公开(公告)号：US10446422B2

公开(公告)日：2019-10-15

申请号：US15941760

申请日：2018-03-30

Applicant: EBARA CORPORATION

Inventor： Masayuki Fujiki ,  Hideharu Aoyama ,  Ryuya Koizumi

IPC: G06F3/0484 ,  H01L21/67 ,  C25D17/00 ,  G06F3/147 ,  G05B19/46 ,  C25D21/12 ,  G06T13/80

Abstract: A method is provided, the method including: repeatedly acquiring a state of one or more devices included in the semiconductor manufacturing apparatus; providing a first animation indicating an operation of the semiconductor manufacturing apparatus by displaying at least an image indicating the state of one or more devices on a display unit each time the state is acquired; storing, in a memory, the acquired state of one or more devices and a time related to the state; receiving an input for switching a display mode; and providing a second animation of the semiconductor manufacturing apparatus by displaying, one by one on the display unit, at least one or more images respectively indicating the state of one or more devices related to one or more times including a reference time stored in the memory, after receiving the input for switching a display mode.

公开(公告)号：US20220005716A1

公开(公告)日：2022-01-06

申请号：US17258916

申请日：2019-07-09

Applicant: EBARA CORPORATION

Inventor： Akihiro Yazawa ,  Takashi Koba ,  Kenichi Kobayashi ,  Kenichi Akazawa ,  Fong-Jie Du ,  Makoto Kashiwagi ,  Asagi Matsugu ,  Takahiro Nanjo ,  Hideharu Aoyama ,  Takashi Mitsuya ,  Tetsuji Togawa

IPC: H01L21/677 ,  B24B37/14 ,  B24B37/26 ,  H01L21/304 ,  B24B37/30 ,  B65G13/02

Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

公开(公告)号：US12237194B2

公开(公告)日：2025-02-25

申请号：US17258916

申请日：2019-07-09

Applicant: EBARA CORPORATION

Inventor： Akihiro Yazawa ,  Takashi Koba ,  Kenichi Kobayashi ,  Kenichi Akazawa ,  Fong-Jie Du ,  Makoto Kashiwagi ,  Asagi Matsugu ,  Takahiro Nanjo ,  Hideharu Aoyama ,  Takashi Mitsuya ,  Tetsuji Togawa

IPC: B24B37/14 ,  B24B37/26 ,  B24B37/30 ,  B65G13/02 ,  H01L21/304 ,  H01L21/677 ,  B24B41/06 ,  B24B57/02 ,  B65G39/04 ,  H01L21/67

Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

公开(公告)号：US11773504B2

公开(公告)日：2023-10-03

申请号：US17149691

申请日：2021-01-14

Applicant: EBARA CORPORATION

Inventor： Mitsuhiro Shamoto ,  Masashi Shimoyama ,  Tsutomu Nakada ,  Hideharu Aoyama ,  Masayuki Fujiki

IPC: C25D21/12 ,  C25D17/00 ,  G06F30/27 ,  C25D7/12 ,  G06F111/10

CPC classification number: C25D21/12 ,  C25D7/123 ,  C25D17/001 ,  G06F30/27 ,  G06F2111/10

Abstract: A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical analysis data storage unit that stores numerical analysis data in which each assumed condition is associated with the in-plane uniformity value for plural assumed conditions; a regression analysis unit that estimates a model that the in-plane uniformity value is an objective variable and variables of assumed conditions are explanatory variables by regression analysis based on the numerical analysis data; and an implement condition search unit that uses the estimated model to search for implement conditions that are recommended values of the assumed conditions related to the in-plane uniformity of the plating film formed in the electroplating treatment of the substrate to be plated.

公开(公告)号：US10577714B2

公开(公告)日：2020-03-03

申请号：US15486762

申请日：2017-04-13

Applicant: EBARA CORPORATION

Inventor： Yoshitaka Mukaiyama ,  Jumpei Fujikata ,  Hideharu Aoyama

IPC: C25D17/28 ,  C25D17/00 ,  C25D17/06 ,  C25D3/38 ,  C25D7/12

Abstract: There are provided a plating apparatus and a plating method enabling continuous operation even while a stocker is taken out of the plating apparatus. The plating apparatus includes a plating treatment section performing plating on a substrate and a plurality of stockers configured to be able to store a holder configured to hold a substrate or an anode. At least one of the plurality of stockers is configured to be movable into and out of the plating apparatus.