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公开(公告)号:US11180853B2
公开(公告)日:2021-11-23
申请号:US16559251
申请日:2019-09-03
Applicant: Ebara Corporation
Inventor: Yu Ishii , Fong-Jie Du , Makoto Kashiwagi
IPC: H01L21/68 , C23C16/458 , C23C16/52 , B24B21/00 , B24B9/06 , B24B37/30 , B24B37/005
Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.
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公开(公告)号:US11331768B2
公开(公告)日:2022-05-17
申请号:US16222779
申请日:2018-12-17
Applicant: EBARA CORPORATION
Inventor: Makoto Kashiwagi , Fong-Jie Du , Manao Hoshina
Abstract: A polishing head having a simple construction and a compact size is disclosed. The polishing head includes: a polishing-tool pressing member for supporting a polishing tool; a movable shaft coupled to the polishing-tool pressing member; a housing which houses the movable shaft therein; and a diaphragm which forms a pressure chamber between an end portion of the movable shaft and the housing, the diaphragm including a central portion in contact with the end portion of the movable shaft, an inner wall portion connecting with the central portion and extending along a side surface of the movable shaft, a folded-back portion connecting with the inner wall portion and having a curved cross section, and an outer wall portion connecting with the folded-back portion and located outside the inner wall portion.
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公开(公告)号:US20220005716A1
公开(公告)日:2022-01-06
申请号:US17258916
申请日:2019-07-09
Applicant: EBARA CORPORATION
Inventor: Akihiro Yazawa , Takashi Koba , Kenichi Kobayashi , Kenichi Akazawa , Fong-Jie Du , Makoto Kashiwagi , Asagi Matsugu , Takahiro Nanjo , Hideharu Aoyama , Takashi Mitsuya , Tetsuji Togawa
IPC: H01L21/677 , B24B37/14 , B24B37/26 , H01L21/304 , B24B37/30 , B65G13/02
Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.
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公开(公告)号:US12237194B2
公开(公告)日:2025-02-25
申请号:US17258916
申请日:2019-07-09
Applicant: EBARA CORPORATION
Inventor: Akihiro Yazawa , Takashi Koba , Kenichi Kobayashi , Kenichi Akazawa , Fong-Jie Du , Makoto Kashiwagi , Asagi Matsugu , Takahiro Nanjo , Hideharu Aoyama , Takashi Mitsuya , Tetsuji Togawa
IPC: B24B37/14 , B24B37/26 , B24B37/30 , B65G13/02 , H01L21/304 , H01L21/677 , B24B41/06 , B24B57/02 , B65G39/04 , H01L21/67
Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.
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公开(公告)号:US10458020B2
公开(公告)日:2019-10-29
申请号:US15095330
申请日:2016-04-11
Applicant: Ebara Corporation
Inventor: Yu Ishii , Fong-Jie Du , Makoto Kashiwagi
IPC: H01L21/68 , B24B9/06 , C23C16/458 , C23C16/52 , B24B21/00 , B24B37/30 , B24B37/005
Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.
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