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14 条记录 (耗时 0.032 秒)

    NON-CONTACT FLUID PARTICLE CLEANER AND METHOD
    2.
    发明申请
    NON-CONTACT FLUID PARTICLE CLEANER AND METHOD 失效
    非接触式流体颗粒清洁剂和方法

    公开(公告)号：US20050205699A1

    公开(公告)日：2005-09-22

    申请号：US10708736

    申请日：2004-03-22

    申请人： Raschid Bezama ,  Nike Medahunsi

    发明人： Raschid Bezama ,  Nike Medahunsi

    IPC分类号： B08B3/02 ,  B08B5/02 ,  B08B15/04 ,  F17D3/00 ,  H01L21/00

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  B08B5/02 ,  B08B15/04 ,  B08B2203/0229 ,  H01L21/67028 ,  Y10S134/902 ,  Y10T137/2087 ,  Y10T137/2098

    摘要： A fluid particle cleaner and method are disclosed. The invention provides a partition to a side of a fluid nozzle to form: a central cavity configured to define the fluid departing the surface into a central cavity vortex; and a side cavity adjacent the central cavity to define fluid escaping from the central cavity into a side vortex. The vortices interact in a counter-rotating and stationary fashion. The strong and smaller central vortex creates an upward air velocity field that forces any airborne particle to move away from the surface. The side vortex is designed to: connect the central vortex velocity field to the vacuum flow and allow airborne particles to remain suspended until they reach the vacuum flow; and create a decelerating field for high speed particles traveling parallel (horizontally) to the surface to increase the residence time in the central vortex with positive vertical velocity.

    摘要翻译： 公开了一种流体颗粒清洁剂和方法。 本发明提供了流体喷嘴侧面的隔板，以形成：中心空腔，其被配置为将离开该表面的流体限定为中心空腔涡流; 以及与中心腔相邻的侧腔，以限定从中心腔逸出到侧涡的流体。 涡流以反向旋转和静止的方式相互作用。 强大和较小的中心涡流产生向上的空气速度场，迫使任何空气中的颗粒远离表面移动。 侧涡被设计成​​：将中心涡流速度场连接到真空流，并允许空气中的颗粒保持悬浮，直到达到真空流; 并产生平行（水平）到表面的高速颗粒的减速场，以增加具有正垂直速度的中心涡流中的停留时间。

    Electronic package with improved current carrying capability and method of forming the same
    5.
    发明申请
    Electronic package with improved current carrying capability and method of forming the same 有权
    具有改善载流能力的电子封装及其形成方法

    公开(公告)号：US20070045816A1

    公开(公告)日：2007-03-01

    申请号：US11529027

    申请日：2006-09-28

    申请人： Govindarajan Natarajan ,  Raschid Bezama

    发明人： Govindarajan Natarajan ,  Raschid Bezama

    IPC分类号： H01L23/04

    CPC分类号： H05K1/0265 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/09881 ,  H01L2924/00

    摘要： An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wirings having regions of larger wire cross-sectional areas in locations where the package must supply higher current distribution to the electronic devices and/or where signal lines need lower electrical resistance. These larger wire cross-sectional areas are vertically extended conductors applied to either the entire conductor or portions of the conductor.

    摘要翻译： 一种用于形成这种封装的电子封装和方法，其在放宽特征容差的同时，扩展线的电流能力和/或降低具有给定特征尺寸的封装的线路电阻。 所述方法和结构包括具有较大导线截面面积的区域的电线，该区域在封装必须向电子器件提供较高电流分布的位置和/或信号线需要较低电阻的位置。 这些较大的导线横截面积是垂直延伸的导体，其应用于导体的整个导体或部分。

    HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING
    6.
    发明申请
    HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING 有权
    用于高功率密度IC的高性能集成MLC冷却装置及其制造方法

    公开(公告)号：US20060266497A1

    公开(公告)日：2006-11-30

    申请号：US10908758

    申请日：2005-05-25

    申请人： Daniel Berger ,  Raschid Bezama ,  Lester Herron ,  Bruno Michel ,  Govindarajan Natarajan

    发明人： Daniel Berger ,  Raschid Bezama ,  Lester Herron ,  Bruno Michel ,  Govindarajan Natarajan

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10S165/908 ,  H01L2924/00

    摘要： A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.

    摘要翻译： 一种用于热控制基板的歧管装置，系统和方法，由此具有在与基板表面正交并且彼此平行的方向上横过其的微喷射阵列和排列阵列的歧管主体附接到基板表面用于加热或 冷却。 歧管体的腔体位于衬底表面上，使得液体从液体微喷射器发射到腔体中以与衬底表面接触，而排水口从腔体正交地去除废液体。 歧管主体被设计和构造成多个冷却单元，由此每个冷却单元具有由至少三个排水沟包围的液体微型喷射器，以防止相邻冷却单元内的相邻液体微型喷嘴之间的相互作用。 气体微粒也可以穿过歧管体以形成用于与衬底表面接触的雾化液体喷雾。

    HIGH POWER MICROJET COOLER
    8.
    发明申请
    HIGH POWER MICROJET COOLER 失效
    高功率微型冷却器

    公开(公告)号：US20070227173A1

    公开(公告)日：2007-10-04

    申请号：US11308504

    申请日：2006-03-30

    申请人： Raschid Bezama ,  Govindarajan Natarajan

    发明人： Raschid Bezama ,  Govindarajan Natarajan

    IPC分类号： F28D5/00 ,  F25D23/12

    CPC分类号： H01L23/4735 ,  F28F3/12 ,  F28F13/02 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.

    摘要翻译： 一种用于热控制的分配设备，系统和方法，其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征，以增强组件的冷却能力。 板的预定表面特征延迟了撞击板表面的流体的速度衰减，同时还增加了暴露于冲击液体的板的表面积，这进而使整体的可靠性和热性能最大化 热系统在给定的最大工作压力。

    APPARATUS AND METHOD FOR REDUCING CONTAMINATION IN IMMERSION LITHOGRAPHY
    9.
    发明申请
    APPARATUS AND METHOD FOR REDUCING CONTAMINATION IN IMMERSION LITHOGRAPHY 失效
    用于减少渗透层析污染的装置和方法

    公开(公告)号：US20070177124A1

    公开(公告)日：2007-08-02

    申请号：US11307230

    申请日：2006-01-27

    申请人： Dmitriy Shneyder ,  Raschid Bezama ,  Dario Goldfarb ,  Kafai Lai

    发明人： Dmitriy Shneyder ,  Raschid Bezama ,  Dario Goldfarb ,  Kafai Lai

    IPC分类号： G03B27/62

    CPC分类号： G03D3/02 ,  G03F7/70341 ,  G03F7/70716 ,  G03F7/70916 ,  H01L21/68735

    摘要： An apparatus for reducing contamination in immersion lithography includes a wafer chuck assembly having a wafer chuck configured to hold a semiconductor wafer on a support surface thereof. The wafer chuck has a gap therein, the gap located adjacent an outer edge of the wafer, and the gap containing a volume of immersion lithography fluid therein. A fluid circulation path is configured within the wafer chuck so as to facilitate the radial outward movement of the immersion lithography fluid in the gap, thereby maintaining a meniscus of the immersion lithography fluid at a selected height with respect to a top surface of the semiconductor wafer.

    摘要翻译： 一种用于减少浸没式光刻中的污染的装置包括晶片卡盘组件，其具有构造成将半导体晶片保持在其支撑表面上的晶片卡盘。 晶片卡盘在其中具有间隙，间隙位于晶片的外边缘附近，并且该间隙包含一定量的浸没光刻流体。 流体循环路径被配置在晶片卡盘内，以便于浸没式光刻流体在间隙中的径向向外移动，从而将浸没式光刻流体的弯月面相对于半导体晶片的顶表面保持在选定的高度 。