Non-volatile memory devices including double diffused junction regions
    1.
    发明授权
    Non-volatile memory devices including double diffused junction regions 有权
    包括双扩散连接区域的非易失性存储器件

    公开(公告)号:US07898039B2

    公开(公告)日:2011-03-01

    申请号:US11675372

    申请日:2007-02-15

    IPC分类号: H01L21/70 H01L29/76

    摘要: A nonvolatile memory device includes a string selection gate and a ground selection gate on a semiconductor substrate, and a plurality of memory cell gates on the substrate between the string selection gate and the ground selection gate. First impurity regions extend into the substrate to a first depth between ones of the plurality of memory cell gates. Second impurity regions extend into the substrate to a second depth that is greater than the first depth between the string selection gate and a first one of the plurality of memory cell gates immediately adjacent thereto, and between the ground selection gate and a last one of the plurality of memory cell gates immediately adjacent thereto. Related fabrication methods are also discussed.

    摘要翻译: 非易失性存储器件包括半导体衬底上的串选择栅极和接地选择栅极,以及在串选择栅极和地选择栅极之间的衬底上的多个存储单元栅极。 第一杂质区域延伸到衬底中到多个存储单元门之间的第一深度。 第二杂质区域延伸到衬底中的第二深度,该第二深度大于串选择栅极与紧邻其之间的多个存储单元栅极中的第一深度之间以及在接地选择栅极和最后一个栅极选择栅极之间的第一深度 与其紧邻的多个存储单元门。 还讨论了相关的制造方法。

    NON-VOLATILE MEMORY DEVICES INCLUDING DOUBLE DIFFUSED JUNCTION REGIONS AND METHODS OF FABRICATING THE SAME
    2.
    发明申请
    NON-VOLATILE MEMORY DEVICES INCLUDING DOUBLE DIFFUSED JUNCTION REGIONS AND METHODS OF FABRICATING THE SAME 有权
    非易失性存储器件,包括双重扩散接点区域及其制造方法

    公开(公告)号:US20080093648A1

    公开(公告)日:2008-04-24

    申请号:US11675372

    申请日:2007-02-15

    IPC分类号: H01L29/788 H01L21/336

    摘要: A nonvolatile memory device includes a string selection gate and a ground selection gate on a semiconductor substrate, and a plurality of memory cell gates on the substrate between the string selection gate and the ground selection gate. First impurity regions extend into the substrate to a first depth between ones of the plurality of memory cell gates. Second impurity regions extend into the substrate to a second depth that is greater than the first depth between the string selection gate and a first one of the plurality of memory cell gates immediately adjacent thereto, and between the ground selection gate and a last one of the plurality of memory cell gates immediately adjacent thereto. Related fabrication methods are also discussed.

    摘要翻译: 非易失性存储器件包括半导体衬底上的串选择栅极和接地选择栅极,以及在串选择栅极和地选择栅极之间的衬底上的多个存储单元栅极。 第一杂质区域延伸到衬底中到多个存储单元门之间的第一深度。 第二杂质区域延伸到衬底中的第二深度,该第二深度大于串选择栅极与紧邻其之间的多个存储单元栅极中的第一深度之间以及在接地选择栅极和最后一个栅极选择栅极之间的第一深度 与其紧邻的多个存储单元门。 还讨论了相关的制造方法。

    Methods of fabricating non-volatile memory devices including double diffused junction regions
    3.
    发明授权
    Methods of fabricating non-volatile memory devices including double diffused junction regions 有权
    制造包括双扩散连接区域的非易失性存储器件的方法

    公开(公告)号:US08324052B2

    公开(公告)日:2012-12-04

    申请号:US13010583

    申请日:2011-01-20

    IPC分类号: H01L21/331

    摘要: A nonvolatile memory device includes a string selection gate and a ground selection gate on a semiconductor substrate, and a plurality of memory cell gates on the substrate between the string selection gate and the ground selection gate. First impurity regions extend into the substrate to a first depth between ones of the plurality of memory cell gates. Second impurity regions extend into the substrate to a second depth that is greater than the first depth between the string selection gate and a first one of the plurality of memory cell gates immediately adjacent thereto, and between the ground selection gate and a last one of the plurality of memory cell gates immediately adjacent thereto. Related fabrication methods are also discussed.

    摘要翻译: 非易失性存储器件包括半导体衬底上的串选择栅极和接地选择栅极,以及在串选择栅极和地选择栅极之间的衬底上的多个存储单元栅极。 第一杂质区域延伸到衬底中到多个存储单元门之间的第一深度。 第二杂质区域延伸到衬底中的第二深度,该第二深度大于串选择栅极与紧邻其之间的多个存储单元栅极中的第一深度之间以及在接地选择栅极和最后一个栅极选择栅极之间的第一深度 与其紧邻的多个存储单元门。 还讨论了相关的制造方法。

    METHODS OF FABRICATING NON-VOLATILE MEMORY DEVICES INCLUDING DOUBLE DIFFUSED JUNCTION REGIONS
    4.
    发明申请
    METHODS OF FABRICATING NON-VOLATILE MEMORY DEVICES INCLUDING DOUBLE DIFFUSED JUNCTION REGIONS 有权
    制造非易失性记忆装置的方法,包括双重扩散结区

    公开(公告)号:US20110111570A1

    公开(公告)日:2011-05-12

    申请号:US13010583

    申请日:2011-01-20

    IPC分类号: H01L21/8234

    摘要: A nonvolatile memory device includes a string selection gate and a ground selection gate on a semiconductor substrate, and a plurality of memory cell gates on the substrate between the string selection gate and the ground selection gate. First impurity regions extend into the substrate to a first depth between ones of the plurality of memory cell gates. Second impurity regions extend into the substrate to a second depth that is greater than the first depth between the string selection gate and a first one of the plurality of memory cell gates immediately adjacent thereto, and between the ground selection gate and a last one of the plurality of memory cell gates immediately adjacent thereto. Related fabrication methods are also discussed.

    摘要翻译: 非易失性存储器件包括半导体衬底上的串选择栅极和接地选择栅极,以及在串选择栅极和地选择栅极之间的衬底上的多个存储单元栅极。 第一杂质区域延伸到衬底中到多个存储单元门之间的第一深度。 第二杂质区域延伸到衬底中的第二深度,该第二深度大于串选择栅极与紧邻其之间的多个存储单元栅极中的第一深度之间以及在接地选择栅极和最后一个栅极选择栅极之间的第一深度 与其紧邻的多个存储单元门。 还讨论了相关的制造方法。

    Semiconductor memory devices and methods for forming the same
    5.
    发明授权
    Semiconductor memory devices and methods for forming the same 有权
    半导体存储器件及其形成方法

    公开(公告)号:US07494871B2

    公开(公告)日:2009-02-24

    申请号:US11647671

    申请日:2006-12-29

    IPC分类号: H01L21/336

    CPC分类号: H01L27/115 H01L27/11521

    摘要: A semiconductor memory device can include select transistors and cell transistors on a semiconductor substrate. An insulation layer covers the select transistors and the cell transistors. The bit lines are in the insulation layer and are electrically connected to respective ones of the select transistors. The bit lines are arranged along at least two different parallel planes having different heights relative to the semiconductor substrate.

    摘要翻译: 半导体存储器件可以包括半导体衬底上的选择晶体管和单元晶体管。 绝缘层覆盖选择晶体管和单元晶体管。 位线在绝缘层中并且电连接到相应的选择晶体管。 沿着相对于半导体衬底具有不同高度的至少两个不同的平行平面布置位线。

    Semiconductor memory devices and methods for forming the same
    6.
    发明申请
    Semiconductor memory devices and methods for forming the same 有权
    半导体存储器件及其形成方法

    公开(公告)号:US20080081413A1

    公开(公告)日:2008-04-03

    申请号:US11647671

    申请日:2006-12-29

    IPC分类号: H01L21/336

    CPC分类号: H01L27/115 H01L27/11521

    摘要: A semiconductor memory device can include select transistors and cell transistors on a semiconductor substrate. An insulation layer covers the select transistors and the cell transistors. The bit lines are in the insulation layer and are electrically connected to respective ones of the select transistors. The bit lines are arranged along at least two different parallel planes having different heights relative to the semiconductor substrate.

    摘要翻译: 半导体存储器件可以包括半导体衬底上的选择晶体管和单元晶体管。 绝缘层覆盖选择晶体管和单元晶体管。 位线在绝缘层中并且电连接到相应的选择晶体管。 沿着相对于半导体衬底具有不同高度的至少两个不同的平行平面布置位线。

    Semiconductor device and related fabrication method
    8.
    发明授权
    Semiconductor device and related fabrication method 有权
    半导体器件及相关制造方法

    公开(公告)号:US07589374B2

    公开(公告)日:2009-09-15

    申请号:US11699990

    申请日:2007-01-31

    IPC分类号: H01L29/788

    摘要: Embodiments of the invention provide a semiconductor device and a related method of fabricating a semiconductor device. In one embodiment, the invention provides a semiconductor device comprising a first gate electrode comprising a lower silicon pattern and an upper silicon pattern and disposed on an active region of a semiconductor substrate, wherein the upper silicon pattern has the same crystal structure as the lower silicon pattern and the active region is defined by a device isolation layer. The semiconductor device further comprises a gate insulating layer disposed between the active region and the first gate electrode.

    摘要翻译: 本发明的实施例提供一种制造半导体器件的半导体器件和相关方法。 在一个实施例中,本发明提供一种半导体器件,其包括第一栅电极,其包括下硅图案和上硅图案,并设置在半导体衬底的有源区上,其中上硅图案具有与下硅相同的晶体结构 图案和有源区域由器件隔离层定义。 半导体器件还包括设置在有源区和第一栅电极之间的栅极绝缘层。

    Nonvolatile memory device and method of manufacturing the same
    9.
    发明授权
    Nonvolatile memory device and method of manufacturing the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US07560768B2

    公开(公告)日:2009-07-14

    申请号:US11594808

    申请日:2006-11-09

    IPC分类号: H01L29/788

    摘要: Provided are a nonvolatile memory device and a method of manufacturing the same. A floating gate electrode of the nonvolatile memory device may have a cross-shaped section as taken along a direction extending along a control gate electrode. The floating gate electrode may have an inverse T-shaped section as taken along a direction extending along an active region perpendicular to the control gate electrode. The floating gate electrode may include a lower gate pattern, a middle gate pattern and an upper gate pattern sequentially disposed on a gate insulation layer, in which the middle gate pattern is larger in width than the lower gate pattern and the upper gate pattern. A boundary between the middle gate pattern and the upper gate pattern may have a rounded corner.

    摘要翻译: 提供一种非易失性存储器件及其制造方法。 非易失性存储器件的浮置栅极可以沿着沿着控制栅电极延伸的方向截取十字形截面。 浮置栅极可以具有沿着垂直于控制栅电极的有源区延伸的方向的T形截面。 浮栅电极可以包括顺序地设置在栅绝缘层上的下栅极图案,中栅极图案和上栅极图案,其中中间栅极图案的宽度大于下栅极图案和上栅极图案。 中间栅极图案和上部栅极图案之间的边界可以具有圆角。

    Method of manufacturing a non-volatile semiconductor device
    10.
    发明申请
    Method of manufacturing a non-volatile semiconductor device 有权
    制造非易失性半导体器件的方法

    公开(公告)号:US20090035906A1

    公开(公告)日:2009-02-05

    申请号:US12222074

    申请日:2008-08-01

    IPC分类号: H01L21/336

    摘要: Example embodiments relate to methods of fabricating a non-volatile memory device. According to example embodiments, a method of fabricating a non-volatile memory device may include forming at least one gate structure on an upper face of a substrate. The at least one gate structure may include a tunnel insulation layer pattern, a charge storing layer pattern, a dielectric layer pattern and a control gate. According to example embodiments, a method of fabricating a non-volatile memory device may also include forming a silicon nitride layer on the upper face of the substrate to cover the at least one gate structure, forming an insulating interlayer on the silicon nitride layer on the upper face of the substrate, and providing an annealing gas toward the upper face of the substrate and a lower face of the substrate to cure defects of the tunnel insulation layer pattern.

    摘要翻译: 示例实施例涉及制造非易失性存储器件的方法。 根据示例性实施例,制造非易失性存储器件的方法可以包括在衬底的上表面上形成至少一个栅极结构。 至少一个栅极结构可以包括隧道绝缘层图案,电荷存储层图案,电介质层图案和控制栅极。 根据示例实施例,制造非易失性存储器件的方法还可以包括在衬底的上表面上形成氮化硅层以覆盖至少一个栅极结构,在氮化硅层上形成绝缘中间层 并且朝向基板的上表面和基板的下表面提供退火气体,以固化隧道绝缘层图案的缺陷。