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    Package for optical components
    1.
    发明授权
    Package for optical components 有权
    光学元件封装

    公开(公告)号：US06664511B2

    公开(公告)日：2003-12-16

    申请号：US10281876

    申请日：2002-10-28

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam ,  Kenzo Ishida

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam ,  Kenzo Ishida

    IPC分类号： H05B100

    CPC分类号： G02B6/30 ,  G02B6/1203 ,  G02B6/36

    摘要： A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

    摘要翻译： 用于光学部件的封装包括封装光学部件的内部封装以及封装内部封装的外部封装。 加热器可以在靠近光学部件的内部包装件中设置以控制其温度，并且为了保持该温度控制，外部包装围绕内部包装形成隔离的空气袋，其将内部包装与外部环境热绝缘。 外包装由具有低导热性的材料形成，以促进该绝缘功能。 如果光学部件包括平面光波电路（PLC），例如， 阵列波导光栅（AWG），其需要严格的温度控制和结构完整性来维持光路的完整性。

    Redundant package for optical components
    2.
    发明授权
    Redundant package for optical components 有权
    用于光学元件的冗余封装

    公开(公告)号：US06486440B1

    公开(公告)日：2002-11-26

    申请号：US09901474

    申请日：2001-07-09

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam

    IPC分类号： H05B100

    CPC分类号： G02B6/30 ,  G02B6/1203 ,  G02B6/36

    摘要： A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

    摘要翻译： 用于光学部件的冗余封装包括封装光学部件的内部封装以及封装内部封装的外部封装。 加热器可以靠近光学部件设置在内部包装件中以控制其温度，并且为了保持该温度控制，外部包装围绕内部包装形成隔离的空气袋，其将内部包装与外部环境绝热。 外包装由具有低导热性的材料形成，以促进该绝缘功能。 如果光学组件包括平面光波电路（PLC），例如阵列波导光栅（AWG），则该封装是特别有用的，其需要严格的温度控制和结构完整性来维持光路的完整性。

    Planar lightwave circuit package
    4.
    发明授权
    Planar lightwave circuit package 失效
    平面光波电路封装

    公开(公告)号：US06945708B2

    公开(公告)日：2005-09-20

    申请号：US10368195

    申请日：2003-02-18

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    IPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/122 ,  G02B6/34 ,  H01S5/022

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

    摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

    摘要翻译： 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。

    Planar lightwave circuit package
    5.
    发明授权
    Planar lightwave circuit package 有权
    平面光波电路封装

    公开(公告)号：US07203390B2

    公开(公告)日：2007-04-10

    申请号：US11200696

    申请日：2005-08-10

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

    摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

    摘要翻译： 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。