Fastening element for vehicle parts
    1.
    发明授权
    Fastening element for vehicle parts 有权
    车辆零件紧固件

    公开(公告)号:US08568073B2

    公开(公告)日:2013-10-29

    申请号:US12223544

    申请日:2007-02-02

    IPC分类号: F16B21/18 F16B37/04

    摘要: The invention relates to a fastening element (1) for vehicle parts (5), in particular for fastening a heat shield to a bolt shaped fastening means (13) of a vehicle body, preferably an underbody of a motor vehicle, comprising a claw disk (2) and a spring washer (3), held at claws (2.1) of the claw disk, wherein the claw disk (2) comprises an opening (6) and the spring washer (3) can be interlocked with a bolt shaped fastening means (13), wherein the claw disk (2) comprises at least one clip element (8), associated with the opening (6) and oriented away from the spring washer (3), wherein the at least one clip element (8) is configured for insertion through an opening (7) in the vehicle part (5) or in the heat shield, and wherein the at least one clip element (8) comprises an undercut (10) for interlocking the rim portion of the opening (7) of the vehicle part (5) or of the heat shield.

    摘要翻译: 本发明涉及一种用于车辆部件(5)的紧固元件(1),特别是用于将隔热罩固定到车体(优选地是机动车辆的底部)的螺栓形紧固装置(13)上,包括爪盘 (2)和固定在爪盘的爪(2.1)上的弹簧垫圈(3),其中爪盘(2)包括开口(6),弹簧垫圈(3)可与螺栓形紧固件 装置(13),其中所述爪盘(2)包括与所述开口(6)相关联并且远离所述弹簧垫圈(3)定向的至少一个夹子元件(8),其中所述至少一个夹子元件(8) 被构造成用于插入穿过车辆部分(5)中或隔热罩中的开口(7),并且其中所述至少一个夹子元件(8)包括底切(10),用于将开口(7)的边缘部分互锁 )或车辆部件(5)或隔热罩。

    Fastening Element for Vehicle Parts
    2.
    发明申请
    Fastening Element for Vehicle Parts 有权
    车辆零件紧固元件

    公开(公告)号:US20100047011A1

    公开(公告)日:2010-02-25

    申请号:US12223544

    申请日:2007-02-02

    IPC分类号: E04B1/49

    摘要: The invention relates to a fastening element (1) for vehicle parts (5), in particular for fastening a heat shield to a bolt shaped fastening means (13) of a vehicle body, preferably an underbody of a motor vehicle, comprising a claw disk (2) and a spring washer (3), held at claws (2.1) of the claw disk, wherein the claw disk (2) comprises an opening (6) and the spring washer (3) can be interlocked with a bolt shaped fastening means (13), wherein the claw disk (2) comprises at least one clip element (8), associated with the opening (6) and oriented away from the spring washer (3), wherein the at least one clip element (8) is configured for insertion through an opening (7) in the vehicle part (5) or in the heat shield, and wherein the at least one clip element (8) comprises an undercut (10) for interlocking the rim portion of the opening (7) of the vehicle part (5) or of the heat shield.

    摘要翻译: 本发明涉及一种用于车辆部件(5)的紧固元件(1),特别是用于将隔热罩固定到车体(优选地是机动车辆的底部)的螺栓形紧固装置(13)上,包括爪盘 (2)和固定在爪盘的爪(2.1)上的弹簧垫圈(3),其中爪盘(2)包括开口(6),弹簧垫圈(3)可与螺栓形紧固件 装置(13),其中所述爪盘(2)包括与所述开口(6)相关联并且远离所述弹簧垫圈(3)定向的至少一个夹子元件(8),其中所述至少一个夹子元件(8) 被构造成用于插入穿过车辆部分(5)中或隔热罩中的开口(7),并且其中所述至少一个夹子元件(8)包括底切(10),用于将开口(7)的边缘部分互锁 )或车辆部件(5)或隔热罩。

    Method for local contacting and local doping of a semiconductor layer
    3.
    发明授权
    Method for local contacting and local doping of a semiconductor layer 有权
    局部接触和局部掺杂半导体层的方法

    公开(公告)号:US08828790B2

    公开(公告)日:2014-09-09

    申请号:US13061158

    申请日:2009-08-20

    摘要: A method for local contacting and local doping of a semiconductor layer including the following process steps: A) Generation of a layer structure on the semiconductor layer through i) application of at least one intermediate layer on one side of the semiconductor layer, and ii) application of at least one metal layer onto the intermediate layer last applied in step i), wherein the metal layer at least partly covers the last applied intermediate layer, B) Local heating of the layer structure in such a manner that in a local region a short-time melt-mixture of at least partial regions of at least the layers: metal layer, intermediate layer and semiconductor layer, forms. After solidification of the melt-mixture, a contacting is created between metal layer and semiconductor layer. It is essential that in step A) i) at least one intermediate layer designed as dopant layer is applied, which contains a dopant wherein the dopant has a greater solubility in the semiconductor layer than the metal of the metal layer.

    摘要翻译: 一种半导体层的局部接触和局部掺杂的方法,包括以下工艺步骤:A)通过在半导体层的一侧上施加至少一个中间层,在半导体层上产生层结构,以及ii) 在步骤i)中最后施加至少一个金属层到中间层上,其中金属层至少部分地覆盖最后施加的中间层,B)层结构的局部加热,使得在局部区域a 形成至少两层以上金属层,中间层和半导体层的至少部分区域的短时熔融混合物。 在熔融混合物固化之后,在金属层和半导体层之间形成接触。 重要的是,在步骤A)中,i)施加设计为掺杂剂层的至少一个中间层,其包含掺杂剂,其中掺杂剂在半导体层中比金属层的金属具有更大的溶解度。

    METHOD FOR PRODUCING A SELECTIVE DOPING STRUCTURE IN A SEMICONDUCTOR SUBSTRATE IN ORDER TO PRODUCE A PHOTOVOLTAIC SOLAR CELL
    4.
    发明申请
    METHOD FOR PRODUCING A SELECTIVE DOPING STRUCTURE IN A SEMICONDUCTOR SUBSTRATE IN ORDER TO PRODUCE A PHOTOVOLTAIC SOLAR CELL 有权
    在半导体基板中生产选择性掺杂结构的方法,用于生产光伏太阳能电池

    公开(公告)号:US20130157401A1

    公开(公告)日:2013-06-20

    申请号:US13805111

    申请日:2011-06-16

    IPC分类号: H01L31/18

    摘要: A method for producing a selective doping structure in a semiconductor substrate in order produce a photovoltaic solar cell. The method includes the following steps: A) applying a doping layer (2) to the emitter side of the semiconductor substrate, B) locally heating a melting region of the doping layer (2) and a melting region of the semiconductor substrate lying under the doping layer (2) in such a way that dopant diffuses from the doping layer (2) into the melted semiconductor substrate via liquid-liquid diffusion, so that a high doping region (3) is produced after the melt mixture solidifies, C) producing the planar low doping region by globally heating the semiconductor substrate, D) removing the doping layer (2) and E) removing or converting a layer of the semiconductor substrate on the doping side in such a way that part of the low doping region and of the high doping region close to the surface is removed or is converted into an electrically non-conducting layer.

    摘要翻译: 一种用于在半导体衬底中产生选择性掺杂结构的方法,以便产生光伏太阳能电池。 该方法包括以下步骤:A)将掺杂层(2)施加到半导体衬底的发射极侧,B)局部加热掺杂层(2)的熔化区域和位于半导体衬底下方的半导体衬底的熔化区域 掺杂层(2),使得掺杂剂通过液 - 液扩散从掺杂层(2)扩散到熔融的半导体衬底中,使得在熔融混合物固化后产生高掺杂区域(3),C)产生 通过全面加热半导体衬底,平面低掺杂区域,D)去除掺杂层(2),以及E)以掺杂侧的半导体衬底的一部分去除或转换半导体衬底的一部分, 靠近表面的高掺杂区域被去除或被转换成不导电的层。

    Liquid pump for an internal combustion engine and device for heating liquid
    5.
    发明授权
    Liquid pump for an internal combustion engine and device for heating liquid 有权
    用于内燃机的液体泵和用于加热液体的装置

    公开(公告)号:US08439656B2

    公开(公告)日:2013-05-14

    申请号:US12391469

    申请日:2009-02-24

    申请人: Andreas Wolf

    发明人: Andreas Wolf

    IPC分类号: F04B35/04

    CPC分类号: F04D29/588 F04D13/0666

    摘要: A liquid pump for an internal combustion engine having a housing in which a pump rotational shaft is accommodated, in particular a water pump of a heat exchanger circuit of a vehicle, and an eddy current arrangement is provided at least partially inside the housing of the liquid pump. The invention furthermore relates to a device for heating a liquid.

    摘要翻译: 一种用于内燃机的液体泵,其具有容纳泵旋转轴的壳体,特别是车辆的热交换器回路的水泵和涡流装置,至少部分地设置在液体的壳体内部 泵。 本发明还涉及一种用于加热液体的装置。

    SPRING ASSEMBLY FOR LEVEL CONTROL IN A VEHICLE
    6.
    发明申请
    SPRING ASSEMBLY FOR LEVEL CONTROL IN A VEHICLE 有权
    弹簧总成用于车辆中的液位控制

    公开(公告)号:US20120240818A1

    公开(公告)日:2012-09-27

    申请号:US13499147

    申请日:2010-09-22

    IPC分类号: B61F5/04 B60G17/02

    CPC分类号: B61F5/14 B61F5/02

    摘要: Disclosed is a spring assembly for level controlled support of a wagon body on a running gear of a vehicle, in particular of a railway vehicle, including a spring device and an actuator device, wherein the spring device takes up a first installation space, the actuator device takes up a second installation space, the spring device and the actuator device are connected to each other in a direction of action in a kinematically serial arrangement, and the actuator device is designed for at least partially compensating for a change in length of the spring device in the direction of action by a displacement at an actuator component in the direction of action, and wherein the first installation space and the second installation space overlap each other in the direction of action in an overlapping region. Also disclosed is a vehicle having such a spring assembly.

    摘要翻译: 公开了一种用于货车车身在车辆的行驶装置上的液压控制支撑的弹簧组件,特别是一种包括弹簧装置和致动器装置的铁路车辆,其中弹簧装置占据第一安装空间,致动器 装置占据第二安装空间,弹簧装置和致动器装置以运动方式串联布置的动作方向彼此连接,并且致动器装置设计成至少部分地补偿弹簧长度的变化 通过在致动器部件的作用方向上的位移而在作用方向上的装置,并且其中第一安装空间和第二安装空间在重叠区域中在作用方向上彼此重叠。 还公开了具有这种弹簧组件的车辆。

    Device and method for controlling an automatic transmission in a motor vehicle
    7.
    发明授权
    Device and method for controlling an automatic transmission in a motor vehicle 有权
    用于控制机动车辆中的自动变速器的装置和方法

    公开(公告)号:US08271166B2

    公开(公告)日:2012-09-18

    申请号:US11722916

    申请日:2006-02-16

    IPC分类号: G06F7/00

    摘要: A device and a method for control of an automatic transmission (1) in a vehicle having one control unit (2), which can receive signals produced by a transmission gearshift lever (7), and/or a first transmission control (8). The signals of the first transmission control are bridgeable so that the automatic transmission can be manually operated. In order to make it possible to efficiently operate the vehicle with low fuel consumption and great flexibility of the driver at the moment, manual operation of the automatic transmission is possible only when the vehicle is at speed (v) lower than a predetermined speed limit.

    摘要翻译: 一种用于控制车辆中的自动变速器(1)的装置和方法,所述车辆具有可接收由变速换档杆(7)产生的信号的一个控制单元(2)和/或第一变速器控制器(8)。 第一变速器控制的信号是可桥接的,从而可以手动操作自动变速器。 为了能够以目前的驾驶员的低燃料消耗和大的灵活性有效地操作车辆,只有当车辆的速度(v)低于预定的速度限制时,才能够自动变速器的手动操作。

    METHOD FOR LOCAL CONTACTING AND LOCAL DOPING OF A SEMICONDUCTOR LAYER
    10.
    发明申请
    METHOD FOR LOCAL CONTACTING AND LOCAL DOPING OF A SEMICONDUCTOR LAYER 有权
    用于局部接触和半导体层局部掺杂的方法

    公开(公告)号:US20110233711A1

    公开(公告)日:2011-09-29

    申请号:US13061158

    申请日:2009-08-20

    IPC分类号: H01L29/36 H01L21/24

    摘要: A method for local contacting and local doping of a semiconductor layer including the following process steps: A) Generation of a layer structure on the semiconductor layer through i) application of at least one intermediate layer on one side of the semiconductor layer, and ii) application of at least one metal layer onto the intermediate layer last applied in step i), wherein the metal layer at least partly covers the last applied intermediate layer, B) Local heating of the layer structure in such a manner that in a local region a short-time melt-mixture of at least partial regions of at least the layers: metal layer, intermediate layer and semiconductor layer, forms. After solidification of the melt-mixture, a contacting is created between metal layer and semiconductor layer. It is essential that in step A) i) at least one intermediate layer designed as dopant layer is applied, which contains a dopant wherein the dopant has a greater solubility in the semiconductor layer than the metal of the metal layer.

    摘要翻译: 一种半导体层的局部接触和局部掺杂的方法,包括以下工艺步骤:A)通过在半导体层的一侧上施加至少一个中间层,在半导体层上产生层结构,以及ii) 在步骤i)中最后施加至少一个金属层到中间层上,其中金属层至少部分地覆盖最后施加的中间层,B)层结构的局部加热,使得在局部区域a 形成至少两层以上金属层,中间层和半导体层的至少部分区域的短时熔融混合物。 在熔融混合物固化之后,在金属层和半导体层之间形成接触。 重要的是,在步骤A)中,i)施加设计为掺杂剂层的至少一个中间层,其包含掺杂剂,其中掺杂剂在半导体层中比金属层的金属具有更大的溶解度。