/56 ,  H05K1/03 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38

    CPC分类号： H05K3/181 ,  C23C18/22 ,  C25D5/56 ,  H05K3/38 ,  H05K3/381 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12944

    摘要： Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.

    摘要翻译： 均匀且完全织构化的聚酰亚胺片的两个表面涂覆有一层无电镍或钴，以及随后的电解铜层，产生用于生产电子电路的无粘合层压板。 铜和镍或钴层牢固地结合到织构化的聚酰亚胺片材上，以达到层压板超过粘结强度要求的程度，如通过目前的初始和后期互连与封装电子电路研究所（IPC）的标准剥离强度试验测量的。 焊料浮渣粘附，以及IPC测试2.4.9方法E对耐热循环的修改。

    METHODS, COMPOSITIONS, DEVICES, AND KITS FOR PERFORMING PHOSPHOLIPID SEPARATION
    9.
    发明申请
    METHODS, COMPOSITIONS, DEVICES, AND KITS FOR PERFORMING PHOSPHOLIPID SEPARATION 有权
    用于进行磷脂分离的方法，组合物，装置和工具

    公开(公告)号：US20130053588A1

    公开(公告)日：2013-02-28

    申请号：US13580884

    申请日：2011-05-20

    申请人： Pamela C. Iraneta ,  Thomas H. Walter ,  Xin Zhang ,  Daniel P. Walsh ,  Kevin D. Wyndham ,  Raymond P. Fish

    发明人： Pamela C. Iraneta ,  Thomas H. Walter ,  Xin Zhang ,  Daniel P. Walsh ,  Kevin D. Wyndham ,  Raymond P. Fish

    IPC分类号： B01D21/26 ,  B01D21/00 ,  C07F9/02

    CPC分类号： C07F9/103 ,  B01D15/22 ,  B01D15/327 ,  B01J20/103 ,  B01J20/28004 ,  B01J20/28019 ,  B01J20/28061 ,  B01J20/28069 ,  B01J20/287 ,  B01J20/3204 ,  B01J20/3217 ,  B01J20/3246 ,  B01J20/3293 ,  B01J2220/64 ,  B01L3/5023 ,  B01L3/50255 ,  B01L2300/0681 ,  C07K1/30 ,  G01N2030/8813

    摘要： Methods, kits and devices for separating phospholipids and proteins from small molecules in biochemical samples can feature an apparatus having a wetting barrier, at least one fit and a separation media. For example, an apparatus can include at least one wall defining a chamber having an exit and an entrance; a wetting barrier disposed between the exit and entrance, so as to define a separation media space located between the wetting barrier and the exit and a sample receiving area located between the wetting barrier and the entrance; and a separation media disposed adjacent to the wetting barrier and having a specific affinity for phospholipids. The wetting barrier is adapted to (i) retain the liquid sample and a protein precipitating agent in the sample receiving area under a first force, thereby facilitating the formation of a protein precipitate and a processed sample, and (ii) flow the processed sample through the wetting barrier and separation media under a second force, wherein the second force is greater than the first force, thereby retaining the protein precipitate in the sample receiving area, retaining phospholipids in the separation media, and eluting small molecules.

    摘要翻译： 用于从生物化学样品中分离磷脂和蛋白质与小分子的方法，试剂盒和装置可以具有具有润湿屏障，至少一种配合和分离介质的装置。 例如，设备可以包括限定具有出口和入口的室的至少一个壁; 设置在出口和入口之间的润湿屏障，以便限定位于润湿屏障和出口之间的分离介质空间以及位于润湿屏障和入口之间的样品接收区域; 以及与所述润湿屏障相邻并且对磷脂具有特异性亲和力的分离介质。 润湿屏障适于（i）在第一力下在样品接收区域中保留液体样品和蛋白质沉淀剂，从而有助于蛋白质沉淀物和加工样品的形成，以及（ii）将经处理的样品通过 润湿屏障和分离介质，其中第二力大于第一力，从而将蛋白质沉淀物保留在样品接收区域中，将磷脂保留在分离介质中，并洗脱小分子。

    Textured polyimide film
    10.
    发明授权
    Textured polyimide film 失效
    纹理聚酰亚胺薄膜

    公开(公告)号：US4806395A

    公开(公告)日：1989-02-21

    申请号：US18342

    申请日：1987-02-24

    申请人： Daniel P. Walsh

    发明人： Daniel P. Walsh

    IPC分类号： C23C18/20 ,  C23C18/22 ,  H05K3/38 ,  B05D3/10 ,  C25D5/56

    CPC分类号： C23C18/22 ,  H05K3/381 ,  H05K2203/122 ,  Y10S205/926

    摘要： One or both surfaces of a polyimide sheet are uniformly and completely textured and can be coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The surface is textured by contacting the polyimide sheet with a one-phase solution of an amine, an alkali metal hydroxide, a water miscible alcohol and water. The copper and nickel or cobalt layers of the laminate can be strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.