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公开(公告)号：US20130176176A1
公开(公告)日：2013-07-11
申请号：US13346305
申请日：2012-01-09
申请人： David L. Vos , Carl Baldwin , David R. Darling , Brian Kaplun , David R. Dorough
发明人： David L. Vos , Carl Baldwin , David R. Darling , Brian Kaplun , David R. Dorough
CPC分类号： H01Q1/38 , B32B37/12 , B32B2457/00 , H01Q1/287 , H01Q21/28
摘要： Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.
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公开(公告)号：US08847823B2
公开(公告)日：2014-09-30
申请号：US13346305
申请日：2012-01-09
申请人： David L. Vos , Carl Baldwin , David R. Darling , Brian Kaplun , David R. Dorough
发明人： David L. Vos , Carl Baldwin , David R. Darling , Brian Kaplun , David R. Dorough
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , B32B37/12 , B32B2457/00 , H01Q1/287 , H01Q21/28
摘要： Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.
摘要翻译： 一些实施例涉及形成在柔性基板上的多频带天线阵列。 低频天线元件可以使用nanoink形成。 可以在预制天线芯片上提供高频元件。 天线阵列可以在低温烘箱中加热以将纳米金属烧结成固体天线元件。 在一些实施例中，可以提供允许天线阵列附接到任何表面的粘合绝缘层。 在其他实施例中，天线阵列可以嵌入复合材料中。
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公开(公告)号：US08730673B2
公开(公告)日：2014-05-20
申请号：US13354531
申请日：2012-01-20
申请人： David L. Vos
发明人： David L. Vos
CPC分类号： H05K7/20 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K1/0272 , H05K3/0061 , H05K2201/064 , H05K2201/10378 , H01L2924/00
摘要： A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.
摘要翻译： 能够可交换地安装在外部机架中的独立的流体冷却的电光插头型模块包括安装在一个或多个内插器上的电子或电光器件，其提供电力和与设备的电和光信号连接， 还设置有流体管道，冷却流体通过该流体管道在闭环冷却路径中循环到热交换器，用于将装置中产生的热量转移到安装底盘中的外部热处理设备。
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公开(公告)号：US6151216A
公开(公告)日：2000-11-21
申请号：US396068
申请日：1999-09-15
CPC分类号： G11B33/1406 , F16F7/14 , G11B33/08 , F16F2222/02
摘要： A method and construction for providing thermal management and vibration isolation to a component that requires a controlled temperature during operation. The component (e.g., a hard disk drive) is mounted within an enclosure such that the component is substantially isolated from mechanical vibrations, and the isolation mechanism further provides a thermal path from the component to the enclosure. An elastomeric article which supports the component may be attached to the interior of the enclosure, the elastomeric article being loaded with thermally conductive fillers (fibers or non-directional particulates molded within the elastomer material). Alternatively, a wire rope which supports the component may be attached to the interior of the enclosure, the wire rope having at least one support strand and at least one heat transfer strand that has a higher thermal conductivity than the support strand.
摘要翻译： 一种为操作期间需要受控温度的部件提供热管理和隔振的方法和结构。 组件（例如，硬盘驱动器）安装在外壳内，使得该组件基本上与机械振动隔离，并且隔离机构进一步提供从组件到外壳的热路径。 支撑部件的弹性制品可以附接到外壳的内部，弹性体制品装载有导热填料（在弹性体材料内模制的纤维或非定向微粒）。 或者，支撑部件的钢丝绳可以附接到外壳的内部，钢丝绳具有至少一个支撑股和至少一个具有比支撑股更高的热导率的传热股。
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公开(公告)号：US07719108B2
公开(公告)日：2010-05-18
申请号：US11032526
申请日：2005-01-10
IPC分类号： H01L27/00
CPC分类号： H05K1/0209 , B23K1/0016 , B23K2101/40 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/341 , H05K2201/09781 , H05K2201/10689 , H05K2201/10734 , H05K2201/10969 , Y02P70/613 , H01L2224/0401
摘要： A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
摘要翻译： 公开了一种用印刷线路板封装半导体部件的方法。 该方法包括确定第一距离，将薄膜施加到半导体部件的表面上，使得薄膜与半导体的支撑体间隔开，将焊盘焊接到印刷线路板上，将半导体部件放置在 将薄膜贴到印刷电路板上，并将薄膜定位在焊盘附近。
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公开(公告)号：US20120300402A1
公开(公告)日：2012-11-29
申请号：US13354531
申请日：2012-01-20
申请人： David L. Vos
发明人： David L. Vos
CPC分类号： H05K7/20 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K1/0272 , H05K3/0061 , H05K2201/064 , H05K2201/10378 , H01L2924/00
摘要： A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.
摘要翻译： 能够可交换地安装在外部机架中的独立的流体冷却的电光插头型模块包括安装在一个或多个内插器上的电子或电光器件，其提供电力和与设备的电和光信号连接， 还设置有流体管道，冷却流体通过该流体管道在闭环冷却路径中循环到热交换器，用于将装置中产生的热量转移到安装底盘中的外部热处理设备。
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公开(公告)号：US07995344B2
公开(公告)日：2011-08-09
申请号：US11621170
申请日：2007-01-09
IPC分类号： H05K7/20
CPC分类号： H05K7/20445 , H01L23/3672 , H01L23/373 , H01L23/433 , H05K7/20454
摘要： A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.
摘要翻译： 一种用于电子部件的散热装置提供散热器和可变形的凸形箔结构，该结构固定在箔结构周围的散热片上，并且适于远离散热片延伸，从而能够使凸箔结构变形 与与箔结构相对安装的电子部件的顶表面接触。
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公开(公告)号：US07670877B2
公开(公告)日：2010-03-02
申请号：US11873146
申请日：2007-10-16
IPC分类号： H01L21/00
CPC分类号： H05K1/0209 , B23K1/0016 , B23K2101/40 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/341 , H05K2201/09781 , H05K2201/10689 , H05K2201/10734 , H05K2201/10969 , Y02P70/613 , H01L2224/0401
摘要： A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
摘要翻译： 公开了一种用印刷线路板封装半导体部件的方法。 该方法包括确定第一距离，将薄膜施加到半导体部件的表面上，使得薄膜与半导体的支撑体间隔开，将焊盘焊接到印刷线路板上，将半导体部件放置在 将薄膜贴到印刷电路板上，并将薄膜定位在焊盘附近。
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公开(公告)号：US06330152B1
公开(公告)日：2001-12-11
申请号：US09590209
申请日：2000-06-08
IPC分类号： H05K720
CPC分类号： H05K7/206 , B60K2001/003
摘要： An apparatus is provided for permitting commercial-off-the-shelf (COTS) electronics to be utilized in harsh environments for which the COTS electronics are not designed, including environments having ambient temperature variations, ambient pressure variations, shock and vibration exposure, environmental contaminants and/or electromagnetic radiation which may be beyond the design specification of the COTS components. The device includes a sealed enclosure having racks or other suitable mounts for the COTS components and having an environmental controlled unit (ECU) which circulates a fluid such as air through the enclosure and through the mounts. The temperature in the enclosure is monitored and the ECU operated to heat or cool fluid passing therethrough to maintain temperature in the enclosure within the design limits of the COTS electronics. A flow channel for ambient fluid, which channel is sealed from the internally circulating fluid, may be provided for removing heat from a cooling unit of the ECU. The enclosure may also have shock mounts, thermal insulation and appropriate shielding to deal with other environmental concerns.
摘要翻译： 提供了一种用于允许在COTS电子设备未设计的恶劣环境中使用商业现货（COTS）电子设备的设备，包括具有环境温度变化，环境压力变化，冲击和振动暴露的环境，环境污染物 和/或可能超出COTS组件的设计规范的电磁辐射。 该装置包括具有用于COTS部件的齿条或其它合适的安装件的密封外壳，并且具有环流控制单元（ECU），其使诸如空气的流体通过外壳和安装件循环。 监控外壳中的温度，并且ECU操作以加热或冷却通过其中的流体，以将外壳中的温度保持在COTS电子设备的设计限度内。 可以设置用于从内部循环流体密封该通道的环境流体的流动通道，用于从ECU的冷却单元移除热量。 外壳还可以具有防震支架，隔热和适当的屏蔽以应对其他环境问题。
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公开(公告)号：US6002588A
公开(公告)日：1999-12-14
申请号：US984813
申请日：1997-12-04
CPC分类号： G11B33/1406 , F16F7/14 , G11B33/08 , F16F2222/02
摘要： A method and construction for providing thermal management and vibration isolation to a component that requires a controlled temperature during operation. The component (e.g., a hard disk drive) is mounted within an enclosure such that the component is substantially isolated from mechanical vibrations, and the isolation mechanism further provides a thermal path from the component to the enclosure. An elastomeric article which supports the component may be attached to the interior of the enclosure, the elastomeric article being loaded with thermally conductive fillers (fibers or non-directional particulates molded within the elastomer material). Alternatively, a wire rope which supports the component may be attached to the interior of the enclosure, the wire rope having at least one support strand and at least one heat transfer strand that has a higher thermal conductivity than the support strand.
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