公开(公告)号：US20060090927A1

公开(公告)日：2006-05-04

申请号：US10904276

申请日：2004-11-02

申请人： David Edwards ,  Ronald Hering ,  David Long ,  Jason Miller ,  Carl Peterson

发明人： David Edwards ,  Ronald Hering ,  David Long ,  Jason Miller ,  Carl Peterson

IPC分类号： H05K3/30

CPC分类号： H05K7/142

摘要： A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.

摘要翻译： 公开了一种用于安装电路板的凸轮动作扩展型支座连接器及相关方法。 支座连接器包括主体和多个安装构件，其具有用于由凸轮接合的内部纵向延伸的凸轮部分。 凸轮构造成在安装构件内定位在第一位置，在第一位置，安装构件不会抵靠安装开口的内部膨胀，并且在第二位置中凸轮接合凸轮部分以使多个安装构件 抵靠安装开口的内部。 由于凸轮作用仅仅是水平的（纯径向的），实际上没有垂直力施加到电路板上，并且可以建立和维持电路板和散热器之间的最佳配合。

公开(公告)号：US20060056156A1

公开(公告)日：2006-03-16

申请号：US10939230

申请日：2004-09-10

申请人： David Long ,  Glenn Daves ,  David Edwards ,  Ronald Hering ,  Sushumna Iruvanti ,  Kenneth Marston ,  Jason Miller

发明人： David Long ,  Glenn Daves ,  David Edwards ,  Ronald Hering ,  Sushumna Iruvanti ,  Kenneth Marston ,  Jason Miller

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A flexible plate for securing a microchip surface to the surface of a cooling device. The flexible plate allows for z-directional movement between the microchip subassembly having a circuit board and a semiconductor substrate, and the cooling device. The flexible plate is a compact, single piece design that provides constraints in alignment in the x-, y-, and theta-directions, while allowing for z-direction compliance and tilt compliance. The flexible plate has tabs for mounting the microchip subassembly and tabs for mounting the cooling device. The microchip tabs are opposite one another and the cooling device mounting tabs are opposite one another. The flexible plate is a one-piece construction made from sheet metal, plastic, or metal castings. The flexible plate has a band with all the tabs mounted on the inside of the band, or one set of tabs mounted on the outside of the band.

摘要翻译： 用于将微芯片表面固定到冷却装置的表面的柔性板。 柔性板允许具有电路板的微芯片组件和半导体衬底之间的z方向运动以及冷却装置。 柔性板是一种紧凑的单件设计，可在x轴，y轴和θ轴方向上对齐，同时允许z方向顺应性和倾斜顺应性。 柔性板具有用于安装用于安装冷却装置的微芯片组件和突出部的突片。 微芯片接头彼此相对，并且冷却装置安装接头彼此相对。 柔性板是由金属板，塑料或金属铸件制成的一体式结构。 柔性板具有带子，其中所有突片安装在带的内部，或者一组安装在带的外侧上的突片。

公开(公告)号：US20060094296A1

公开(公告)日：2006-05-04

申请号：US10904198

申请日：2004-10-28

申请人： David Edwards ,  Ronald Hering ,  David Long ,  Jason Miller

发明人： David Edwards ,  Ronald Hering ,  David Long ,  Jason Miller

IPC分类号： H01R13/73

CPC分类号： H05K7/142

摘要： An expanding standoff connector is disclosed including a collar having a slit through a wall of the collar, a tapered interior surface and an exterior surface configured to engage an interior of a mounting opening of the circuit board. A fastener including a threaded portion and a substantially cone shaped portion configured to mate with the tapered interior surface of the collar is placed within the collar and advanced to expand the collar to mount the circuit board. A related method for mounting a circuit board is also disclosed. Since the expansion is horizontal only (purely radial), a more uniform radial expansion from top-to-bottom of the collar is applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be maintained.

摘要翻译： 公开了一种扩展的支座连接器，其包括具有通过套环的壁的狭缝的套环，锥形内表面和被配置为接合电路板的安装开口的内部的外表面。 包括螺纹部分和构造成与套环的锥形内表面配合的基本锥形部分的紧固件被放置在套环内并且前进以扩展套环以安装电路板。 还公开了一种用于安装电路板的相关方法。 由于膨胀仅是水平的（纯径向），所以从电路板的顶部到底部的更均匀的径向膨胀被施加到电路板上，并且可以保持电路板和散热器之间的最佳匹配对准。

公开(公告)号：US20070052111A1

公开(公告)日：2007-03-08

申请号：US11162389

申请日：2005-09-08

申请人： David Long ,  William Brodsky ,  Jason Miller ,  John Torok ,  Jeffrey Zitz

发明人： David Long ,  William Brodsky ,  Jason Miller ,  John Torok ,  Jeffrey Zitz

IPC分类号： H01L23/48

CPC分类号： H01L23/4093 ,  H01L23/16 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/00

摘要： An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

摘要翻译： 电子模块和组装电子模块的方法。 电路板通过连接器阵列连接到芯片基板，并且基座部件位于电路板的远离芯片基板和连接器阵列的一侧。 弹性体结构被放置在电路板和基底构件之间。 弹性体结构在邻近电路板的第一限定平面和邻近基底构件的第二限定平面之间具有空隙，空隙适于允许弹性材料在结构中的局部变形。 该方法包括在电路板和基底构件之间施加压缩力以至少部分地压缩弹性体结构以改善电路板上的负载均衡。

公开(公告)号：US20050058771A1

公开(公告)日：2005-03-17

申请号：US10605219

申请日：2003-09-16

申请人： L. Herron ,  James Humenik ,  David Long ,  Jason Miller

发明人： L. Herron ,  James Humenik ,  David Long ,  Jason Miller

IPC分类号： B41F15/42 ,  H05K3/12 ,  H05K3/40 ,  B05D5/12

CPC分类号： H05K3/1233 ,  B41F15/42 ,  H05K3/4053 ,  H05K2203/0143

摘要： A method of applying paste to an electronic circuit board substrate containing via openings comprises providing over the substrate a mask having openings therein for lines and openings corresponding to the substrate via openings, and providing a roller having a surface adjacent the roller. Paste is then applied either to the mask or to a side of the surface facing the mask. The method then includes rolling the roller and the surface over the mask and flowing the paste into the openings in the mask without substantially sliding the roller and surface over the mask. In the preferred embodiment, paste is applied to a side of the surface facing the mask and the surface containing the paste is rolled over the mask. The surface may be attached to the roller. More preferably, the surface is on a film strip, separate from the roller, disposed between the roller and the substrate.

摘要翻译： 将糊剂涂布到包含通孔的电子电路板基底上的方法包括在基底上设置一个掩模，该掩模在其上具有与基底通孔开口相对应的线和开口的开口，并提供一个具有与滚子相邻的表面的辊。 然后将糊剂施加到面罩或面向面罩的表面的一侧。 该方法然后包括将辊和表面滚动在掩模上并将糊剂流动到面罩中的开口中，而不使辊和表面基本上滑过掩模。 在优选实施例中，将糊剂施加到面向面罩的表面的一侧，并且将含有糊状物的表面卷在掩模上。 表面可以附接到辊子。 更优选地，表面位于设置在辊和基底之间的与辊分离的膜条上。

公开(公告)号：US20070054514A1

公开(公告)日：2007-03-08

申请号：US11162173

申请日：2005-08-31

申请人： David Long ,  Paul Bodenweber ,  Jason Miller ,  Yuet-Ying Yu

发明人： David Long ,  Paul Bodenweber ,  Jason Miller ,  Yuet-Ying Yu

IPC分类号： H01R12/00

CPC分类号： G01R1/0433 ,  G01R3/00 ,  G01R35/00 ,  H01R12/52 ,  H01R12/7005 ,  H01R12/7076 ,  H01R12/714 ,  H05K7/1061

摘要： An apparatus and method to determine the amount of misalignment between a chip carrier and socket by the use of an inspection master. The inspection master is tailored to the perimeter size of the chip carrier and contains alignment marks on the same array as the electrical contact pads of the chip carrier. The inspection master allows bad sockets to be screened out prior to use on a chip carrier and also provides a quantified characterization of the socket array positional error which can be used to adjust the socket fabrication process.

摘要翻译： 一种通过使用检验母版来确定芯片载体和插座之间的未对准量的装置和方法。 检测主机适合于芯片载体的周长尺寸，并且在与芯片载体的电接触焊盘相同的阵列上包含对准标记。 检查主机允许在使用芯片载体之前将坏插槽进行屏蔽，并且还提供可用于调整插座制造工艺的插座阵列位置误差的量化特征。

公开(公告)号：US20050150901A1

公开(公告)日：2005-07-14

申请号：US10707812

申请日：2004-01-14

申请人： David Long ,  Jason Miller

发明人： David Long ,  Jason Miller

IPC分类号： B67D7/08 ,  G05D7/06 ,  B67D5/08

CPC分类号： G05D7/0676

摘要： A dispensing system for feeding paste through a screen onto a workpiece monitors the position of a piston applying pressure to the paste with a linear variable differential transformer and sets limits on the slope of the piston displacement is a measure of the feed rate and the “spring back” of the piston when pressure is re- leased, as a measure of trapped air in the system.

摘要翻译： 用于通过筛网将浆料输送到工件上的分配系统利用线性可变差动变压器监测活塞向浆料施加压力的位置，并且将活塞位移的斜率限制为进给速率的量度，而“弹簧 压力释放时活塞的“返回”作为系统中被捕获的空气的量度。

公开(公告)号：US20050077025A1

公开(公告)日：2005-04-14

申请号：US10685202

申请日：2003-10-14

申请人： Raschid Bezama ,  William Harkins ,  David Long ,  Jason Miller ,  Christopher Pepe ,  Ronald Rothkranz ,  John Rudy ,  Benjamin Tongue

发明人： Raschid Bezama ,  William Harkins ,  David Long ,  Jason Miller ,  Christopher Pepe ,  Ronald Rothkranz ,  John Rudy ,  Benjamin Tongue

IPC分类号： B41F15/12 ,  H05K3/12 ,  F24H3/00

CPC分类号： B41F15/12 ,  B41P2235/00 ,  H05K3/1225 ,  H05K2203/1121

摘要： A method and apparatus for the rapid cooling of screen masks used in the fabrication of semiconductor components is provided. The method and apparatus use a specially designed cooling plate which is contacted with a mask frame holding the screening mask. After a heated cleaning step which cleans the mask frame and screening mask of metal paste used in the screening operation, the cooling plate having one or more concave lower surfaces contacts the upper surfaces of the mask frame and bends the mask frame in the shape of the concave surfaces. This ensures intimate contact between the cooling plate and mask frame and enhances the thermal efficiency of the cooling step.

摘要翻译： 提供了用于半导体部件制造中使用的屏蔽掩模的快速冷却的方法和装置。 该方法和装置使用专门设计的冷却板，该冷却板与保持屏蔽罩的面罩框架相接触。 在清洗掩模框架并筛选用于筛选操作的金属膏的掩模的加热清洁步骤之后，具有一个或多个凹下表面的冷却板接触荫罩框架的上表面，并将面罩框架弯曲成 凹面。 这确保了冷却板和掩模框架之间的紧密接触，并提高了冷却步骤的热效率。

公开(公告)号：US20110054823A1

公开(公告)日：2011-03-03

申请号：US12682715

申请日：2008-11-21

申请人： David Long ,  Gerald Jung ,  Gerhard Loschner ,  Paul Hayford ,  Andrew Moulden

发明人： David Long ,  Gerald Jung ,  Gerhard Loschner ,  Paul Hayford ,  Andrew Moulden

IPC分类号： G06F19/00

CPC分类号： G05B23/0256 ,  G01M17/007 ,  G05B17/02 ,  G05B2219/23446 ,  G05B2219/25367

摘要： Provided are a method, a test system and a microcontroller (40), for use in a test system for testing vehicles and automotive components. Control signals that are generated by active components within a vehicle during a test drive are sampled and played back to a specimen vehicle within a laboratory test environment, and the control signals are played back synchronously with data representing conditions and events such as loads, acceleration and displacements that are experienced during the test drive. A microcontroller (40) is provided to buffer control signal data and to synchronize playback of the control signals via a CAN (60) bus within the specimen test vehicle in response to trigger signals.

摘要翻译： 提供了一种方法，测试系统和微控制器（40），用于测试车辆和汽车部件的测试系统。 在测试驱动期间由车辆内的有源部件产生的控制信号在实验室测试环境内被采样并再现到标本车辆，并且控制信号与表示诸如负载，加速度等条件和事件的数据同步地重放， 测试期间经历的位移。 微控制器（40）被提供用于缓冲控制信号数据，并且响应于触发信号，通过样本测试车辆内的CAN（60）总线来同步控制信号的重放。

公开(公告)号：US20080196639A1

公开(公告)日：2008-08-21

申请号：US11949628

申请日：2007-12-03

申请人： David Long

发明人： David Long

IPC分类号： F23J15/02 ,  B01D53/56

CPC分类号： B01D53/56 ,  B01D2251/20 ,  C04B7/364 ,  Y02P40/145 ,  C04B7/42 ,  C04B7/434 ,  C04B7/24 ,  C04B7/421 ,  C04B7/432

摘要： The present invention is directed to systems and methods of reducing nitrogen oxides from an air stream by introducing cyanide into the air stream and reacting the cyanide with the nitrogen oxides. In some embodiments, the reacting takes place at a temperature between 1200 and 1640° F.

摘要翻译： 本发明涉及通过将氰化物引入空气流中并使氰化物与氮氧化物反应从而将空气流中的氮氧化物还原的系统和方法。 在一些实施方案中，反应在1200至1640°F之间的温度下进行。