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    ULTRASONIC IMAGING DEVICE WITH PROGRAMMABLE ANATOMY AND FLOW IMAGING
    3.
    发明申请
    ULTRASONIC IMAGING DEVICE WITH PROGRAMMABLE ANATOMY AND FLOW IMAGING 有权

    公开(公告)号：US20210278530A1

    公开(公告)日：2021-09-09

    申请号：US17153631

    申请日：2021-01-20

    申请人： EXO IMAGING, INC.

    发明人： Yusuf Haque ,  Sandeep Akkaraju ,  Janusz Bryzek ,  Brian Bircumshaw

    IPC分类号： G01S15/89 ,  G01N29/24 ,  A61B8/00

    摘要： An imaging device includes a transducer that includes an array of piezoelectric elements formed on a substrate. Each piezoelectric element includes at least one membrane suspended from the substrate, at least one bottom electrode disposed on the membrane, at least one piezoelectric layer disposed on the bottom electrode, and at least one top electrode disposed on the at least one piezoelectric layer. Adjacent piezoelectric elements are configured to be isolated acoustically from each other. The device is utilized to measure flow or flow along with imaging anatomy.

    Multi-transducer chip ultrasound device
    8.
    发明授权
    Multi-transducer chip ultrasound device 有权

    公开(公告)号：US12099150B2

    公开(公告)日：2024-09-24

    申请号：US17511245

    申请日：2021-10-26

    申请人： Exo Imaging, Inc.

    发明人： Liang Wang ,  Yusuf Haque ,  Janusz Bryzek

    IPC分类号： B06B1/00 ,  B81B7/00 ,  G01S7/52 ,  G01S15/89

    CPC分类号： G01S7/52079 ,  B81B7/008 ,  G01S7/5205 ,  G01S15/8925 ,  B81B2201/0271

    摘要： An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each transducer chip may comprise a microelectromechanical systems (MEMS) component that may include a plurality of ultrasound elements closely packed with one another, an Application-Specific Integrated Circuit (ASIC) that may be operatively coupled to the plurality of ultrasound elements of said MEMS component, and a control unit that may be electrically coupled to each ASIC of the plurality of transducer chips for control thereof. In some embodiments, at least two transducer chips of the plurality of transducer chips may be placed on the circuitry substrate with a separation distance that may be less than an operational wavelength of the ultrasound elements of the MEMS components of said at least two transducer chips.