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公开(公告)号：US08186048B2
公开(公告)日：2012-05-29
申请号：US11952634
申请日：2007-12-07
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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公开(公告)号：US08720051B2
公开(公告)日：2014-05-13
申请号：US13151499
申请日：2011-06-02
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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公开(公告)号：US20110235282A1
公开(公告)日：2011-09-29
申请号：US13151499
申请日：2011-06-02
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露于身体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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公开(公告)号：US20090002970A1
公开(公告)日：2009-01-01
申请号：US11952634
申请日：2007-12-07
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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公开(公告)号：US20110225803A1
公开(公告)日：2011-09-22
申请号：US13117284
申请日：2011-05-27
申请人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
IPC分类号： H05K13/00
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似的操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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公开(公告)号：US08296941B2
公开(公告)日：2012-10-30
申请号：US13117284
申请日：2011-05-27
申请人： David J. Hiner , Waite R. Warren, Jr. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, Jr. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
IPC分类号： H01L24/97 , H01L23/552 , H05K3/30
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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公开(公告)号：US20100199492A1
公开(公告)日：2010-08-12
申请号：US12766347
申请日：2010-04-23
申请人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
IPC分类号： H05K3/00
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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公开(公告)号：US20090000815A1
公开(公告)日：2009-01-01
申请号：US11952545
申请日：2007-12-07
申请人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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公开(公告)号：US08959762B2
公开(公告)日：2015-02-24
申请号：US13034755
申请日：2011-02-25
CPC分类号： H05K1/0216 , H01L23/552 , H01L24/97 , H01L2924/1461 , H05K1/0218 , H05K1/115 , H05K1/181 , H05K3/0052 , H05K3/0097 , H05K3/284 , H05K3/4614 , H05K2201/0715 , H05K2201/0949 , H05K2201/09618 , H05K2201/09709 , Y10T29/49124 , Y10T29/4913 , Y10T29/49146 , Y10T29/49171 , H01L2924/00
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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公开(公告)号：US20120217048A1
公开(公告)日：2012-08-30
申请号：US13034755
申请日：2011-02-25
CPC分类号： H05K1/0216 , H01L23/552 , H01L24/97 , H01L2924/1461 , H05K1/0218 , H05K1/115 , H05K1/181 , H05K3/0052 , H05K3/0097 , H05K3/284 , H05K3/4614 , H05K2201/0715 , H05K2201/0949 , H05K2201/09618 , H05K2201/09709 , Y10T29/49124 , Y10T29/4913 , Y10T29/49146 , Y10T29/49171 , H01L2924/00
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译： 在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。 最初在单个元模块上形成不同模块的电路。 每个模块将具有其中形成电路的一个或多个组件区域。 对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。 然后在元模块上的所有模块上形成单体，例如包覆模体。 然后，通过切割，钻孔或类似操作将待屏蔽的每个组分区域的金属结构的至少一部分暴露于身体。 接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。
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