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公开(公告)号：US6074888A
公开(公告)日：2000-06-13
申请号：US135696
申请日：1998-08-18
IPC分类号： B81B1/00 , B81C1/00 , G02B3/00 , G02B5/00 , G02B6/12 , G02B6/122 , G02B6/42 , G03F7/40 , H01L31/18 , H01L33/00 , H01L21/00
CPC分类号： H01L31/18 , G02B6/122 , G02B6/42 , H01L33/005 , G02B2006/12102 , G02B2006/12114 , G02B2006/12176 , G02B6/4246
摘要： A method for fabricating a monolithic micro-optical component. The construction of the micro-optical components is accomplished by using standard semiconductor fabrication techniques. The method comprises the steps of depositing an etch stop layer (44) onto a semiconductor substrate (42); depositing an optical component layer (46) onto the etch stop layer (44); coating the entire surface of the optical component layer with a photoresist material; applying a photoresist mask (50) to the photoresist material on the optical component layer (46); selectively etching away the optical component layer (46) to form at least one optical column (52); forming a pedestal (54) for each of the optical columns (52) by selectively etching away the etch stop layer (44); and finally polishing each of the optical columns (52), thereby forming monolithic optical components (56). The method may optionally include the step of removing the photoresist mask from each of the optical columns prior to polishing the optical columns, as well as the step of depositing an antireflectivity coating onto each of the optical components.
摘要翻译： 一种用于制造单片微光学部件的方法。 微型光学部件的构造通过使用标准半导体制造技术来实现。 该方法包括以下步骤：在半导体衬底（42）上沉积蚀刻停止层（44）; 在所述蚀刻停止层（44）上沉积光学部件层（46）; 用光致抗蚀剂材料涂覆光学部件层的整个表面; 将光致抗蚀剂掩模（50）施加到光学部件层（46）上的光致抗蚀剂材料上; 选择性地蚀刻掉光学部件层（46）以形成至少一个光学柱（52）; 通过选择性地蚀刻掉蚀刻停止层（44），为每个光学柱（52）形成基座（54）; 并最后对每个光学柱（52）进行抛光，由此形成单片光学部件（56）。 该方法可以可选地包括在抛光光学柱之前从每个光学柱去除光致抗蚀剂掩模的步骤，以及在每个光学部件上沉积抗反射涂层的步骤。
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公开(公告)号：US06252725B1
公开(公告)日：2001-06-26
申请号：US09498634
申请日：2000-02-07
IPC分类号： G02B702
CPC分类号： H01L31/18 , G02B6/122 , G02B6/42 , G02B6/4246 , G02B2006/12102 , G02B2006/12114 , G02B2006/12176 , H01L33/005
摘要： A method for fabricating a monolithic micro-optical component. The construction of the micro-optical components is accomplished by using standard semiconductor fabrication techniques. The method comprises the steps of depositing an etch stop layer (44) onto a semiconductor substrate (42); depositing an optical component layer (46) onto the etch stop layer (44); coating the entire surface of the optical component layer with a photoresist material; applying a photoresist mask (50) to the photoresist material on the optical component layer (46); selectively etching away the optical component layer (46) to form at least one optical column (52); forming a pedestal (54) for each of the optical columns (52) by selectively etching away the etch stop layer (44); and finally polishing each of the optical columns (52), thereby forming monolithic optical components (56). The method may optionally include the step of removing the photoresist mask from each of the optical columns prior to polishing the optical columns, as well as the step of depositing an antireflectivity coating onto each of the optical components.
摘要翻译： 一种用于制造单片微光学部件的方法。 微型光学部件的构造通过使用标准半导体制造技术来实现。 该方法包括以下步骤：在半导体衬底（42）上沉积蚀刻停止层（44）; 在所述蚀刻停止层（44）上沉积光学部件层（46）; 用光致抗蚀剂材料涂覆光学部件层的整个表面; 将光致抗蚀剂掩模（50）施加到光学部件层（46）上的光致抗蚀剂材料上; 选择性地蚀刻掉光学部件层（46）以形成至少一个光学柱（52）; 通过选择性地蚀刻掉蚀刻停止层（44），为每个光学柱（52）形成基座（54）; 并最后对每个光学柱（52）进行抛光，由此形成单片光学部件（56）。 该方法可以可选地包括在抛光光学柱之前从每个光学柱去除光致抗蚀剂掩模的步骤，以及在每个光学部件上沉积抗反射涂层的步骤。
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公开(公告)号：US5853960A
公开(公告)日：1998-12-29
申请号：US40636
申请日：1998-03-18
IPC分类号： H01L33/00 , G02B1/11 , G02B3/00 , H01L27/146 , H01L31/0232 , H01L27/14 , H01L31/0304
CPC分类号： G02B3/04 , G02B3/0012 , G02B3/005 , G02B3/0056 , H01L31/0232 , H01L27/14643
摘要： The invention relates to a method for fabricating III-V semiconductor micro-optical lenses for hybrid integration with micro-optical devices, where a micro-optical lens is formed from a semiconductor wafer by selectively etching a surface of the semiconductor wafer and a lens arm is formed from the semiconductor wafer on a surface opposite the surface by selectively etching the surface of the semiconductor wafer. The lens and lens arm are then cleaved from the substrate wafer and directly mounted to a micro-optical device. As a result of using III-V semiconductor material to form micro-optical lenses for hybrid integration to micro-optical devices of the same semiconductor material, thermal expansion stability is increased and efficient transfer of light between micro-optical lenses and micro-optical devices is achieved.
摘要翻译： 本发明涉及一种用于制造与微型光学器件混合集成的III-V半导体微光学透镜的方法，其中通过选择性地蚀刻半导体晶片的表面和半导体晶片的表面从半导体晶片形成微光学透镜， 通过选择性地蚀刻半导体晶片的表面，在与表面相对的表面上由半导体晶片形成。 然后将透镜和透镜臂从基底晶片切割并直接安装到微光学装置。 作为使用III-V族半导体材料形成用于与同一半导体材料的微型光学器件进行混合集成的微光学透镜的结果，热膨胀稳定性增加，并且在微光学透镜和微光学器件之间有效传输光 已完成。
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公开(公告)号：US6150192A
公开(公告)日：2000-11-21
申请号：US114633
申请日：1998-07-13
IPC分类号： H01L21/60 , H01L21/603 , H01L33/00 , H01L21/44
CPC分类号： H01L24/75 , H01L2224/75 , H01L2224/81141 , H01L2224/81193 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , Y10T29/49144 , Y10T29/49544
摘要： An interconnected apparatus for producing a low loss, reproducible electrical interconnection between a semiconductor device and a substrate includes a rod and rod receptor. The rod, generally cylindrically shaped, is attached to the semiconductor device and includes an outer circumferential wall which comes into contact with the rod receptor during a bonding process. A lip portion is formed on one end of the rod receptor for interlocking engagement with the rod. The rod receptor is plated on the substrate and includes a generally circularly shaped body which forms a centrally disposed well for receiving the rod. A lip portion is formed on one end or mouth of the rod receptor for interlocking engagement with the rod. When the rod and corresponding receptor are aligned and brought together, the rod deforms and interlocks with its corresponding rod receptor. A thermo-compression bonding process is utilized to bond the rod to the rod receptor, thereby producing a strong interlocking bond.
摘要翻译： 用于在半导体器件和衬底之间产生低损耗，可再现的电互连的互连设备包括棒和棒接收器。 通常为圆柱形的杆附接到半导体器件，并且包括在接合过程中与杆接收器接触的外周壁。 唇形部分形成在杆接收器的一端上以与杆互锁接合。 杆接收器被电镀在基底上，并且包括大致圆形的主体，其形成用于容纳杆的居中设置的孔。 唇形部分形成在杆接收器的一端或口上，用于与棒互锁接合。 当杆和相应的接收器对准并聚集在一起时，杆变形并与其相应的杆接收器互锁。 利用热压接合方法将棒粘合到杆接收器，从而产生强的互锁键。
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公开(公告)号：US6115521A
公开(公告)日：2000-09-05
申请号：US74187
申请日：1998-05-07
CPC分类号： G02B6/4214 , G02B2006/12102 , G02B2006/12104 , G02B6/4206 , G02B6/423 , G02B6/4236
摘要： The invention relates to an optical integrated alignment device for accurately aligning optical fiber and waveguides to efficiently couple energy between optical devices. This is accomplished by using the anisotropic etch characteristics of III-V semiconductor materials. One orthogonal etch direction serves to provide a channel for precise fiber-positioning; the other direction, which is also orthogonal provides a reflecting surface for directing the optical energy between optical devices; and finally, a non-selective etch to form a micro-optical lens to focus optical energy to an optical device.
摘要翻译： 本发明涉及一种用于精确对准光纤和波导以在光学器件之间有效耦合能量的光学集成对准装置。 这是通过使用III-V半导体材料的各向异性蚀刻特性来实现的。 一个正交蚀刻方向用于提供用于精确光纤定位的通道; 正交的另一方向提供了用于在光学装置之间引导光能的反射表面; 最后，进行非选择性蚀刻以形成将光能聚焦到光学器件的微光学透镜。
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公开(公告)号：US06187515B1
公开(公告)日：2001-02-13
申请号：US09074188
申请日：1998-05-07
IPC分类号： G02B636
CPC分类号： G02B6/4214 , G02B6/423
摘要： The invention relates to an optical integrated circuit microbench system for accurately aligning optical fiber and waveguides to efficiently couple energy between optical devices. This is accomplished by using the anisotropic etch characteristics of III-V semiconductor materials in two orthogonal directions. One etch direction serves to provide a channel for precise fiber-positioning; the other direction, which is orthogonal provides a reflecting surface for directing the optical energy onto optical devices.
摘要翻译： 本发明涉及一种用于精确对准光纤和波导以在光学器件之间有效耦合能量的光学集成电路微型平台系统。 这是通过在两个正交方向上使用III-V半导体材料的各向异性蚀刻特性来实现的。 一个蚀刻方向用于提供用于精确光纤定位的通道; 正交的另一方向提供用于将光能引导到光学装置上的反射表面。
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公开(公告)号：US06172414B2
公开(公告)日：2001-01-09
申请号：US09067222
申请日：1998-04-28
IPC分类号： H01L2304
CPC分类号： H01L24/75 , H01L2224/75 , H01L2224/81141 , H01L2224/81193 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , Y10T29/49144 , Y10T29/49544
摘要： An interconnected apparatus for producing a low loss, reproducible electrical interconnection between a semiconductor device and a substrate includes a rod and rod receptor. The rod, generally cylindrically shaped, is attached to the semiconductor device and includes an outer circumferential wall which comes into contact with the rod receptor during a bonding process. A lip portion is formed on one end of the rod receptor for interlocking engagement with the rod. The rod receptor is plated on the substrate and includes a generally circularly shaped body which forms a centrally disposed well for receiving the rod. A lip portion is formed on one end or mouth of the rod receptor for interlocking engagement with the rod. When the rod and corresponding receptor are aligned and brought together, the rod deforms and interlocks with its corresponding rod receptor. A thermo-compression bonding process is utilized to bond the rod to the rod receptor, thereby producing a strong interlocking bond.
摘要翻译： 用于在半导体器件和衬底之间产生低损耗，可再现的电互连的互连设备包括棒和棒接收器。 通常为圆柱形的杆附接到半导体器件，并且包括在接合过程中与杆接收器接触的外周壁。 唇形部分形成在杆接收器的一端上以与杆互锁接合。 杆接收器被电镀在基底上，并且包括大致圆形的主体，其形成用于容纳杆的居中设置的孔。 唇形部分形成在杆接收器的一端或口上，用于与棒互锁接合。 当杆和相应的接收器对准并聚集在一起时，杆变形并与其相应的杆接收器互锁。 利用热压接合方法将棒粘合到杆接收器，从而产生强的互锁键。
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公开(公告)号：US5498973A
公开(公告)日：1996-03-12
申请号：US362682
申请日：1994-12-22
申请人： William A. Cavaliere , John S. Ferrario , Howard E. Ferris , Raymond C. Schuler , Ronald L. Strijek
发明人： William A. Cavaliere , John S. Ferrario , Howard E. Ferris , Raymond C. Schuler , Ronald L. Strijek
CPC分类号： G01R31/2635 , H01S5/4025 , H01S5/0014
摘要： An apparatus for testing individual ones of semiconductor laser devices of a laser bar during a manufacturing thereof comprises a laser bar chuck for securing the laser bar in a first manner and orientation. A probe is used for probing a laser device of the laser bar. A translational manipulator receives the laser bar chuck and the probe in a second and third manner and orientation, respectively, the manipulator further for translationally positioning the laser bar chuck and the probe independently in a fourth and fifth controlled manner. An energizing means energizes the probe in a sixth controlled manner. A detector detects a lasing of a probed laser device and provides a characteristic output signal representative of a testing characteristic of the probed laser device. Lastly, a controller controls the manipulator and the energizing means in a prescribed manner: (i) in preparation for a testing of a desired one of the laser devices of the laser bar; (ii) during a testing of a desired one of the laser devices of the laser bar; and (iii) upon a completion of the testing of the desired one of the laser devices.
摘要翻译： 一种用于在其制造期间测试激光棒的各个半导体激光器件的装置包括用于以第一方式和取向固定激光棒的激光棒卡盘。 探头用于探测激光棒的激光装置。 平移操纵器分别以第二和第三方式和方向接收激光棒卡盘和探针，操纵器还用于以第四和第五受控方式独立地平移地定位激光棒卡盘和探针。 激励装置以第六受控方式激励探头。 检测器检测探测的激光装置的激光，并提供表示探测的激光装置的测试特性的特征输出信号。 最后，控制器以规定的方式控制操纵器和激励装置：（i）准备对激光条的所需激光装置进行测试; （ii）在激光棒的所需激光器件的测试期间; 和（iii）完成所需的一个激光装置的测试。
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公开(公告)号：US06788724B2
公开(公告)日：2004-09-07
申请号：US09900423
申请日：2001-07-06
IPC分类号： H01S308
CPC分类号： H01S5/141 , H01S3/1062 , H01S5/02216 , H01S5/0222 , H01S5/02248 , H01S5/02284
摘要： An external cavity laser in a hermetically sealed container and methods for hermetically sealing the external cavity laser. The external cavity laser may be tunable by various mechanisms to allow transmission at multiple selectable wavelength channels.
摘要翻译： 密封容器中的外腔激光器和用于气密密封外腔激光器的方法。 外腔激光器可以通过各种机构来调节，以允许在多个可选择的波长通道上传输。
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