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    Process for interfacial adhesion in laminate structures through patterned roughing of a surface
    1.
    发明授权
    Process for interfacial adhesion in laminate structures through patterned roughing of a surface 有权
    通过图案化粗糙化表面的层压结构中的界面粘合方法

    公开(公告)号：US07972965B2

    公开(公告)日：2011-07-05

    申请号：US11862706

    申请日：2007-09-27

    申请人： Edward C. Cooney, III ,  Vincent McGahay ,  Thomas M. Shaw ,  Anthony K. Stamper ,  Matthew E. Colburn

    发明人： Edward C. Cooney, III ,  Vincent McGahay ,  Thomas M. Shaw ,  Anthony K. Stamper ,  Matthew E. Colburn

    IPC分类号： H01L21/311

    CPC分类号： H01L21/76829 ,  H01L21/31144 ,  H01L21/76828 ,  H01L21/78

    摘要： The present invention relates to a process for improved interfacial adhesion of dielectrics using patterned roughing. Improved adhesion strength between layers and substrates can be achieved through increasing the roughness of the interface between the materials. Roughness may including any disturbance of an otherwise generally smooth surface, such as grooves, indents, holes, trenches, and/or the like. Roughing on the interface may be achieved by depositing a material on a surface of the substrate to act as a mask and then using an etching process to induce the roughness. The material, acting as a mask, allows etching to occur on a fine, or sub-miniature, scale below the Scale achieved with a conventional photo mask and lithography to achieve the required pattern roughing. Another material is then deposited on the roughened surface of the substrate, filling in the roughing and adhering to the substrate.

    摘要翻译： 本发明涉及使用图案化粗糙化改善电介质的界面粘附的方法。 可以通过增加材料之间的界面的粗糙度来实现层和基底之间的改善的粘附强度。 粗糙度可能包括任何干扰通常平滑的表面，如凹槽，凹痕，孔，沟槽等。 可以通过在衬底的表面上沉积材料作为掩模，然后使用蚀刻工艺来引起粗糙度来实现界面上的粗加工。 用作掩模的材料允许蚀刻在以常规光掩模和光刻实现的规模以下的精细或次微小尺度上发生，以实现所需的图案粗糙化。 然后将另一种材料沉积在基底的粗糙表面上，填充粗加工并粘附到基底上。

    Process for interfacial adhesion in laminate structures through patterned roughing of a surface
    2.
    发明授权
    Process for interfacial adhesion in laminate structures through patterned roughing of a surface 失效
    通过图案化粗糙化表面的层压结构中的界面粘合方法

    公开(公告)号：US07303994B2

    公开(公告)日：2007-12-04

    申请号：US10710034

    申请日：2004-06-14

    申请人： Edward C. Cooney, III ,  Vincent McGahay ,  Thomas M Shaw ,  Anthony K. Stamper ,  Matthew E. Colburn

    发明人： Edward C. Cooney, III ,  Vincent McGahay ,  Thomas M Shaw ,  Anthony K. Stamper ,  Matthew E. Colburn

    IPC分类号： H01L21/302

    CPC分类号： H01L21/76829 ,  H01L21/31144 ,  H01L21/76828 ,  H01L21/78

    摘要： The present invention relates to a process for improved interfacial adhesion of dielectrics using patterned roughing. Improved adhesion strength between layers and substrates can be achieved through increasing the roughness of the interface between the materials. Roughness may including any disturbance of an otherwise generally smooth surface, such as grooves, indents, holes, trenches, and/or the like. Roughing on the interface may be achieved by depositing a material on a surface of the substrate to act as a mask and then using an etching process to induce the roughness. The material, acting as a mask, allows etching to occur on a fine, or sub-miniature, scale below the Scale achieved with a conventional photo mask and lithography to achieve the required pattern roughing. Another material is then deposited on the roughened surface of the substrate, filling in the roughing and adhering to the substrate.

    摘要翻译： 本发明涉及使用图案化粗糙化改善电介质的界面粘附的方法。 可以通过增加材料之间的界面的粗糙度来实现层和基底之间的改善的粘附强度。 粗糙度可能包括任何干扰通常平滑的表面，如凹槽，凹痕，孔，沟槽等。 可以通过在衬底的表面上沉积材料作为掩模，然后使用蚀刻工艺来引起粗糙度来实现界面上的粗加工。 用作掩模的材料允许蚀刻在以常规光掩模和光刻实现的规模以下的精细或次微小尺度上发生，以实现所需的图案粗糙化。 然后将另一种材料沉积在基底的粗糙表面上，填充粗加工并粘附到基底上。