公开(公告)号：US11891715B2

公开(公告)日：2024-02-06

申请号：US17177500

申请日：2021-02-17

Applicant: EBARA CORPORATION

Inventor： Yasuyuki Masuda ,  Shao Hua Chang ,  Yoshitaka Mukaiyama ,  Masashi Shimoyama ,  Jumpei Fujikata

IPC: C25D17/02 ,  C25D21/10 ,  B33Y80/00 ,  B33Y50/02 ,  B33Y10/00

CPC classification number: C25D21/10 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y80/00 ,  C25D17/02

Abstract: A paddle capable of reducing an influence of blocking the electric field and capable of improving its mechanical strength is disclosed. The paddle, which is configured to agitate a processing liquid in a processing tank by moving in the processing tank, includes a plurality of agitating beams that form a honeycomb structure. The honeycomb structure has a plurality of hexagonal through-holes formed by the plurality of agitating beams.

公开(公告)号：US10577714B2

公开(公告)日：2020-03-03

申请号：US15486762

申请日：2017-04-13

Applicant: EBARA CORPORATION

Inventor： Yoshitaka Mukaiyama ,  Jumpei Fujikata ,  Hideharu Aoyama

IPC: C25D17/28 ,  C25D17/00 ,  C25D17/06 ,  C25D3/38 ,  C25D7/12

Abstract: There are provided a plating apparatus and a plating method enabling continuous operation even while a stocker is taken out of the plating apparatus. The plating apparatus includes a plating treatment section performing plating on a substrate and a plurality of stockers configured to be able to store a holder configured to hold a substrate or an anode. At least one of the plurality of stockers is configured to be movable into and out of the plating apparatus.

公开(公告)号：US20210262111A1

公开(公告)日：2021-08-26

申请号：US17177500

申请日：2021-02-17

Applicant: EBARA CORPORATION

Inventor： Yasuyuki Masuda ,  Shao Hua Chang ,  Yoshitaka Mukaiyama ,  Masashi Shimoyama ,  Jumpei Fujikata

IPC: C25D21/10 ,  C25D17/02 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A paddle capable of reducing an influence of blocking the electric field and capable of improving its mechanical strength is disclosed. The paddle, which is configured to agitate a processing liquid in a processing tank by moving in the processing tank, includes a plurality of agitating beams that form a honeycomb structure. The honeycomb structure has a plurality of hexagonal through-holes formed by the plurality of agitating beams.

公开(公告)号：US09714476B2

公开(公告)日：2017-07-25

申请号：US14596540

申请日：2015-01-14

Applicant: EBARA CORPORATION

Inventor： Junichiro Yoshioka ,  Yoshitaka Mukaiyama

IPC: C25D17/06 ,  C25D17/00 ,  H01L21/687

CPC classification number: C25D17/001 ,  C25D17/06 ,  H01L21/68721

Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

公开(公告)号：US11384447B2

公开(公告)日：2022-07-12

申请号：US16330717

申请日：2017-09-07

Applicant: EBARA CORPORATION

Inventor： Matsutaro Miyamoto ,  Yoshitaka Mukaiyama

IPC: H01L21/687 ,  C25D17/06

Abstract: Provided is a substrate holder including a first holding member and a second holding member configured to sandwich and fix a substrate, wherein the first holding member includes a first holding member body, and a clamp provided on the first holding member body, the clamp being rotatable about a shaft extending parallel to a surface of the first holding member body, or being reciprocable in a direction intersecting with the surface of the first holding member body, the second holding member includes a second holding member body, and the clamp is capable of engaging with the second holding member in a state where the first holding member body and the second holding member body are brought into contact with each other, to fix the second holding member to the first holding member.

公开(公告)号：US11047063B2

公开(公告)日：2021-06-29

申请号：US16373456

申请日：2019-04-02

Applicant: EBARA CORPORATION

Inventor： Jumpei Fujikata ,  Masashi Shimoyama ,  Yoichi Nakagawa ,  Yoshitaka Mukaiyama ,  Yoshio Minami

IPC: C25D17/00 ,  C25D5/02 ,  C25D17/06 ,  C25D17/10

Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.

公开(公告)号：US10665495B2

公开(公告)日：2020-05-26

申请号：US15851655

申请日：2017-12-21

Applicant: EBARA CORPORATION

Inventor： Toshio Yokoyama ,  Yoshitaka Mukaiyama ,  Takuya Tsushima

IPC: H01L21/687 ,  C25D17/00 ,  C25D17/06

Abstract: A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device comprising a first holder retainer configured to hold the first retaining member in a first posture; and a second holder retainer configured to be movable in a linear manner toward and away from the first holder retainer, capable of holding the second retaining member in the first posture and a second posture which is substantially orthogonal to the first posture, configured to push the second retaining member against the first retaining member in the first posture to lock the first and second retaining members to each other.

公开(公告)号：US12226825B2

公开(公告)日：2025-02-18

申请号：US18248091

申请日：2021-09-14

Applicant: EBARA CORPORATION

Inventor： Hiroyuki Shinozaki ,  Junki Asai ,  Yoshitaka Mukaiyama

IPC: B33Y30/00 ,  B22F10/28 ,  B22F10/322 ,  B22F12/00 ,  B22F12/70

Abstract: The present invention constructs, in an AM system, such an environment that fine particles are prevented from scattering from an area where the fine particles such as a powder material can be present to another area. According to one aspect, an AM system configured to manufacture a fabrication object is provided. This AM system includes a fabrication chamber in which an AM apparatus is disposed, and a buffer chamber in communication with the fabrication chamber. The buffer chamber includes an entrance in communication with a surrounding environment, an exit in communication with the fabrication chamber, a grating floor, and an exhaust port. The AM system further includes a first gate configured to be able to open and close the entrance of the buffer chamber, and a second gate configured to be able to open and close the exit of the buffer chamber.

公开(公告)号：US11015261B2

公开(公告)日：2021-05-25

申请号：US16084948

申请日：2017-03-07

Applicant: EBARA CORPORATION

Inventor： Yoshitaka Mukaiyama ,  Toshio Yokoyama ,  Junitsu Yamakawa ,  Takuya Tsushima ,  Tomonori Hirao ,  Sho Tamura ,  Hirotaka Ohashi

IPC: C25D17/06 ,  C25D17/08 ,  C25D17/00 ,  C25D7/12 ,  H01L21/67 ,  B65G49/02 ,  H01L21/683 ,  H05K3/18 ,  B65G47/52 ,  C25D5/34 ,  H05K1/02

Abstract: To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.

公开(公告)号：US10294578B2

公开(公告)日：2019-05-21

申请号：US14919002

申请日：2015-10-21

Applicant: EBARA CORPORATION

Inventor： Jumpei Fujikata ,  Masashi Shimoyama ,  Yoichi Nakagawa ,  Yoshitaka Mukaiyama ,  Yoshio Minami

IPC: C25D5/02 ,  C25D17/00 ,  C25D17/06 ,  C25D17/10

Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.