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1.发明授权公开(公告)号：US06491730B1
公开(公告)日：2002-12-10
申请号：US09621314
申请日：2000-07-20
IPC分类号： D06L108
摘要： A method for dry-cleaning articles such as fabrics and clothing in carbon dioxide. The article includes a stained portion or region, which is pretreated with a pretreatment composition prior to initiating the cleaning cycle. The pretreatment step is followed by contacting the pretreated article to be cleaned with a liquid dry cleaning composition for a time sufficient to clean the article. The liquid dry-cleaning composition comprises a mixture of carbon dioxide, a surfactant, and an organic co-solvent. After the contacting step, the article is separated from the liquid dry cleaning composition. The pretreatment composition, in a preferred embodiment, comprises at least one of (a) a surfactant; (b) d-limonene, and (c) a C12-C15 alkane co-solvent. Preferably the pretreatment composition comprises at least two, and in some particularly preferred embodiments, the pretreatment composition comprises all three, of the aforesaid ingredients.
摘要翻译： 用于在二氧化碳中干燥诸如织物和衣服的物品的方法。 该制品包括染色部分或区域，其在开始清洁循环之前用预处理组合物预处理。 预处理步骤之后，将待处理的待处理制品与液体干洗组合物接触足够时间以清洁制品。 液体干洗组合物包含二氧化碳，表面活性剂和有机共溶剂的混合物。 在接触步骤之后，将物品与液体干洗组合物分离。 在优选实施方案中，预处理组合物包含以下中的至少一种：（a）表面活性剂; （b）d-柠檬烯，和（c）C12-C15烷烃共溶剂。 优选地，预处理组合物包含至少两种，在一些特别优选的实施方案中，预处理组合物包含所有三种上述成分。
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2.发明授权Solid particulate propellant systems and aerosol containers employing the same 有权固体颗粒推进剂系统和使用其的气溶胶容器公开(公告)号：US06218353B1
公开(公告)日：2001-04-17
申请号：US09211674
申请日：1998-12-14
IPC分类号： D06L100
摘要： A liquid composition useful for suspending and dispensing a solid particulate comprises carbon dioxide, a surfactant, an organic co-solvent, and the solid particulate to be suspended. The composition may optionally contain water. The composition is useful as a propellant in an aerosol container for spraying the solid particulate from the container.
摘要翻译： 用于悬浮和分散固体颗粒的液体组合物包括二氧化碳，表面活性剂，有机共溶剂和要悬浮的固体颗粒。 组合物可任选地含有水。 该组合物可用作用于从容器喷射固体颗粒的气溶胶容器中的推进剂。
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公开(公告)号：US06989172B2
公开(公告)日：2006-01-24
申请号：US10681515
申请日：2003-10-08
申请人： James P. DeYoung , James B. McClain , Stephen M. Gross , Doug Taylor , Mark I. Wagner , David Brainard
发明人： James P. DeYoung , James B. McClain , Stephen M. Gross , Doug Taylor , Mark I. Wagner , David Brainard
CPC分类号： H01L21/283 , B05D1/18 , B05D2401/90 , H01L21/28556 , H01L21/288 , H01L21/67028 , H01L28/65
摘要： A method of coating a substrate comprises the steps of: (a) providing a substrate in an enclosed vessel, the substrate having a surface portion; (b) at least partially filling the enclosed vessel with a first supercritical fluid so that said first supercritical fluid contacts the surface portion, with the first supercritical fluid carrying or containing a coating component; then (c) adding a separate compressed gas atmosphere to the reaction vessel so that a boundary is formed between the first supercritical fluid and the separate compressed gas atmosphere, said separate compressed gas atmosphere having a density less than said first supercritical fluid; and then (d) displacing said first supercritical fluid from said vessel by continuing adding said separate compressed gas atmosphere to said vessel so that said boundary moves across said surface portion and a thin film of coating component is deposited on said microelectronic substrate.
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公开(公告)号：US06602351B2
公开(公告)日：2003-08-05
申请号：US09951247
申请日：2001-09-13
IPC分类号： B08B300
CPC分类号： B08B7/0021 , C23G5/00 , H01L21/02063 , Y10S134/902
摘要： A method of cleaning and removing water and entrained solutes during a manufacturing process from a microelectronic device such as a resist-coated semiconductor substrate, a MEM's device, or an optoelectronic device comprising the steps of: (a) providing a partially fabricated integrated circuit, MEM's device, or optoelectronic device having water, entrained solutes, and/or solid particles or the like on the substrate; (b) providing a densified (e.g., liquid or supercritical) carbon dioxide cleaning composition, the drying composition comprising carbon dioxide and, optionally but preferably, a cleaning adjunct; (c) immersing the surface portion in the densified carbon dioxide cleaning composition; and then (d) removing the cleaning composition from the surface portion.
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公开(公告)号：US06344243B1
公开(公告)日：2002-02-05
申请号：US09921376
申请日：2001-08-02
IPC分类号： B05D100
CPC分类号： B05D1/18 , B05D2401/90 , C23C26/00 , C23C30/00 , D06M15/277 , D06M15/643 , D06M23/10 , D06M23/105 , D06M2101/06 , D06M2101/08 , D06M2101/12 , D06M2101/32 , D06M2101/34 , D06M2200/12
摘要： A method of treating a substrate comprises contacting a surface of said substrate, with a pressurized fluid comprising carbon dioxide and a surface treatment component, the surface treatment component being entrained in the pressurized fluid and contacting the surface so that the surface treatment component lowers the surface tension of the surface of the substrate and treats the substrate. The contacting step is preferably carried out by immersion, the fluid is preferably a liquid or supercritical fluid, the substrate is preferably a metal or fabric substrate, and the surface treatment component is preferably a fluoroacrylate polymer.
摘要翻译： 处理基材的方法包括使所述基材的表面与包含二氧化碳和表面处理组分的加压流体接触，所述表面处理组分被夹带在加压流体中并与表面接触，使得表面处理组分降低表面 衬底表面的张力并处理衬底。 接触步骤优选通过浸渍进行，流体优选为液体或超临界流体，基底优选为金属或织物基底，并且表面处理组分优选为氟代丙烯酸酯聚合物。
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公开(公告)号：US07141496B2
公开(公告)日：2006-11-28
申请号：US10762905
申请日：2004-01-22
申请人： James P. DeYoung , James B. McClain , Stephen M. Gross , Doug Taylor , Mark I. Wagner , David Brainard
发明人： James P. DeYoung , James B. McClain , Stephen M. Gross , Doug Taylor , Mark I. Wagner , David Brainard
IPC分类号： H01L21/44
CPC分类号： H01L21/32051 , H01L21/283 , H01L21/288 , H01L21/76814 , H01L21/76843 , H01L21/76871
摘要： A method of treating a dielectric surface portion of a semiconductor substrate, comprising the steps of: (a) providing a semiconductor substrate having a dielectric surface portion; and then (b) treating said dielectric surface portion with a coating reagent, the coating reagent comprising a reactive group coupled to a coordinating group, with the coordinating group having a metal bound thereto, so that the metal is deposited on the dielectric surface portion to produce a surface portion treated with a metal.
摘要翻译： 一种处理半导体衬底的电介质表面部分的方法，包括以下步骤：（a）提供具有电介质表面部分的半导体衬底; 然后（b）用涂层试剂处理所述电介质表面部分，所述涂覆试剂包含与配位基团偶联的反应基团，所述配位基团与其结合金属，使得金属沉积在电介质表面部分上 产生用金属处理的表面部分。
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7.发明授权Methods for transferring supercritical fluids in microelectronic and other industrial processes 失效在微电子和其他工业过程中转移超临界流体的方法公开(公告)号：US06905555B2
公开(公告)日：2005-06-14
申请号：US10448474
申请日：2003-05-30
CPC分类号： B08B7/0021 , B05D1/18 , B05D2401/90 , H01L21/02063 , H01L21/02101 , H01L21/67017 , H01L21/67028 , Y10T137/0324
摘要： A method of displacing a supercritical fluid from a pressure vessel (e.g., in a microelectronic manufacturing process), with the steps of: providing an enclosed pressure vessel containing a first supercritical fluid (said supercritical fluid preferably comprising carbon dioxide); adding a second fluid (typically also a supercritical fluid) to said vessel, with said second fluid being added at a pressure greater than the pressure of the first supercritical fluid, and with said second fluid having a density less than that of the first supercritical fluid; forming an interface between the first supercritical fluid and the second fluid; and displacing at least a portion of the first supercritical fluid from the vessel with the pressure of the second, preferably fluid while maintaining the interface therebetween.
摘要翻译： 一种从压力容器（例如，在微电子制造过程中）置换超临界流体的方法，其步骤包括：提供包含第一超临界流体（所述超临界流体优选包含二氧化碳）的封闭压力容器; 向所述容器中加入第二流体（通常也是超临界流体），其中所述第二流体以大于第一超临界流体的压力的压力加入，并且所述第二流体的密度小于第一超临界流体的密度 ; 在所述第一超临界流体和所述第二流体之间形成界面; 并且使第二超临界流体的至少一部分与第二流体（优选流体）的压力从容器移位，同时保持其间的界面。
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公开(公告)号：US06711773B2
公开(公告)日：2004-03-30
申请号：US10234766
申请日：2002-09-04
IPC分类号： D06B2320
CPC分类号： D06F43/005 , B08B7/0021 , D06F43/007 , D06F43/08
摘要： A system for the controlled addition of detergent formulations and the like to a carbon dioxide cleaning apparatus comprises: (a) a high pressure wash vessel; (b) an auxiliary vessel; (c) a drain line connecting the auxiliary vessel to the wash vessel; (d) optionally but preferably, a separate vent line connecting the auxiliary vessel to the wash vessel; (e) a detergent reservoir; and (f) a detergent supply line connecting the detergent reservoir to the auxiliary vessel. An advantage of this apparatus is that, because the detergent formulation can be pumped into the auxiliary vessel in a predetermined aliquot or amount, which predetermined aliquot or amount can then be transferred into the wash vessel where it combines with the liquid carbon dioxide cleaning solution, the detergent formulation can be added to the cleaning solution in a more controlled or accurate manner. An alternate embodiment adapted for the addition of aqueous detergent formulations and the like to a carbon dioxide dry cleaning system under turbulent conditions comprises: (a) a high pressure wash vessel; (b) a filter; (c) a carbon dioxide cleaning solution drain line interconnecting the wash vessel to the filter; (d) a carbon dioxide cleaning solution supply line connecting the filter to the wash vessel; (e) a first high pressure pump (i.e., a pump that is capable of pumping liquid solutions comprising liquid carbon dioxide) operably connected to the drain line; (f) a detergent formulation reservoir; (g) a detergent formulation supply line connecting the reservoir to the carbon dioxide cleaning solution supply line; and (h) a second high pressure pump operably connected to the detergent formulation supply line for transferring detergent formulation from the detergent formulation reservoir into the carbon dioxide cleaning solution under turbulent conditions.
摘要翻译： 用于将二氧化碳清洗装置中洗涤剂配方等控制加入的系统包括：（a）高压洗涤容器; （b）辅助船只; （c）将辅助容器连接到洗涤容器的排水管线; （d）可选地，但优选地，将辅助容器连接到洗涤容器的单独排放管线; （e）洗涤剂储存器; 和（f）将洗涤剂储存器连接到辅助容器的洗涤剂供应管线。 该设备的优点在于，由于洗涤剂配方可以以预定的等分试样或数量泵送到辅助容器中，该预定的等分试样或数量可随后被转移到与液体二氧化碳清洗溶液结合的洗涤容器中， 洗涤剂配方可以以更受控制或更准确的方式添加到清洁溶液中。 适于在湍流条件下将含水洗涤剂配方等添加到二氧化碳干洗系统的替代实施方案包括：（a）高压洗涤容器; （b）过滤器; （c）将洗涤容器与过滤器相互连接的二氧化碳清洗液排出管线; （d）将过滤器连接到洗涤容器的二氧化碳清洗溶液供应管线; （e）可操作地连接到排出管线的第一高压泵（即，能够泵送包含液体二氧化碳的液体溶液的泵）; （f）洗涤剂配制容器; （g）将储存器连接到二氧化碳清洗溶液供应管线的洗涤剂配制剂供应管线; 和（h）第二高压泵，其可操作地连接到洗涤剂配方供应管线，用于将洗涤剂配方从紊乱的条件下将洗涤剂配制剂从洗涤剂配制容器转移到二氧化碳清洗溶液中。
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公开(公告)号：US06613157B2
公开(公告)日：2003-09-02
申请号：US09951092
申请日：2001-09-13
IPC分类号： B08B300
CPC分类号： B08B7/0021 , C23G5/00 , H01L21/02063 , Y10S134/902 , Y10S438/906
摘要： A method of cleaning and removing solid particles during a manufacturing process from a microelectronic device such as a resist-coated semiconductor substrate, a MEM's device, or an optoelectronic device comprising the steps of: (a) providing a partially fabricated integrated circuit, MEM's device, or optoelectronic device having water and entrained solutes on the substrate; (b) providing a densified (e.g., liquid or supercritical) carbon dioxide cleaning composition, the cleaning composition comprising carbon dioxide and a cleaning adjunct, the cleaning adjunct selected from the group consisting of cosolvents, surfactants, and combinations thereof; (c) immersing the surface portion in the densified carbon dioxide cleaning composition to remove solid particles from the surface portion; and then (d) removing the cleaning composition from the surface portion. Process parameters are controlled so that the cleaning composition is maintained as a homogeneous composition during the immersing step, the removing step, or both the immersing and removing step, without substantial deposition of the drying/cleaning adjunct or solid particles on the substrate.
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公开(公告)号：US06270844B1
公开(公告)日：2001-08-07
申请号：US09740779
申请日：2000-12-19
IPC分类号： B05D100
摘要： A method of treating a substrate comprises contacting a surface of said substrate, with a pressurized fluid comprising carbon dioxide and a surface treatment component, the surface treatment component being entrained in the pressurized fluid and contacting the surface so that the surface treatment component lowers the surface tension of the surface of the substrate and treats the substrate. The contacting step is preferably carried out by immersion, the fluid is preferably a liquid or supercritical fluid, the substrate is preferably a metal or fabric substrate, and the surface treatment component is preferably a fluoroacrylate polymer.
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