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    Hydrosilyation cured silicone resins obtained by fractionation
    1.
    发明授权
    Hydrosilyation cured silicone resins obtained by fractionation 失效
    通过分级得到的水解固化的硅氧烷树脂

    公开(公告)号：US06596821B1

    公开(公告)日：2003-07-22

    申请号：US10091678

    申请日：2002-03-05

    申请人： Dimitris E. Katsoulis ,  Bizhong Zhu ,  John R. Keryk ,  Frederick J. McGarry ,  Zhongtao Li

    发明人： Dimitris E. Katsoulis ,  Bizhong Zhu ,  John R. Keryk ,  Frederick J. McGarry ,  Zhongtao Li

    IPC分类号： C08G7704

    CPC分类号： C08G77/04 ,  C08G77/36 ,  C08K5/0025

    摘要： A process for producing a cured silsesquioxane resin. The process includes fractionating the silsesquioxane resin a plurality of times utilizing an organic solvent in combination with an organic non-solvent. The fractionated resin is then stripped of excess solvent. The stripped resin is then mixed with a cross-linking compound to form a curable composition. The curable composition is cured to form a cured resin having high fracture toughness and strength without the loss of elastic modulus.

    摘要翻译： 固化倍半硅氧烷树脂的制造方法。 该方法包括使用有机溶剂与有机非溶剂组合多次分级倍半硅氧烷树脂。 然后将分馏的树脂汽提出过量的溶剂。 然后将剥离的树脂与交联化合物混合以形成可固化组合物。 可固化组合物固化以形成具有高断裂韧性和强度的固化树脂，而不损失弹性模量。

    Hydrosilsesquioxane resin compositions having improved thin film properties
    7.
    发明授权
    Hydrosilsesquioxane resin compositions having improved thin film properties 失效
    具有改善薄膜性能的倍半硅氧烷树脂组合物

    公开(公告)号：US06737117B2

    公开(公告)日：2004-05-18

    申请号：US10116953

    申请日：2002-04-05

    申请人： Ronald P. Boisvert ,  Duane R. Bujalski ,  Brian R. Harkness ,  Zhongtao Li ,  Kai Su ,  Bianxiao Zhong

    发明人： Ronald P. Boisvert ,  Duane R. Bujalski ,  Brian R. Harkness ,  Zhongtao Li ,  Kai Su ,  Bianxiao Zhong

    IPC分类号： B05D304

    CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C09D183/04 ,  C08L83/00

    摘要： Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2. Also disclosed herein is a method of preparing such a resin solution, as well as a method of preparing a solid coating, comprising (i) coating the resin solution on a surface; (ii) removing the solvent from the resin solution; (iii) removing R groups from the organosiloxane resin; and (iv) curing the resin solution, to form the solid coating. Coatings prepared from the resins disclosed herein have relatively low dielectric constants and also have relatively low SiH content and relatively high modulus.

    摘要翻译： 本文公开了一种树脂溶液，其包含（a）约0.1固体wt％至约50固体wt％的包含式（RSiO 3/2）x（R'SiO 3/2）y的有机硅氧烷树脂，其中R选自 由C 4 -C 24烷基，C 4 -C 24烯基，C 4 -C 24烷氧基，C 8 -C 24烯氧基和C 4 -C 24取代的烃组成的基团; R'选自-H，C 1 -C 4未取代的烃和C 1 -C 4取代的烃; x为约5摩尔％至约75摩尔％; y为约10摩尔％至约95摩尔％; x + y为至少约40摩尔％。 和（b）约50固体wt％至约99.9固体wt％的包含至少约90mol％的式HSiO 3/2的树脂。 本文还公开了制备这种树脂溶液的方法，以及制备固体涂层的方法，包括（i）将树脂溶液涂布在表面上; （ii）从树脂溶液中除去溶剂; （iii）从有机硅氧烷树脂中除去R基团; 和（iv）固化树脂溶液以形成固体涂层。 由本文公开的树脂制备的涂料具有相对低的介电常数，并且还具有相对低的SiH含量和相对高的模量。