Bonding device and method for producing plate-shaped bonded assembly

    公开(公告)号:US10737477B2

    公开(公告)日:2020-08-11

    申请号:US15700785

    申请日:2017-09-11

    Abstract: A method for producing a bonded plate-shaped assembly includes retaining a pair of plate-shaped members facing each other by a pair of retaining base members; charging a photo-curable liquid material between the pair of plate-shaped members facing each other; causing movement of the pair of retaining base members by a retaining base member movement unit to cause the pair of plate-shaped members to draw close to each other to cause wetting spreading of the liquid material between the pair of plate-shaped members; detecting a wetting spreading state of the liquid material by a sensor; and illuminating curing light, in response to the result of detection, to the liquid material wettingly spread to the entire surfaces of the pair of plate-shaped members, to form the bonded plate-shaped assembly made up of the pair of plate-shaped members bonded together.

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