Abstract:
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.
Abstract:
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.
Abstract:
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.
Abstract:
Optical bond-wire interconnections between microelectronic chips, wherein optical wires are bonded onto microelectronic chips. Such optical connections offer numerous advantages compared to traditional electrical connections. Among other things, these interconnections are insensitive to electromagnetic interference and need not be located at the edges of a chip but rather can be placed for optimal utility to the circuit function. In addition, such interconnections can be given the same or other pre-specified lengths regardless of the placement in the module and they are capable of signal bandwidths up to 20 Gigahertz without causing a cross-talk problem. A method of fabrication of such optical interconnections using optical fiber, a laser or photodetector and etched mirror and etched V-shaped grooves.
Abstract:
The invention is an optical labeling/identification system that comprises an optical interrogator, optical label and a programmer. The optical label stores and returns to the interrogator different parts of a wavelength code word. The programmer programs the optical labels with a programming light beam to change the wavelength response of the labels. Interrogation and programming of the labels can be accomplished from a stand off distance without physical contact between the label and the interrogator/programmer. The label may be applied to uneven, wrinkled or discontinuous surfaces.
Abstract:
An apparatus and methods for encoding and decoding data are disclosed. The method for transmitting and receiving data allows for coding and decoding each bit of data with a different code. The transmitter and receiver devices allow encoding and decoding, respectively, each bit of data with different a code.
Abstract:
A vertical cavity modulator/detector (VCMD) device and a method for modulating and detecting light are disclosed. The VCMD device contains an n-type contact layer, a transparent tuning layer, a multiple quantum well structure, a p-type contact layer, a low reflectance mirror arranged to be an input for a light that is to be modulated and a light that is to be detected, and a high reflectance mirror, wherein said n-type contact layer, said transparent tuning layer, said multiple quantum well structure and said p-type contact layer are arranged in a stack between said low reflectance mirror and said high reflectance back mirror.
Abstract:
An apparatus and method for building an optically pumped laser integrated with an electrically driven pump laser is disclosed. The apparatus disclosed comprises an optically pumped laser containing an active layer and an optical pump laser containing an optical mode at least partially overlapping and propagating substantially parallel to optically pumped laser's active layer. The method discloses forming an optically pumped gain element containing an active layer, forming a pump laser containing an optical mode at least partially overlapping and propagating substantially parallel to optically pumped gain element's active layer.
Abstract:
An optoelectronic-RF device has at least one optical modulator/sensor comprising at least two cascaded optical-waveguide gratings and at least one non-grating optical waveguide segment interconnecting the at least two cascaded optical-waveguide gratings, with at least one optical waveguide segment interconnecting the at least two cascaded optical-waveguide gratings via the at least one non-grating optical waveguide segment. An RF waveguide is provided for propagating an RF electric field, the at least one optical modulator/sensor being disposed in and forming a portion of the RF waveguide with light propagating through the cascaded optical-waveguide gratings in a direction that is perpendicular to a direction of propagation of the RF electric field in the RF waveguide.
Abstract:
The present invention describes a microresonator that can be used as a 1:f variable coupler in a unit cell. It is described how a cascade of unit cells can be used to form a tunable, higher-order RF-filter with reconfigurable passbands. The disclosed filter structure can be utilized for the narrowband channelization of RF signals that have been modulated onto optical carriers. It is also disclosed how to utilize add/drop capabilities of the contemplated microdisks to confer connectivity and cascading in two dimensions. The present invention can conveniently provide a wavelength division multiplexing router, where an array of unit cells as provided herein can form a programmable optical switching matrix, through electronic programming of filter parameters.