Jig for a polishing apparatus
    2.
    发明授权

    公开(公告)号:US11305399B2

    公开(公告)日:2022-04-19

    申请号:US16530175

    申请日:2019-08-02

    Abstract: Provided is a jig for assisting the dismounting and mounting of a top ring.
    One embodiment provides a jig for mounting/dismounting at least a part of the top ring for holding a substrate. The jig comprises a movable plate for supporting at least a part of the top ring, which is in a dismounted state, a plurality of posts for positioning the jig at a predetermined position relative to the top ring, the plurality of posts being configured to be engaged with the top ring, and a drive mechanism for moving the movable plate in a direction toward and away from the top ring.

    Polishing unit, substrate processing apparatus, and polishing method

    公开(公告)号:US11890716B2

    公开(公告)日:2024-02-06

    申请号:US17117723

    申请日:2020-12-10

    CPC classification number: B24B37/0053 B24B37/04 B24B49/12

    Abstract: An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350, a top ring 302, a light emitting member 371, a slip-out detector 370, and an elimination mechanism 380. A polishing pad 352 that polishes a substrate WF is attached to the polishing table 350. The top ring 302 holds the substrate WF to press the substrate WF against the polishing pad 352. The light emitting member 371 emits a light to a detection area 372 on the polishing pad 352. The slip-out detector 370 detects a slip out of the substrate WF from the top ring 302 based on the light reflected from the detection area 372. The elimination mechanism 380 eliminates a polishing liquid flowing into the detection area 372.

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