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    Placement head for a die placing assembly
    1.
    发明授权
    Placement head for a die placing assembly 有权
    放置头用于模具放置组件

    公开(公告)号：US08701276B2

    公开(公告)日：2014-04-22

    申请号：US12193751

    申请日：2008-08-19

    申请人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    发明人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    IPC分类号： B23P19/00

    CPC分类号： H01L21/67144 ,  H01L21/67248 ,  H01L21/67276 ,  H01L21/681

    摘要： The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage. The placement head further includes a third translation stage mounted on the second stage, the third stage displaceable orthogonally to the first and second stages, as well as a die placer head mounted to the third stage, the placer head shaped and dimensioned to operatively receive a die from the dice conveyance mechanism and to place the dice onto the carrier.

    摘要翻译： 本发明提供一种用于组装骰子的模具放置组件的放置头，用于将骰子装配在载体上。 汇编器具有外壳，其具有用于在其上操作地支撑晶片的支撑组件，用于从所述晶片拾取骰子的模具拾取组件，用于将模具放置在载体上的管芯放置组件，将模具从 模具拾取和放置组件，以及控制组装器的控制系统。 放置头包括安装在管芯放置组件上的第一平移台，所述第一台可相对于管芯放置组件沿第一轴线可操作地移位。 放置头还包括安装在第一平台上的第二平移台，第二平台可垂直于第一平台移动。 放置头还包括安装在第二台上的第三平移台，与第一和第二平台正交可移位的第三台，以及安装到第三阶段的模具沉头，其形状和尺寸设计成可操作地接收 从骰子传送机构死亡并将骰子放置在载体上。

    CLAMP ASSEMBLY FOR AN ASSEMBLER FOR ASSEMBLING PRINTHEAD INTEGRATED CIRCUITRY ON A CARRIER
    2.
    发明申请
    CLAMP ASSEMBLY FOR AN ASSEMBLER FOR ASSEMBLING PRINTHEAD INTEGRATED CIRCUITRY ON A CARRIER 有权
    用于装配集成电路的集成电路用于集成电路的集成电路

    公开(公告)号：US20100043215A1

    公开(公告)日：2010-02-25

    申请号：US12193753

    申请日：2008-08-19

    申请人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    发明人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    IPC分类号： B23P19/00

    CPC分类号： B41J2/1623 ,  B41J2/16 ,  B41J2002/14362 ,  B41J2202/19 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261

    摘要： The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.

    摘要翻译： 本发明提供了一种用于装配器的夹具组件，用于将打印头集成电路组装在载体上。 汇编器具有外壳，其具有用于在其上操作地支撑晶片的支撑组件，用于从所述晶片拾取骰子的模具拾取组件，用于将模具放置在载体上的管芯放置组件，将模具从 模具拾取和放置组件，以及控制组装器的控制系统。 夹具组件包括细长的夹紧体，其主体成形并被构造成由模具放置组件容纳，以及安装在主体顶部上的一对细长的保持板。 该夹具还包括成形和尺寸设计成被容纳在板下方的主体中的插入件，可操作地接收所述托架的插入件以及定位在主体中的隔膜，隔膜可气动地移位以将插入件可操作地推靠在保持板上。

    Integrated circuit placement system
    3.
    发明授权
    Integrated circuit placement system 有权
    集成电路放置系统

    公开(公告)号：US08092625B2

    公开(公告)日：2012-01-10

    申请号：US12193745

    申请日：2008-08-19

    申请人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell ,  Peter John Morley Sobey

    发明人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell ,  Peter John Morley Sobey

    IPC分类号： B32B41/00

    CPC分类号： H01L21/6838 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

    摘要翻译： 本发明涉及一种用于将骰子放置在载体上的骰子放置组件。 该组件包括具有夹持机构的支撑平台，该夹持机构构造成将载体夹紧到所述平台上，以及操作性地指向平台的至少一个相机，以检测载体上的对准基准。 组件还包括具有真空机构的放置装置，用于从供给机构中取出骰子，所述放置装置具有致动器，以将骰子与载体对准，并将骰子放置在其上一次对齐，以及加热器以在骰子之前加热骰子 放置在试验台上。 还包括控制器，可操作地控制夹紧机构，相机和放置装置，以便于将骰子准确地放置在载体上。

    INTEGRATED CIRCUIT PLACEMENT SYSTEM
    4.
    发明申请
    INTEGRATED CIRCUIT PLACEMENT SYSTEM 有权
    集成电路放置系统

    公开(公告)号：US20100047043A1

    公开(公告)日：2010-02-25

    申请号：US12193745

    申请日：2008-08-19

    申请人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell ,  Peter John Morley Sobey

    发明人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell ,  Peter John Morley Sobey

    IPC分类号： H01L21/67

    CPC分类号： H01L21/6838 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

    摘要翻译： 本发明涉及一种用于将骰子放置在载体上的骰子放置组件。 该组件包括具有夹持机构的支撑平台，该夹持机构构造成将载体夹紧到所述平台上，以及操作性地指向平台的至少一个相机，以检测载体上的对准基准。 组件还包括具有真空机构的放置装置，用于从供给机构中取出骰子，所述放置装置具有致动器，以将骰子与载体对准，并将骰子放置在其上一次对齐，以及加热器以在骰子之前加热骰子 放置在试验台上。 还包括控制器，可操作地控制夹紧机构，相机和放置装置，以便于将骰子准确地放置在载体上。

    PLACEMENT HEAD FOR A DIE PLACING ASSEMBLY
    6.
    发明申请
    PLACEMENT HEAD FOR A DIE PLACING ASSEMBLY 有权
    放置头用于放置组件

    公开(公告)号：US20100047044A1

    公开(公告)日：2010-02-25

    申请号：US12193751

    申请日：2008-08-19

    申请人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    发明人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    IPC分类号： H01L21/67

    CPC分类号： H01L21/67144 ,  H01L21/67248 ,  H01L21/67276 ,  H01L21/681

    摘要： The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage. The placement head further includes a third translation stage mounted on the second stage, the third stage displaceable orthogonally to the first and second stages, as well as a die placer head mounted to the third stage, the placer head shaped and dimensioned to operatively receive a die from the dice conveyance mechanism and to place the dice onto the carrier.

    摘要翻译： 本发明提供一种用于组装骰子的模具放置组件的放置头，用于将骰子装配在载体上。 汇编器具有外壳，其具有用于在其上操作地支撑晶片的支撑组件，用于从所述晶片拾取骰子的模具拾取组件，用于将模具放置在载体上的管芯放置组件，将模具从 模具拾取和放置组件，以及控制组装器的控制系统。 放置头包括安装在管芯放置组件上的第一平移台，所述第一台可相对于管芯放置组件沿第一轴线可操作地移位。 放置头还包括安装在第一平台上的第二平移台，第二平台可垂直于第一平台移动。 放置头还包括安装在第二台上的第三平移台，与第一和第二平台正交可移位的第三台，以及安装到第三阶段的模具沉头，其形状和尺寸设计成可操作地接收 从骰子传送机构死亡并将骰子放置在载体上。

    Clamp assembly for an assembler of integrated circuitry on a carrier
    8.
    发明授权
    Clamp assembly for an assembler of integrated circuitry on a carrier 有权
    用于载体上集成电路的汇编器的夹具组件

    公开(公告)号：US07979979B2

    公开(公告)日：2011-07-19

    申请号：US12193753

    申请日：2008-08-19

    申请人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    发明人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    IPC分类号： B23P19/00

    CPC分类号： B41J2/1623 ,  B41J2/16 ,  B41J2002/14362 ,  B41J2202/19 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261

    摘要： The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.

    摘要翻译： 本发明提供了一种用于装配器的夹具组件，用于将打印头集成电路组装在载体上。 汇编器具有外壳，其具有用于在其上操作地支撑晶片的支撑组件，用于从所述晶片拾取骰子的模具拾取组件，用于将模具放置在载体上的管芯放置组件，将模具从 模具拾取和放置组件，以及控制组装器的控制系统。 夹具组件包括细长的夹紧体，其主体成形并被构造成由模具放置组件容纳，以及安装在主体顶部上的一对细长的保持板。 该夹具还包括成形和尺寸设计成被容纳在板下方的主体中的插入件，可操作地接收所述托架的插入件以及定位在主体中的隔膜，隔膜可气动地移位以将插入件可操作地推靠在保持板上。