Method of producing crystalline semiconductor material and method of fabricating semiconductor device
    1.
    发明授权
    Method of producing crystalline semiconductor material and method of fabricating semiconductor device 失效
    制造结晶半导体材料的方法和制造半导体器件的方法

    公开(公告)号:US07538014B2

    公开(公告)日:2009-05-26

    申请号:US11553054

    申请日:2006-10-26

    IPC分类号: H01L21/00

    摘要: Disclosed are a method of producing a crystalline semiconductor material capable of improving the crystallinity and a method of fabricating a semiconductor device using the crystalline semiconductor material. An amorphous film is uniformly irradiated with a pulse laser beam (energy beam) emitted from an XeCl excimer laser by 150 times so as to heat the amorphous film at such a temperature as to partially melt crystal grains having the {100} orientations with respect to the vertical direction of a substrate and melt amorphous film or crystal grains having face orientations other than the {100} orientations. Silicon crystals having the {100} orientations newly occur between a silicon oxide film and liquid-phase silicon and are bonded to each other at random, to newly form crystal grains having the {100} orientations. Such a crystal grain creation step is repeated, to form a crystalline film which has crystal grains preferentially grown in the {100} orientations with respect to the vertical direction of the substrate and thereby has sharp square-shaped crystal grain boundaries.

    摘要翻译: 公开了一种制造能够提高结晶度的结晶半导体材料的方法和使用该晶体半导体材料制造半导体器件的方法。 使用从XeCl准分子激光器发射的脉冲激光束(能量束)将非晶膜均匀地照射150次,以便在这样的温度下加热非晶膜,以便部分地熔化具有{100}取向的晶粒相对于 衬底的垂直方向和具有除{100}取向以外的面取向的熔融非晶膜或晶粒。 在氧化硅膜和液相硅之间新发生具有{100}取向的硅晶体并且彼此无规地结合,以重新形成具有{100}取向的晶粒。 重复这样的晶粒生成工序,形成相对于衬底的垂直方向在{100}取向上优先生长的晶粒,从而具有尖锐的方形晶粒边界的结晶膜。

    Method of producing crystalline semiconductor material and method of fabricating semiconductor device
    3.
    发明授权
    Method of producing crystalline semiconductor material and method of fabricating semiconductor device 失效
    制造结晶半导体材料的方法和制造半导体器件的方法

    公开(公告)号:US07169690B2

    公开(公告)日:2007-01-30

    申请号:US11098846

    申请日:2005-04-05

    IPC分类号: H01L21/20

    摘要: Disclosed are a method of producing a crystalline semiconductor material capable of improving the crystallinity and a method of fabricating a semiconductor device using the crystalline semiconductor material. An amorphous film is uniformly irradiated with a pulse laser beam (energy beam) emitted from an XeCl excimer laser by 150 times so as to heat the amorphous film at such a temperature as to partially melt crystal grains having the {100} orientations with respect to the vertical direction of a substrate and melt amorphous film or crystal grains having face orientations other than the {100} orientations. Silicon crystals having the {100} orientations newly occur between a silicon oxide film and liquid-phase silicon and are bonded to each other at random, to newly form crystal grains having the {100} orientations. Such a crystal grain creation step is repeated, to form a crystalline film which has crystal grains preferentially grown in the {100} orientations with respect to the vertical direction of the substrate and thereby has sharp square-shaped crystal grain boundaries.

    摘要翻译: 公开了一种制造能够提高结晶度的结晶半导体材料的方法和使用该晶体半导体材料制造半导体器件的方法。 使用从XeCl准分子激光器发射的脉冲激光束(能量束)将非晶膜均匀地照射150次,以便在这样的温度下加热非晶膜,以便部分地熔化具有{100}取向的晶粒相对于 衬底的垂直方向和具有除{100}取向以外的面取向的熔融非晶膜或晶粒。 在氧化硅膜和液相硅之间新发生具有{100}取向的硅晶体并且彼此无规地结合,以重新形成具有{100}取向的晶粒。 重复这样的晶粒生成工序,形成相对于衬底的垂直方向在{100}取向上优先生长的晶粒,从而具有尖锐的方形晶粒边界的结晶膜。

    METHOD OF PRODUCING CRYSTALLINE SEMICONDUCTOR MATERIAL AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    4.
    发明申请
    METHOD OF PRODUCING CRYSTALLINE SEMICONDUCTOR MATERIAL AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE 失效
    生产晶体半导体材料的方法和制备半导体器件的方法

    公开(公告)号:US20070051302A1

    公开(公告)日:2007-03-08

    申请号:US11553054

    申请日:2006-10-26

    摘要: Disclosed are a method of producing a crystalline semiconductor material capable of improving the crystallinity and a method of fabricating a semiconductor device using the crystalline semiconductor material. An amorphous film is uniformly irradiated with a pulse laser beam (energy beam) emitted from an XeCl excimer laser by 150 times so as to heat the amorphous film at such a temperature as to partially melt crystal grains having the {100} orientations with respect to the vertical direction of a substrate and melt amorphous film or crystal grains having face orientations other than the {100} orientations. Silicon crystals having the {100} orientations newly occur between a silicon oxide film and liquid-phase silicon and are bonded to each other at random, to newly form crystal grains having the {100} orientations. Such a crystal grain creation step is repeated, to form a crystalline film which has crystal grains preferentially grown in the {100} orientations with respect to the vertical direction of the substrate and thereby has sharp square-shaped crystal grain boundaries.

    摘要翻译: 公开了一种制造能够提高结晶度的结晶半导体材料的方法和使用该晶体半导体材料制造半导体器件的方法。 使用从XeCl准分子激光器发射的脉冲激光束(能量束)将非晶膜均匀地照射150次,以便在这样的温度下加热非晶膜,以便部分地熔化具有{100}取向的晶粒相对于 衬底的垂直方向和具有除{100}取向以外的面取向的熔融非晶膜或晶粒。 在氧化硅膜和液相硅之间新发生具有{100}取向的硅晶体并且彼此无规地结合,以重新形成具有{100}取向的晶粒。 重复这样的晶粒生成工序,形成相对于衬底的垂直方向在{100}取向上优先生长的晶粒,从而具有尖锐的方形晶粒边界的结晶膜。

    Method for manufacturing an oriented crystalline semiconductor using a pulsed laser
    6.
    发明授权
    Method for manufacturing an oriented crystalline semiconductor using a pulsed laser 失效
    使用脉冲激光器制造取向晶体半导体的方法

    公开(公告)号:US06972246B2

    公开(公告)日:2005-12-06

    申请号:US10856138

    申请日:2004-05-28

    摘要: A manufacturing method for a crystalline semiconductor material including a plurality of semiconductor crystal grains is provided. The manufacturing method includes forming an amorphous or polycrystalline semiconductor layer on a substrate having a flat surface; forming a plurality of projections each having a side wall surface substantially perpendicular to the flat surface of the substrate, a height set in the range of about 1 nm to less than or equal to about ¼ of the thickness of the semiconductor layer, and a lateral dimension set in the range of about 3 μm to about 18 μm in a direction parallel to the flat surface of the substrate; and heating the semiconductor layer a number of times by using a pulsed laser thereby forming the crystalline semiconductor material including the crystal grains each having a specific plane orientation with respect to a direction perpendicular to the flat surface of the substrate so that the crystal grains respectively correspond to the projections. Accordingly, the position, size, and plane orientation of a crystal can be controlled by a simple step, and a crystalline semiconductor material excellent in planarity as a film can be formed.

    摘要翻译: 提供了包括多个半导体晶粒的结晶半导体材料的制造方法。 该制造方法包括在具有平坦表面的基板上形成非晶或多晶半导体层; 形成多个突起,每个突起具有基本上垂直于基板的平坦表面的侧壁表面,设置在约1nm至小于或等于半导体层的厚度的约1/4的范围内的高度,以及横向 尺寸在平行于基板的平坦表面的方向上设定在约3μm至约18μm的范围内; 并通过使用脉冲激光加热半导体层多次,从而形成晶体半导体材料,该晶体半导体材料包括相对于垂直于衬底的平坦表面的方向具有特定平面取向的晶粒,使得晶粒分别对应于 对预测。 因此,可以通过简单的步骤来控制晶体的位置,尺寸和平面取向,并且可以形成作为膜的平面性优异的结晶半导体材料。

    Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device
    7.
    发明授权
    Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device 有权
    晶体半导体材料的制造方法和半导体器件的制造方法

    公开(公告)号:US07189665B2

    公开(公告)日:2007-03-13

    申请号:US11293727

    申请日:2005-12-02

    IPC分类号: H01L21/00

    摘要: A manufacturing method for a crystalline semiconductor material including a plurality of semiconductor crystal grains is provided. The manufacturing method includes forming an amorphous or polycrystalline semiconductor layer on a substrate having a flat surface; forming a plurality of projections each having a side wall surface substantially perpendicular to the flat surface of the substrate, a height set in the range of about 1 nm to less than or equal to about ¼ of the thickness of the semiconductor layer, and a lateral dimension set in the range of about 3 μm to about 18 μm in a direction parallel to the flat surface of the substrate; and heating the semiconductor layer a number of times by using a pulsed laser thereby forming the crystalline semiconductor material including the crystal grains each having a specific plane orientation with respect to a direction perpendicular to the flat surface of the substrate so that the crystal grains respectively correspond to the projections. Accordingly, the position, size, and plane orientation of a crystal can be controlled by a simple step, and a crystalline semiconductor material excellent in planarity as a film can be formed.

    摘要翻译: 提供了包括多个半导体晶粒的结晶半导体材料的制造方法。 该制造方法包括在具有平坦表面的基板上形成非晶或多晶半导体层; 形成多个突起,每个突起具有大致垂直于基板的平坦表面的侧壁表面,设置在约1nm至小于或等于半导体层厚度的约1/4的范围内的高度,以及横向 尺寸在平行于基板的平坦表面的方向上设定在约3μm至约18μm的范围内; 并通过使用脉冲激光加热半导体层多次,从而形成晶体半导体材料,该晶体半导体材料包括相对于垂直于衬底的平坦表面的方向具有特定平面取向的晶粒,使得晶粒分别对应于 对预测。 因此,可以通过简单的步骤来控制晶体的位置,尺寸和平面取向,并且可以形成作为膜的平面性优异的结晶半导体材料。

    Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device
    8.
    发明申请
    Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device 有权
    晶体半导体材料的制造方法和半导体器件的制造方法

    公开(公告)号:US20060084246A1

    公开(公告)日:2006-04-20

    申请号:US11293727

    申请日:2005-12-02

    IPC分类号: H01L21/20 H01L21/36

    摘要: A manufacturing method for a crystalline semiconductor material including a plurality of semiconductor crystal grains is provided. The manufacturing method includes forming an amorphous or polycrystalline semiconductor layer on a substrate having a flat surface; forming a plurality of projections each having a side wall surface substantially perpendicular to the flat surface of the substrate, a height set in the range of about 1 nm to less than or equal to about ¼ of the thickness of the semiconductor layer, and a lateral dimension set in the range of about 3 μm to about 18 μm in a direction parallel to the flat surface of the substrate; and heating the semiconductor layer a number of times by using a pulsed laser thereby forming the crystalline semiconductor material including the crystal grains each having a specific plane orientation with respect to a direction perpendicular to the flat surface of the substrate so that the crystal grains respectively correspond to the projections. Accordingly, the position, size, and plane orientation of a crystal can be controlled by a simple step, and a crystalline semiconductor material excellent in planarity as a film can be formed.

    摘要翻译: 提供了包括多个半导体晶粒的结晶半导体材料的制造方法。 该制造方法包括在具有平坦表面的基板上形成非晶或多晶半导体层; 形成多个突起,每个突起具有基本上垂直于基板的平坦表面的侧壁表面,设置在约1nm至小于或等于半导体层的厚度的约1/4的范围内的高度,以及横向 尺寸在平行于基板的平坦表面的方向上设定在约3μm至约18μm的范围内; 并通过使用脉冲激光加热半导体层多次,从而形成晶体半导体材料,该晶体半导体材料包括相对于垂直于衬底的平坦表面的方向具有特定平面取向的晶粒,使得晶粒分别对应于 对预测。 因此,可以通过简单的步骤来控制晶体的位置,尺寸和平面取向,并且可以形成作为膜的平面性优异的结晶半导体材料。

    Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device
    9.
    发明申请
    Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device 失效
    晶体半导体材料的制造方法和半导体器件的制造方法

    公开(公告)号:US20050006646A1

    公开(公告)日:2005-01-13

    申请号:US10856138

    申请日:2004-05-28

    摘要: A manufacturing method for a crystalline semiconductor material including a plurality of semiconductor crystal grains is provided. The manufacturing method includes forming an amorphous or polycrystalline semiconductor layer on a substrate having a flat surface; forming a plurality of projections each having a side wall surface substantially perpendicular to the flat surface of the substrate, a height set in the range of about 1 nm to less than or equal to about ¼ of the thickness of the semiconductor layer, and a lateral dimension set in the range of about 3 μm to about 18 μm in a direction parallel to the flat surface of the substrate; and heating the semiconductor layer a number of times by using a pulsed laser thereby forming the crystalline semiconductor material including the crystal grains each having a specific plane orientation with respect to a direction perpendicular to the flat surface of the substrate so that the crystal grains respectively correspond to the projections. Accordingly, the position, size, and plane orientation of a crystal can be controlled by a simple step, and a crystalline semiconductor material excellent in planarity as a film can be formed.

    摘要翻译: 提供了包括多个半导体晶粒的结晶半导体材料的制造方法。 该制造方法包括在具有平坦表面的基板上形成非晶或多晶半导体层; 形成多个突起,每个突起具有基本上垂直于基板的平坦表面的侧壁表面,设置在约1nm至小于或等于半导体层的厚度的约1/4的范围内的高度,以及横向 尺寸在平行于基板的平坦表面的方向上设定在约3μm至约18μm的范围内; 并通过使用脉冲激光加热半导体层多次,从而形成晶体半导体材料,该晶体半导体材料包括相对于垂直于衬底的平坦表面的方向具有特定平面取向的晶粒,使得晶粒分别对应于 对预测。 因此,可以通过简单的步骤来控制晶体的位置,尺寸和平面取向,并且可以形成作为膜的平面性优异的结晶半导体材料。

    Dial plate structure and watch
    10.
    发明授权
    Dial plate structure and watch 有权
    表盘结构和表

    公开(公告)号:US08717855B2

    公开(公告)日:2014-05-06

    申请号:US13597927

    申请日:2012-08-29

    IPC分类号: G04B19/06

    CPC分类号: G04B19/065 G04B19/087

    摘要: A dial plate structure includes first and second dial plates and a rotary indicator. The first dial plate has a first opening or a first cutout. The second dial plate is arranged under the first dial plate and has a plurality of function display portions exposed through the opening or the cutout. The rotary indicator is arranged between the first and second dial plates and has a function indicator to selectively indicate one of the function display portions by rotation. The rotary indicator is partially exposed through the opening or the cutout. The rotary indicator has, on the surface thereof, a plurality of index markers respectively corresponding to the function display portions. The first dial plate has a second opening or a second cutout to expose one of the index markers when the function indicator indicates one of the function display portions corresponding to the indicated function display portion.

    摘要翻译: 表盘结构包括第一和第二拨盘和旋转指示器。 第一刻度盘具有第一开口或第一切口。 第二表盘布置在第一拨盘下方,并且具有通过开口或切口暴露的多个功能显示部。 旋转指示器布置在第一和第二表盘之间,并且具有功能指示器,以通过旋转来选择性地指示功能显示部分之一。 旋转指示器通过开口或切口部分露出。 旋转指示器在其表面上分别对应于功能显示部分的多个索引标记。 当功能指示符指示与所指示的功能显示部分相对应的功能显示部分之一时,第一刻度盘具有第二开口或第二切口以暴露索引标记之一。