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公开(公告)号:US10354900B2
公开(公告)日:2019-07-16
申请号:US15356869
申请日:2016-11-21
Applicant: Ebara Corporation
Inventor: Akihiro Yazawa , Kenichi Kobayashi , Takahiro Nanjo , Hiroyuki Takenaka
IPC: H01L21/677 , H01L21/67 , H01L21/687
Abstract: Disclosed is a substrate transfer apparatus including: a pair of hands facing with each other; an opening/closing mechanism configured to move the pair of hands symmetrically in an opening/closing direction; a driving unit configured to transmit a power to the opening/closing mechanism; and a controller configured to control an operation of the driving unit. The opening/closing mechanism includes: a rotating body configured to rotate depending on a moving amount of the pair of hands in the opening/closing direction, and a sensor configured to detect a rotating amount of the rotating body. The controller controls an operation of the driving unit based on a signal from the sensor.
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公开(公告)号:US10525564B2
公开(公告)日:2020-01-07
申请号:US15248028
申请日:2016-08-26
Applicant: Ebara Corporation
Inventor: Kenichi Akazawa , Kenichi Kobayashi , Akihiro Yazawa , Manao Hoshina
Abstract: Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the substrate mounted on the first arm pair; and a rotating mechanism configured to rotate the first arm pair and the second arm pair around a predetermined axis that is set inside the first arm pair and the second arm pair and extends along an extension direction of the first arm pair and the second arm pair such that the substrate is reversed upside down.
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公开(公告)号:US10071458B2
公开(公告)日:2018-09-11
申请号:US15353913
申请日:2016-11-17
Applicant: Ebara Corporation
Inventor: Akihiro Yazawa , Kenichi Kobayashi
IPC: B24B49/16 , B24B9/00 , B24B37/005 , B24B9/06
CPC classification number: B24B37/005 , B24B9/065
Abstract: An object of the invention is to provide a calibration apparatus which enables the pressing force of the polishing pad to be adjusted by a simple method without the need of removing a stage on which a substrate can be placed. One embodiment of the invention provides a calibration apparatus for a bevel polishing system for polishing a bevel portion of a substrate, comprising: a load measuring device capable of measuring a pressing load from a polishing pad of the bevel polishing system; and a base plate capable of having the load measuring device placed thereon, wherein the base plate is capable of being fixed on a vacuum suction table which is capable of having a substrate placed thereon.
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公开(公告)号:US11890716B2
公开(公告)日:2024-02-06
申请号:US17117723
申请日:2020-12-10
Applicant: EBARA CORPORATION
Inventor: Akihiro Yazawa , Kenichi Kobayashi , Asagi Matsugu
IPC: B24B37/005 , B24B37/04 , B24B49/12
CPC classification number: B24B37/0053 , B24B37/04 , B24B49/12
Abstract: An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350, a top ring 302, a light emitting member 371, a slip-out detector 370, and an elimination mechanism 380. A polishing pad 352 that polishes a substrate WF is attached to the polishing table 350. The top ring 302 holds the substrate WF to press the substrate WF against the polishing pad 352. The light emitting member 371 emits a light to a detection area 372 on the polishing pad 352. The slip-out detector 370 detects a slip out of the substrate WF from the top ring 302 based on the light reflected from the detection area 372. The elimination mechanism 380 eliminates a polishing liquid flowing into the detection area 372.
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公开(公告)号:US12237194B2
公开(公告)日:2025-02-25
申请号:US17258916
申请日:2019-07-09
Applicant: EBARA CORPORATION
Inventor: Akihiro Yazawa , Takashi Koba , Kenichi Kobayashi , Kenichi Akazawa , Fong-Jie Du , Makoto Kashiwagi , Asagi Matsugu , Takahiro Nanjo , Hideharu Aoyama , Takashi Mitsuya , Tetsuji Togawa
IPC: B24B37/14 , B24B37/26 , B24B37/30 , B65G13/02 , H01L21/304 , H01L21/677 , B24B41/06 , B24B57/02 , B65G39/04 , H01L21/67
Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.
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公开(公告)号:US10508355B2
公开(公告)日:2019-12-17
申请号:US15661817
申请日:2017-07-27
Applicant: EBARA CORPORATION
Inventor: Akihiro Yazawa , Kenichi Kobayashi , Yasuyuki Miyasawa , Tsuyoshi Soma
Abstract: A plating apparatus enabling a user to conduct maintenance of a substrate holder while an operation of the plating apparatus is being performed is disclosed. The plating apparatus includes: a processing section for plating a substrate; a storage container configured to store the substrate holder for holding the substrate; a transport machine configured to transport the substrate holder between the processing section and the storage container; a maintenance area adjacent to the storage container; and a substrate-holder carrier supported by the storage container. The substrate-holder carrier is movable between the storage container and the maintenance area while supporting the substrate holder.
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公开(公告)号:US20170178940A1
公开(公告)日:2017-06-22
申请号:US15356869
申请日:2016-11-21
Applicant: Ebara Corporation
Inventor: Akihiro Yazawa , Kenichi Kobayashi , Takahiro Nanjo , Hiroyuki Takenaka
IPC: H01L21/677 , H01L21/67
CPC classification number: H01L21/67742 , H01L21/67173 , H01L21/67219 , H01L21/67259 , H01L21/68707
Abstract: Disclosed is a substrate transfer apparatus including: a pair of hands facing with each other; an opening/closing mechanism configured to move the pair of hands symmetrically in an opening/closing direction; a driving unit configured to transmit a power to the opening/closing mechanism; and a controller configured to control an operation of the driving unit. The opening/closing mechanism includes: a rotating body configured to rotate depending on a moving amount of the pair of hands in the opening/closing direction, and a sensor configured to detect a rotating amount of the rotating body. The controller controls an operation of the driving unit based on a signal from the sensor.
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公开(公告)号:US20220005716A1
公开(公告)日:2022-01-06
申请号:US17258916
申请日:2019-07-09
Applicant: EBARA CORPORATION
Inventor: Akihiro Yazawa , Takashi Koba , Kenichi Kobayashi , Kenichi Akazawa , Fong-Jie Du , Makoto Kashiwagi , Asagi Matsugu , Takahiro Nanjo , Hideharu Aoyama , Takashi Mitsuya , Tetsuji Togawa
IPC: H01L21/677 , B24B37/14 , B24B37/26 , H01L21/304 , B24B37/30 , B65G13/02
Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.
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9.
公开(公告)号:US10593570B2
公开(公告)日:2020-03-17
申请号:US15421905
申请日:2017-02-01
Applicant: Ebara Corporation
Inventor: Akihiro Yazawa , Kenichi Kobayashi , Kenichi Akazawa
IPC: H01L21/67 , H01L21/687 , B08B1/00 , B08B11/02
Abstract: According to the present disclosure, there is provided a substrate holding module that is capable of accommodating a substrate transferred by a transfer robot. The substrate holding module includes a pedestal including a holding mechanism configured to hold the substrate, a cover configured to cover the pedestal, and a moving mechanism configured to move the cover away from the pedestal.
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10.
公开(公告)号:US20170236727A1
公开(公告)日:2017-08-17
申请号:US15421905
申请日:2017-02-01
Applicant: Ebara Corporation
Inventor: Akihiro Yazawa , Kenichi Kobayashi , Kenichi Akazawa
Abstract: According to the present disclosure, there is provided a substrate holding module that is capable of accommodating a substrate transferred by a transfer robot. The substrate holding module includes a pedestal including a holding mechanism configured to hold the substrate, a cover configured to cover the pedestal, and a moving mechanism configured to move the cover away from the pedestal.
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