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1.发明授权Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor 有权金属栅极集成结构和方法，包括金属保险丝，反熔丝和/或电阻公开(公告)号：US08159040B2
公开(公告)日：2012-04-17
申请号：US12119526
申请日：2008-05-13
申请人： Douglas D. Coolbaugh , Ebenezer E. Eshun , Ephrem G. Gebreselasie , Zhong-Xiang He , Herbert Lei Ho , Deok-kee Kim , Chandrasekharan Kothandaraman , Dan Moy , Robert Mark Rassel , John Matthew Safran , Kenneth Jay Stein , Norman Whitelaw Robson , Ping-Chuan Wang , Hongwen Yan
发明人： Douglas D. Coolbaugh , Ebenezer E. Eshun , Ephrem G. Gebreselasie , Zhong-Xiang He , Herbert Lei Ho , Deok-kee Kim , Chandrasekharan Kothandaraman , Dan Moy , Robert Mark Rassel , John Matthew Safran , Kenneth Jay Stein , Norman Whitelaw Robson , Ping-Chuan Wang , Hongwen Yan
IPC分类号： H01L29/00
CPC分类号： H01L27/0629 , H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor structure and a method for fabricating the semiconductor structure provide a field effect device located and formed upon an active region of a semiconductor substrate and at least one of a fuse structure, an anti-fuse structure and a resistor structure located and formed at least in part simultaneously upon an isolation region laterally separated from the active region within the semiconductor substrate. The field effect device includes a gate dielectric comprising a high dielectric constant dielectric material and a gate electrode comprising a metal material. The at least one of the fuse structure, anti-fuse structure and resistor structure includes a pad dielectric comprising the same material as the gate dielectric, and optionally, also a fuse, anti-fuse or resistor that may comprise the same metal material as the gate electrode.
摘要翻译： 半导体结构和半导体结构的制造方法提供一种场效应器件，其位于和形成在半导体衬底的有源区上，并且至少一个熔丝结构，抗熔丝结构和电阻结构中的至少一个至少位于并形成 部分地同时地在与半导体衬底内的有源区域横向分离的隔离区域上。 场效应器件包括包括高介电常数介电材料的栅极电介质和包括金属材料的栅电极。 熔丝结构，反熔丝结构和电阻器结构中的至少一个包括包括与栅极电介质相同的材料的焊盘电介质，以及可选地还包括熔断器，反熔丝或电阻器，其可以包括与所述栅极电介质相同的金属材料 栅电极。
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2.发明申请METAL GATE INTEGRATION STRUCTURE AND METHOD INCLUDING METAL FUSE, ANTI-FUSE AND/OR RESISTOR 有权金属栅组合结构和方法，包括金属保险丝，抗保险丝和/或电阻公开(公告)号：US20090283840A1
公开(公告)日：2009-11-19
申请号：US12119526
申请日：2008-05-13
申请人： Douglas D. Coolbaugh , Ebenezer E. Eshun , Ephrem G. Gebreselasie , Zhong-Xiang He , Herbert Lei Ho , Deok-kee Kim , Chandrasekharan Kothandaraman , Dan Moy , Robert Mark Rassel , John Matthew Safran , Kenneth Jay Stein , Norman Whitelaw Robson , Ping-Chuan Wang , Hongwen Yan
发明人： Douglas D. Coolbaugh , Ebenezer E. Eshun , Ephrem G. Gebreselasie , Zhong-Xiang He , Herbert Lei Ho , Deok-kee Kim , Chandrasekharan Kothandaraman , Dan Moy , Robert Mark Rassel , John Matthew Safran , Kenneth Jay Stein , Norman Whitelaw Robson , Ping-Chuan Wang , Hongwen Yan
IPC分类号： H01L27/06 , H01L21/8234
CPC分类号： H01L27/0629 , H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor structure and a method for fabricating the semiconductor structure provide a field effect device located and formed upon an active region of a semiconductor substrate and at least one of a fuse structure, an anti-fuse structure and a resistor structure located and formed at least in part simultaneously upon an isolation region laterally separated from the active region within the semiconductor substrate. The field effect device includes a gate dielectric comprising a high dielectric constant dielectric material and a gate electrode comprising a metal material. The at least one of the fuse structure, anti-fuse structure and resistor structure includes a pad dielectric comprising the same material as the gate dielectric, and optionally, also a fuse, anti-fuse or resistor that may comprise the same metal material as the gate electrode.
摘要翻译： 半导体结构和半导体结构的制造方法提供一种场效应器件，其位于和形成在半导体衬底的有源区上，并且至少一个熔丝结构，抗熔丝结构和电阻结构中的至少一个至少位于并形成 部分地同时地在与半导体衬底内的有源区域横向分离的隔离区域上。 场效应器件包括包括高介电常数介电材料的栅极电介质和包括金属材料的栅电极。 熔丝结构，反熔丝结构和电阻器结构中的至少一个包括包括与栅极电介质相同的材料的焊盘电介质，以及可选地还包括熔断器，反熔丝或电阻器，其可以包括与所述栅极电介质相同的金属材料 栅电极。
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公开(公告)号：US08004060B2
公开(公告)日：2011-08-23
申请号：US11946938
申请日：2007-11-29
申请人： Deok-kee Kim , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran , Kenneth J. Stein
发明人： Deok-kee Kim , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran , Kenneth J. Stein
IPC分类号： H01L29/00
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： A metal layer and a semiconductor layer are sequentially deposited on a substrate. The semiconductor layer and the metal layer are lithographically patterned to form a stack of a semiconductor portion and a metal gate portion, which is preferably performed concurrently with formation of at least one metal gate stack. In one embodiment, the size of the semiconductor portion is reduced and a metal semiconductor alloy portion is formed on the semiconductor portion by metallization. In a first electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the metal semiconductor alloy portion and the metal gate portion. In another embodiment, two disjoined metal semiconductor alloy portions are formed on the semiconductor portion. In a second electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the two previously disjoined metal semiconductor alloy portions.
摘要翻译： 金属层和半导体层顺序地沉积在基板上。 半导体层和金属层被光刻图案化以形成半导体部分和金属栅极部分的堆叠，其优选地与至少一个金属栅极叠层的形成同时进行。 在一个实施例中，半导体部分的尺寸减小，并且金属半导体合金部分通过金属化形成在半导体部分上。 在由此形成的第一电反熔丝中，金属半导体合金部分可以电铸以在金属半导体合金部分和金属栅极部分之间形成短路。 在另一个实施例中，在半导体部分上形成两个非接合的金属半导体合金部分。 在由此形成的第二电反熔丝中，金属半导体合金部分可以被电铸以在两个先前接合的金属半导体合金部分之间形成短路。
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公开(公告)号：US20090141533A1
公开(公告)日：2009-06-04
申请号：US11946938
申请日：2007-11-29
申请人： Deok-kee Kim , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran , Kenneth J. Stein
发明人： Deok-kee Kim , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran , Kenneth J. Stein
IPC分类号： G11C17/08 , H01L27/20 , H01L21/768
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： A metal layer and a semiconductor layer are sequentially deposited on a substrate. The semiconductor layer and the metal layer are lithographically patterned to form a stack of a semiconductor portion and a metal gate portion, which is preferably performed concurrently with formation of at least one metal gate stack. In one embodiment, the size of the semiconductor portion is reduced and a metal semiconductor alloy portion is formed on the semiconductor portion by metallization. In a first electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the metal semiconductor alloy portion and the metal gate portion. In another embodiment, two disjoined metal semiconductor alloy portions are formed on the semiconductor portion. In a second electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the two previously disjoined metal semiconductor alloy portions.
摘要翻译： 金属层和半导体层顺序地沉积在基板上。 半导体层和金属层被光刻图案化以形成半导体部分和金属栅极部分的堆叠，其优选地与至少一个金属栅极叠层的形成同时进行。 在一个实施例中，半导体部分的尺寸减小，并且金属半导体合金部分通过金属化形成在半导体部分上。 在由此形成的第一电反熔丝中，金属半导体合金部分可以电铸以在金属半导体合金部分和金属栅极部分之间形成短路。 在另一个实施例中，在半导体部分上形成两个非接合的金属半导体合金部分。 在由此形成的第二电反熔丝中，金属半导体合金部分可以被电铸以在两个先前接合的金属半导体合金部分之间形成短路。
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5.发明授权Electrically programmable fuse using anisometric contacts and fabrication method 有权电子可编程保险丝采用不规则接触和制造方法公开(公告)号：US08629049B2
公开(公告)日：2014-01-14
申请号：US13420724
申请日：2012-03-15
IPC分类号： H01L21/44
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： A fabrication method for fabricating an electrically programmable fuse method includes depositing a polysilicon layer on a substrate, patterning an anode contact region, a cathode contact region and a fuse link conductively connecting the cathode contact region with the anode contact region, which is programmable by applying a programming current, depositing a silicide layer on the polysilicon layer, and forming a plurality of anisometric contacts on the silicide layer of the cathode contact region and the anode contact region in a predetermined configuration, respectively.
摘要翻译： 制造电可编程熔丝法的制造方法包括在衬底上沉积多晶硅层，图案化阳极接触区域，阴极接触区域和将阴极接触区域与阳极接触区域导电连接的熔断体，其可通过应用 编程电流，在多晶硅层上沉积硅化物层，以及在预定构型中分别在阴极接触区域和阳极接触区域的硅化物层上形成多个不规则接触。
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6.发明申请SECURE ANTI-FUSE WITH LOW VOLTAGE PROGRAMMING THROUGH LOCALIZED DIFFUSION HEATING 失效通过局部扩散加热实现低电压编程的安全保险丝公开(公告)号：US20130063202A1
公开(公告)日：2013-03-14
申请号：US13612938
申请日：2012-09-13
IPC分类号： H01L23/544 , H01H37/76
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： An antifuse has first and second semiconductor regions having one conductivity type and a third semiconductor region therebetween having an opposite conductivity type. A conductive region contacting the first region has a long dimension in a second direction transverse to the direction of a long dimension of a gate. An antifuse anode is spaced apart from the first region in the second direction and a contact is connected with the second region. Applying a programming voltage between the anode and the contact with gate bias sufficient to fully turn on field effect transistor operation of the antifuse heats the first region to drive a dopant outwardly, causing an edge of the first region to move closer to an edge of the second region and reduce electrical resistance between the first and second regions by an one or more orders of magnitude.
摘要翻译： 反熔丝具有一个导电类型的第一和第二半导体区域和它们之间具有相反导电类型的第三半导体区域。 接触第一区域的导电区域在横向于栅极的长尺寸方向的第二方向上具有长尺寸。 反熔丝阳极在第二方向上与第一区域间隔开，并且触点与第二区域连接。 在阳极和接触之间施加编程电压，栅极偏压足以完全导通反熔丝的场效应晶体管操作加热第一区域以向外驱动掺杂剂，导致第一区域的边缘更接近于 并且将第一和第二区域之间的电阻降低一个或多个数量级。
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7.发明授权Electrically programmable fuse using anisometric contacts and fabrication method 有权电子可编程保险丝采用不规则接触和制造方法公开(公告)号：US08519507B2
公开(公告)日：2013-08-27
申请号：US12493616
申请日：2009-06-29
IPC分类号： H01L23/52
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： An electrically programmable fuse that includes an anode contact region and a cathode contact region are formed of a polysilicon layer having a silicide layer formed thereon, and a fuse link conductively connecting the cathode contact region with the anode contact region, which is programmable by applying a programming current, and a plurality of anisometric contacts formed on the silicide layer of the cathode contact region or on both the silicide layer of the cathode contact region and the anode contact region in a predetermined configuration, respectively.
摘要翻译： 包括阳极接触区域和阴极接触区域的电可编程熔丝由其上形成有硅化物层的多晶硅层和导电连接阴极接触区域与阳极接触区域的熔丝链形成，该熔丝链可通过应用 编程电流，以及分别形成在阴极接触区域的硅化物层上或在阴极接触区域和阳极接触区域的硅化物层上以预定构造形成的多个不规则接触。
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8.发明授权Secure anti-fuse with low voltage programming through localized diffusion heating 有权通过局部扩散加热，通过低电压编程实现安全的反熔丝公开(公告)号：US08350264B2
公开(公告)日：2013-01-08
申请号：US12835764
申请日：2010-07-14
IPC分类号： H01L29/04
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： An antifuse is provided having a unitary monocrystalline semiconductor body including first and second semiconductor regions each having the same first conductivity type, and a third semiconductor region between the first and second semiconductor regions which has a second conductivity type opposite from the first conductivity type. An anode and a cathode can be electrically connected with the first semiconductor region. A conductive region including a metal, a conductive compound of a metal or an alloy of a metal can contact the first semiconductor region and extend between the cathode and the anode. The antifuse can further include a contact electrically connected with the second semiconductor region. In this way, the antifuse can be configured such that the application of a programming voltage between the anode and the cathode heats the first semiconductor region sufficiently to reach a temperature which drives a dopant outwardly therefrom, causing an edge of the first semiconductor region to move closer to an adjacent edge of the second semiconductor region, thus permanently reducing electrical resistance between the first and second semiconductor regions by one or more orders of magnitude.
摘要翻译： 提供一种具有单一单晶半导体本体的反熔丝，该单体半导体本体包括具有相同的第一导电类型的第一和第二半导体区域以及具有与第一导电类型相反的第二导电类型的第一和第二半导体区域之间的第三半导体区域。 阳极和阴极可以与第一半导体区域电连接。 包括金属，金属的导电化合物或金属的合金的导电区域可以接触第一半导体区域并在阴极和阳极之间延伸。 反熔丝还可以包括与第二半导体区域电连接的触点。 以这种方式，反熔丝可被配置为使得在阳极和阴极之间施加编程电压将第一半导体区域充分加热以达到从其向外驱动掺杂剂的温度，从而使第一半导体区域的边缘移动 更靠近第二半导体区域的相邻边缘，从而将第一和第二半导体区域之间的电阻永久地减小一个或多个数量级。
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9.发明授权Secure anti-fuse with low voltage programming through localized diffusion heating 失效通过局部扩散加热，通过低电压编程实现安全的反熔丝公开(公告)号：US08569755B2
公开(公告)日：2013-10-29
申请号：US13612938
申请日：2012-09-13
IPC分类号： H01L29/04
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： An antifuse has first and second semiconductor regions having one conductivity type and a third semiconductor region therebetween having an opposite conductivity type. A conductive region contacting the first region has a long dimension in a second direction transverse to the direction of a long dimension of a gate. An antifuse anode is spaced apart from the first region in the second direction and a contact is connected with the second region. Applying a programming voltage between the anode and the contact with gate bias sufficient to fully turn on field effect transistor operation of the antifuse heats the first region to drive a dopant outwardly, causing an edge of the first region to move closer to an edge of the second region and reduce electrical resistance between the first and second regions by an one or more orders of magnitude.
摘要翻译： 反熔丝具有一个导电类型的第一和第二半导体区域和它们之间具有相反导电类型的第三半导体区域。 接触第一区域的导电区域在横向于栅极的长尺寸方向的第二方向上具有长尺寸。 反熔丝阳极在第二方向上与第一区域间隔开，并且触点与第二区域连接。 在阳极和接触之间施加编程电压，栅极偏压足以完全导通反熔丝的场效应晶体管操作加热第一区域以向外驱动掺杂剂，导致第一区域的边缘更接近于 并且将第一和第二区域之间的电阻降低一个或多个数量级。
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10.发明申请ELECTRICALLY PROGRAMMABLE FUSE USING ANISOMETRIC CONTACTS AND FABRICATION METHOD 有权电气可编程保险丝使用异构联系和制造方法公开(公告)号：US20120171857A1
公开(公告)日：2012-07-05
申请号：US13420724
申请日：2012-03-15
IPC分类号： H01L21/768
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： A fabrication method for fabricating an electrically programmable fuse method includes depositing a polysilicon layer on a substrate, patterning an anode contact region, a cathode contact region and a fuse link conductively connecting the cathode contact region with the anode contact region, which is programmable by applying a programming current, depositing a silicide layer on the polysilicon layer, and forming a plurality of anisometric contacts on the silicide layer of the cathode contact region and the anode contact region in a predetermined configuration, respectively.
摘要翻译： 制造电可编程熔丝法的制造方法包括在衬底上沉积多晶硅层，图案化阳极接触区域，阴极接触区域和将阴极接触区域与阳极接触区域导电连接的熔断体，其可通过应用 编程电流，在多晶硅层上沉积硅化物层，以及在预定构型中分别在阴极接触区域和阳极接触区域的硅化物层上形成多个不规则接触。
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