摘要:
A flow indicator comprising a housing and a floater and adapted to draw an air sample is provided. The housing has at least one lower inlet port, an interior space, an upper outlet port, and a transparent window. The floater is disposed inside the housing and is adapted to move substantially vertically in accordance with the flow of the air sample. The floater is also adapted to indicate a flow rate of the air sample.
摘要:
A flow indicator is disclosed and includes a horizontally disposed housing having a lower cap with a lower inlet port drawing in an air sample, an interior space passing the air sample, an upper cap having an upper outlet port exhausting the air sample, and a transparent tube coupled between the lower and upper caps and functioning as a transparent window allowing visual observation of at least a portion of the interior space. The flow indicator also includes a floater disposed within the housing and moving vertically in response to the flow of the air sample to indicate a flow rate for the air sample.
摘要:
A flow indicator includes a horizontally disposed housing having a lower inlet port drawing in an air sample, an interior space passing the air sample, an upper outlet port exhausting the air sample, and a transparent window allowing visual observation of at least a portion of the interior space. The flow indicator also includes a floater disposed within the housing to move vertically in response to the flow of the air sample to indicate a flow rate for the air sample, and a guide member extending upward from a lower portion of the housing and guiding movement of the floater.
摘要:
A flow indicator comprising a housing and a floater and adapted to draw an air sample is provided. The housing has at least one lower inlet port, an interior space, an upper outlet port, and a transparent window. The floater is disposed inside the housing and is adapted to move substantially vertically in accordance with the flow of the air sample. The floater is also adapted to indicate a flow rate of the air sample.
摘要:
A particle adsorption device includes a chamber having an inlet and an outlet by which air can pass through the chamber, a support for supporting an adsorbent plate in the chamber, and at least one porous plate disposed in the chamber to control the air flow through the chamber and over a surface of the adsorbent plate. A sampling apparatus includes a particle counter which has a detector that is operative to count particles of a certain size contained in the air, the particle adsorption device, and a probe by which a sample of air is sequentially or selectively fed to the particle adsorption device and the particle counter. Thus, in a method for use in monitoring a manufacturing environment for potential contamination, particles of a certain size in the air can be counted, and particles in the air can be collected on the surface of the adsorbent plate. The collected particles can be analyzed to determine their shape and composition. Te source of the particles can be traced from data produced using the sampling apparatus.
摘要:
A fluid sampling apparatus and associated fluid analyzer sample process fluids used in semiconductor manufacturing at a plurality of measurement points. The fluid sampling apparatus includes a first nozzle assembly having a plurality of outlet nozzles. The plurality of outlet nozzles are connected to lines supplying the process fluids. A second nozzle assembly is installed above the first nozzle assembly and includes an inlet nozzle connected to an apparatus for measuring a contamination level of the process fluids. A motor is connected to the second nozzle assembly to align a selected outlet nozzle with the inlet nozzle. A pneumatic cylinder is coupled to the first nozzle assembly to connect the selected outlet nozzle with the inlet nozzle. In this manner, it is possible to measure the contamination level of process fluids supplied at a plurality of measurement points by using a single measuring apparatus.
摘要:
In a semiconductor device, parallel first and second conductive lines having a unit width extend from a memory cell region into a connection region. A trim region in the connection region includes pads respectively connected to the first and second conductive lines but are separated by a width much greater than the unit width.
摘要:
Non-volatile memory devices include a tunnel insulating layer on a channel region of a substrate, a charge-trapping layer pattern on the tunnel insulating layer and a first blocking layer pattern on the charge-trapping layer pattern. Second blocking layer patterns are on the tunnel insulating layer proximate sidewalls of the charge-trapping layer pattern. The second blocking layer patterns are configured to limit lateral diffusion of electrons trapped in the charge-trapping layer pattern. A gate electrode is on the first blocking layer pattern. The second blocking layer patterns may prevent lateral diffusion of the electrons trapped in the charge-trapping layer pattern.
摘要:
Methods of forming a contact structure in a semiconductor device include providing a semiconductor substrate including active regions and word lines crossing the active regions. A first interlayer dielectric layer is formed on the semiconductor substrate. Direct contact plugs are formed extending through the first interlayer dielectric layer to contact selected ones of the active regions. Bit line structures are formed on the first interlayer dielectric layer and crossing the word lines that are coupled to the selected ones of the active regions by the direct contact plugs. A second interlayer dielectric layer is formed on the semiconductor substrate including the bit line structures. Barrier patterns are formed extending in parallel with bit line structures and into the second interlayer dielectric layer. Mask patterns are formed overlying an entirety of top surfaces of the direct contact plugs on the second interlayer dielectric layer and the bit line structures. The second and first interlayer dielectric layers are etched using the mask patterns, the barrier patterns and the bit line structures as an etching mask to form buried contact holes and buried contact plugs are formed in the buried contact holes.
摘要:
A virtual measuring device and a method for measuring the deposition thickness of amorphous silicon being deposited on a substrate is disclosed, where the method of measuring the deposition thickness of amorphous silicon includes predicting and adapting operations. In the predicting operation, during a process of depositing the amorphous silicon to a substrate, the deposition thickness is predicted by multiplying a predicted deposition speed to a deposition time by using a prediction model expressing a relationship between a deposition speed and a plurality of process factors that are correlated with the deposition speed obtained from the deposition thickness and the deposition time, and the predicted deposition thickness is compared with the measured deposition thickness, so that the relationship between the plurality of process factors and the deposition speed in the prediction model is compensated according to the comparison difference.