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1.发明授权公开(公告)号：US08170724B2
公开(公告)日：2012-05-01
申请号：US12029124
申请日：2008-02-11
IPC分类号： G05D23/00
CPC分类号： H05K7/20836 , H05K7/20736 , H05K7/20781 , H05K7/2079
摘要： Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.
摘要翻译： 本文公开了用于冷却计算机部件的计算机系统和相关方法。 计算机系统的一个实施例包括具有与空气出口间隔开的空气入口的计算机机柜。 计算机系统还包括位于计算机机柜中的热交换器，以及与热交换器流体连通的散热系统。 计算机系统还包括至少一个用于监测计算机机柜和房间之间的热传递的传感器。 所述计算机系统还包括可操作地耦合到所述至少一个传感器的控制系统，所述控制系统包括计算机可读介质，所述计算机可读介质保持用于基于来自所述传感器的信息来确定所述计算机机柜和房间之间的热传递是否平衡的指令， 如果没有，调整参数以平衡传热。
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2.发明授权公开(公告)号：US09420729B2
公开(公告)日：2016-08-16
申请号：US13438735
申请日：2012-04-03
CPC分类号： H05K7/20836 , H05K7/20736 , H05K7/20781 , H05K7/2079
摘要： Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.
摘要翻译： 本文公开了用于冷却计算机部件的计算机系统和相关方法。 计算机系统的一个实施例包括具有与空气出口间隔开的空气入口的计算机机柜。 计算机系统还包括位于计算机机柜中的热交换器，以及与热交换器流体连通的散热系统。 计算机系统还包括至少一个用于监测计算机机柜和房间之间的热传递的传感器。 所述计算机系统还包括可操作地耦合到所述至少一个传感器的控制系统，所述控制系统包括计算机可读介质，所述计算机可读介质保持用于基于来自所述传感器的信息确定所述计算机机柜与所述房间之间的热传递是否平衡的指令，以及 如果没有，调整参数以平衡传热。
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公开(公告)号：US20090201644A1
公开(公告)日：2009-08-13
申请号：US12029124
申请日：2008-02-11
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20736 , H05K7/20781 , H05K7/2079
摘要： Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.
摘要翻译： 本文公开了用于冷却计算机部件的计算机系统和相关方法。 计算机系统的一个实施例包括具有与空气出口间隔开的空气入口的计算机机柜。 计算机系统还包括位于计算机机柜中的热交换器，以及与热交换器流体连通的散热系统。 计算机系统还包括至少一个用于监测计算机机柜和房间之间的热传递的传感器。 所述计算机系统还包括可操作地耦合到所述至少一个传感器的控制系统，所述控制系统包括计算机可读介质，所述计算机可读介质保持用于基于来自所述传感器的信息来确定所述计算机机柜和房间之间的热传递是否平衡的指令， 如果没有，调整参数以平衡传热。
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4.发明授权公开(公告)号：US07330350B2
公开(公告)日：2008-02-12
申请号：US10862031
申请日：2004-06-04
IPC分类号： G06F1/20
CPC分类号： H05K7/20836 , G06F1/20
摘要： Systems and methods for cooling computer components in large computer systems are disclosed herein. In one embodiment, a computer system configured in accordance with aspects of the invention can include a computer module positioned in a chassis, and an air mover configured to move air through the chassis and past the computer module. The computer system can further include a pressure sensor operably coupled to the air mover. If the pressure sensor determines that the difference between a first air pressure inside the chassis and a second air pressure outside the chassis is less than a preselected pressure, the air mover can increase the flow of air through the chassis and past the computer module.
摘要翻译： 本文公开了用于冷却大型计算机系统中的计算机组件的系统和方法。 在一个实施例中，根据本发明的方面配置的计算机系统可以包括定位在底盘中的计算机模块和构造成使空气移动通过机架并经过计算机模块的空气推动器。 计算机系统还可以包括可操作地联接到空气推进器的压力传感器。 如果压力传感器确定底盘内的第一空气压力与底盘外部的第二空气压力之间的差小于预选压力，则空气推动器可以增加通过底盘并经过计算机模块的空气流。
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5.发明申请公开(公告)号：US20120188706A1
公开(公告)日：2012-07-26
申请号：US13438735
申请日：2012-04-03
IPC分类号： G06F1/20
CPC分类号： H05K7/20836 , H05K7/20736 , H05K7/20781 , H05K7/2079
摘要： Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.
摘要翻译： 本文公开了用于冷却计算机部件的计算机系统和相关方法。 计算机系统的一个实施例包括具有与空气出口间隔开的空气入口的计算机机柜。 计算机系统还包括位于计算机机柜中的热交换器，以及与热交换器流体连通的散热系统。 计算机系统还包括至少一个用于监测计算机机柜和房间之间的热传递的传感器。 所述计算机系统还包括可操作地耦合到所述至少一个传感器的控制系统，所述控制系统包括计算机可读介质，所述计算机可读介质保持用于基于来自所述传感器的信息来确定所述计算机机柜和房间之间的热传递是否平衡的指令， 如果没有，调整参数以平衡传热。
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公开(公告)号：US07362571B2
公开(公告)日：2008-04-22
申请号：US11227832
申请日：2005-09-15
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： Flow conditioners for use with air inlets on computer cabinets are disclosed herein. In one embodiment, a large computer system includes a plurality of computer cabinets arranged in close proximity to each other. Each of the computer cabinets can include a fan, impellor, or other air mover positioned proximate to an inlet that receives cooling air from a plenum, such as a floor plenum. In this embodiment, a flow conditioner configured in accordance with the present invention can be positioned proximate to the air inlet. The flow conditioner can include a vortex diffuser and a flow-speed normalizer. The flow-speed normalizer can include a perforated screen that forms a cylinder around the inlet, and the vortex diffuser can include one or more vanes that extend across the cylinder adjacent to the inlet.
摘要翻译： 本文公开了与计算机机壳上的进气口一起使用的流动调节器。 在一个实施例中，大型计算机系统包括彼此靠近地布置的多个计算机机柜。 每个计算机机柜可以包括位于靠近入口的风扇，叶轮或其它空气推动器，所述入口接收来自诸如地板增压室的增压室的冷却空气。 在该实施例中，根据本发明构造的流动调节器可以靠近进气口定位。 流动调节器可以包括涡流扩散器和流速归一化器。 流速归一化器可以包括围绕入口形成圆柱体的穿孔筛，并且涡流扩散器可以包括一个或多个延伸穿过邻近入口的圆柱体的叶片。
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公开(公告)号：US06700070B1
公开(公告)日：2004-03-02
申请号：US09705369
申请日：2000-11-03
IPC分类号： H05K100
CPC分类号： H05K1/0266 , H05K1/0269 , H05K1/0393 , H05K3/0008 , H05K3/0052 , H05K3/0097 , H05K3/243 , H05K3/365 , H05K3/4007 , H05K2201/0367 , H05K2201/0373 , H05K2201/09063 , H05K2201/09781 , H05K2201/09918 , H05K2203/166 , H05K2203/167
摘要： The field of the manufacture of electronic components, specifically to manufacturing flexible conductive strips having contact pads thereon, wherein a first set of alignment marks are provided on a substrate. Using the first set of alignment marks, several electronic components are formed in selected positions on the substrate. The electronic components may be formed in various groups, with a first group being formed using a first mask then, subsequent groups being formed using subsequent masks. Each of the respective masks are aligned with the first set of alignment marks in order to position the electronic components formed using the masks at the desired locations on the substrate. A second set of alignment marks are produced using the same mask as a set of electronic components that are located on the substrate. Subsequently, when a different set of features is produced, it is positioned using the second set of alignment marks located on the individual parts. Thus, tolerances can be achieved that would normally be possible only in the manufacture of individual parts, while still obtaining the advantages of the economies of scale possible by making many parts on a large sheet.
摘要翻译： 电子部件的制造领域，特别是制造其上具有接触焊盘的柔性导电条，其中第一组对准标记设置在基板上。 使用第一组对准标记，在基板上的选定位置形成几个电子部件。 电子部件可以形成为各种组，第一组使用第一掩模形成，然后使用后续掩模形成随后的组。 各个掩模中的每一个对准第一组对准标记，以便将使用掩模形成的电子部件定位在基板上的所需位置。第二组对准标记使用与一组电子装置相同的掩模 位于基板上的部件。 随后，当产生不同的特征集合时，使用位于各个部件上的第二组对准标记进行定位。 因此，可以实现通常仅在制造单个零件时可以实现的公差，同时通过在许多部件上制作大尺寸片而获得规模经济的优点。
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公开(公告)号：US06641406B1
公开(公告)日：2003-11-04
申请号：US09705368
申请日：2000-11-03
IPC分类号： H01R1200
CPC分类号： H01R12/62 , H05K1/11 , H05K3/243 , H05K3/28 , H05K3/365 , H05K3/4007 , H05K3/42 , H05K2201/0367 , H05K2201/0373 , H05K2201/0949
摘要： The flexible connector for high density circuit applications comprises a multilayer flexible substrate upon which are formed a plurality of contact pads, in a density required by a particular application. This density may exceed two hundred contact pads per square inch. Contact pads of similar size and configuration are formed on the surface of another device, i.e., circuit board, and provision made to align the contact pads of the connector with those of the circuit board. Micro-pads are formed on the surface of the contact pads on the connector such, that when the connector is brought into contact with the circuit board, and sufficient pressure is applied, the micro-pads make actual electrical contact with the pads of the circuit board. Since the total surface area in contact, namely the sum of the surface areas of the micro-pads, is a small fraction of the total area of the connector, a large pressure is provided at the electrical contact interface even when low pressure is provided to the connector as a whole.
摘要翻译： 用于高密度电路应用的柔性连接器包括多层柔性基板，其上形成有特定应用所需的密度的多个接触焊盘。 该密度可能超过每平方英寸200个接触垫。 具有相似尺寸和构造的接触垫形成在另一装置即电路板的表面上，并且使连接器的接触垫与电路板的接触垫对齐。 微焊盘形成在连接器上的接触焊盘的表面上，即当连接器与电路板接触并施加足够的压力时，微焊盘与电路板的实际电接触 板。 由于接触的总表面积，即微焊盘的表面积的总和，是连接器总面积的一小部分，所以即使在提供低压时也在电接触界面处提供大的压力 连接器作为一个整体。
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公开(公告)号：US06336816B1
公开(公告)日：2002-01-08
申请号：US09619566
申请日：2000-07-19
IPC分类号： H01R1200
CPC分类号： H01R12/7005 , H01R12/714 , H01R12/721 , H01R12/79 , H05K3/365
摘要： A method and apparatus for coupling electrical connectors to a printed circuit board. The first and second clamp member are held in an open position with electrical connectors therebetween. While in the open position, the clamp is positioned over a printed circuit board, with the first and second clamp members aligned for connection to the circuit board. The clamp is then partially closed, to a preloaded position which aligns the electrodes in the clamping assembly with the electrodes on the circuit board. After the initial alignment has occurred, the clamp is firmly fastened to the printed circuit board, to electrically couple the electrodes of the connectors and the clamp to the electrodes on the printed circuit board.
摘要翻译： 一种用于将电连接器耦合到印刷电路板的方法和装置。 第一和第二夹紧构件保持在打开位置，其间具有电连接器。 当处于打开位置时，夹具定位在印刷电路板上方，其中第一和第二夹紧构件对准以连接到电路板。 然后将夹具部分地封闭到预加载位置，其将夹紧组件中的电极与电路板上的电极对准。 在初始对准发生后，夹具牢固地固定在印刷电路板上，将连接器的电极和夹具电连接到印刷电路板上的电极上。
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公开(公告)号：US06514088B1
公开(公告)日：2003-02-04
申请号：US09705366
申请日：2000-11-03
IPC分类号： H01R1200
CPC分类号： H01R13/2414
摘要： A uniform pressure pad formed of a resilient material having a plurality of uniform pressure areas formed between a row and column array of cavities formed in the pad thickness. The cavities surrounding the pressure areas allow the resilient pad material to flow evenly thereby providing uniformity in the pressure applied to each pressure area.
摘要翻译： 由弹性材料形成的均匀的压力垫，其具有形成在衬垫厚度形成的空腔的行和列阵列之间形成的多个均匀的压力区域。 围绕压力区域的空腔允许弹性垫材料均匀流动，从而提供施加到每个压力区域的压力的均匀性。
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