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23 条记录 (耗时 0.029 秒)

    Redundant package for optical components
    1.
    发明授权
    Redundant package for optical components 有权
    用于光学元件的冗余封装

    公开(公告)号：US06486440B1

    公开(公告)日：2002-11-26

    申请号：US09901474

    申请日：2001-07-09

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam

    IPC分类号： H05B100

    CPC分类号： G02B6/30 ,  G02B6/1203 ,  G02B6/36

    摘要： A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

    摘要翻译： 用于光学部件的冗余封装包括封装光学部件的内部封装以及封装内部封装的外部封装。 加热器可以靠近光学部件设置在内部包装件中以控制其温度，并且为了保持该温度控制，外部包装围绕内部包装形成隔离的空气袋，其将内部包装与外部环境绝热。 外包装由具有低导热性的材料形成，以促进该绝缘功能。 如果光学组件包括平面光波电路（PLC），例如阵列波导光栅（AWG），则该封装是特别有用的，其需要严格的温度控制和结构完整性来维持光路的完整性。

    Package for optical components
    3.
    发明授权
    Package for optical components 有权
    光学元件封装

    公开(公告)号：US06664511B2

    公开(公告)日：2003-12-16

    申请号：US10281876

    申请日：2002-10-28

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam ,  Kenzo Ishida

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam ,  Kenzo Ishida

    IPC分类号： H05B100

    CPC分类号： G02B6/30 ,  G02B6/1203 ,  G02B6/36

    摘要： A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

    摘要翻译： 用于光学部件的封装包括封装光学部件的内部封装以及封装内部封装的外部封装。 加热器可以在靠近光学部件的内部包装件中设置以控制其温度，并且为了保持该温度控制，外部包装围绕内部包装形成隔离的空气袋，其将内部包装与外部环境热绝缘。 外包装由具有低导热性的材料形成，以促进该绝缘功能。 如果光学部件包括平面光波电路（PLC），例如， 阵列波导光栅（AWG），其需要严格的温度控制和结构完整性来维持光路的完整性。

    Planar lightwave circuit package
    4.
    发明授权
    Planar lightwave circuit package 有权
    平面光波电路封装

    公开(公告)号：US07203390B2

    公开(公告)日：2007-04-10

    申请号：US11200696

    申请日：2005-08-10

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

    摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

    摘要翻译： 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。

    Planar lightwave circuit package
    5.
    发明授权
    Planar lightwave circuit package 失效
    平面光波电路封装

    公开(公告)号：US06945708B2

    公开(公告)日：2005-09-20

    申请号：US10368195

    申请日：2003-02-18

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    IPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/122 ,  G02B6/34 ,  H01S5/022

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

    摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

    摘要翻译： 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。

    Transfer molded packages with embedded thermal insulation
    6.
    发明授权
    Transfer molded packages with embedded thermal insulation 有权
    具有嵌入式保温的转移成型包装

    公开(公告)号：US06606425B1

    公开(公告)日：2003-08-12

    申请号：US10100277

    申请日：2002-03-18

    申请人： Douglas E. Crafts ,  Kenzo Ishida ,  David J. Chapman ,  Duane Cook ,  James F. Farrell ,  Suresh Ramalingam ,  Steven M. Swain

    发明人： Douglas E. Crafts ,  Kenzo Ishida ,  David J. Chapman ,  Duane Cook ,  James F. Farrell ,  Suresh Ramalingam ,  Steven M. Swain

    IPC分类号： G02B612

    CPC分类号： G02B6/12026 ,  G02B6/4253 ,  G02B6/4273

    摘要： An optical component package, in which a transfer molded layer of material (e.g., syntactic foam in one embodiment) is formed at least partially around, or entirely around, the optical component to provide structural and thermal insulation around the component. The optical component may be a planar lightwave circuit (PLC), with a protective passivation layer formed between the PLC and the layer of syntactic foam, to de-couple stresses and thermal transfer between the PLC and the layer of syntactic foam. Strengthening caps, fiber assemblies, and a heater may be provided with the PLC assembly, around which the layer of syntactic foam can also be formed. The protective passivation layer can also be formed between these structures and the syntactic foam; in one embodiment between at least two strengthening caps formed on opposing edges of the PLC. The disclosed package provides numerous structural, thermal and size benefits.

    摘要翻译： 一种光学部件封装，其中材料的转移模制层（例如，一个实施例中的复合泡沫）至少部分地围绕或完全围绕光学部件形成，以在部件周围提供结构和隔热。 光学部件可以是平面光波电路（PLC），在PLC和复合泡沫层之间形成保护钝化层，以解除PLC和复合泡沫层之间的应力和热传递。 可以提供加强盖，纤维组件和加热器，PLC组件也可以形成层压泡沫层。 保护钝化层也可以在这些结构和复合泡沫之间形成; 在一个实施例中，在形成在PLC的相对边缘上的至少两个加强盖之间。 所公开的封装提供了许多结构，热和尺寸的优点。

    Scanning spectrometer with multiple photodetectors
    8.
    发明授权
    Scanning spectrometer with multiple photodetectors 有权
    具有多个光电探测器的扫描光谱仪

    公开(公告)号：US07852475B2

    公开(公告)日：2010-12-14

    申请号：US12189993

    申请日：2008-08-12

    申请人： Douglas E. Crafts ,  Jinxi Shen ,  Philip Duggan ,  James F. Farrell ,  Barthelemy Fondeur ,  Eliseo Ranalli

    发明人： Douglas E. Crafts ,  Jinxi Shen ,  Philip Duggan ,  James F. Farrell ,  Barthelemy Fondeur ,  Eliseo Ranalli

    IPC分类号： G01J3/28

    CPC分类号： G01J3/2803 ,  G01J3/18 ,  G02B6/12019

    摘要： A scanning optical spectrometer with a detector array is disclosed, in which position of focused spot of light at the input of a dispersive element such as arrayed waveguide grating (AWG) with a slab input, is scanned using a micro-electro-mechanical (MEMS) tiltable micromirror so as to make the dispersed spectrum of light scan over the detector array coupled to the AWG. Sub-spectra recorded using individual detectors are concatenated by a processor unit to obtain the spectrum of input light.

    摘要翻译： 公开了一种具有检测器阵列的扫描光谱仪，其中使用微机电（MEMS）扫描在诸如具有板输入的阵列波导光栅（AWG）等分散元件的输入处的聚焦光点的位置 ）可倾斜微镜，以便使光的分散光谱扫描耦合到AWG的检测器阵列。 使用各个检测器记录的子光谱由处理器单元连接以获得输入光的光谱。

    Scanning Spectrometer With Multiple Photodetectors
    10.
    发明申请
    Scanning Spectrometer With Multiple Photodetectors 有权
    具有多个光电探测器的扫描光谱仪

    公开(公告)号：US20090046288A1

    公开(公告)日：2009-02-19

    申请号：US12189993

    申请日：2008-08-12

    申请人： Douglas E. Crafts ,  Jinxi Shen ,  Philip Duggan ,  James F. Farrell ,  Barthelemy Fondeur ,  Eliseo Ranalli

    发明人： Douglas E. Crafts ,  Jinxi Shen ,  Philip Duggan ,  James F. Farrell ,  Barthelemy Fondeur ,  Eliseo Ranalli

    IPC分类号： G01J3/28

    CPC分类号： G01J3/2803 ,  G01J3/18 ,  G02B6/12019

    摘要： A scanning optical spectrometer with a detector array is disclosed, in which position of focused spot of light at the input of a dispersive element such as arrayed waveguide grating (AWG) with a slab input, is scanned using a micro-electro-mechanical (MEMS) tiltable micromirror so as to make the dispersed spectrum of light scan over the detector array coupled to the AWG. Sub-spectra recorded using individual detectors are concatenated by a processor unit to obtain the spectrum of input light.

    摘要翻译： 公开了一种具有检测器阵列的扫描光谱仪，其中使用微机电（MEMS）扫描在诸如具有板输入的阵列波导光栅（AWG）等分散元件的输入处的聚焦光点的位置 ）可倾斜微镜，以便使光的分散光谱扫描耦合到AWG的检测器阵列。 使用各个检测器记录的子光谱由处理器单元连接以获得输入光的光谱。