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14 条记录 (耗时 0.023 秒)

    Multi-layered probes
    1.
    发明申请
    Multi-layered probes 审中-公开
    多层探针

    公开(公告)号：US20070200576A1

    公开(公告)日：2007-08-30

    申请号：US11703875

    申请日：2007-02-07

    申请人： Edward Laurent ,  Edward Malantonio ,  Richard Sadler ,  Bahadir Tunaboylu ,  Brian McHugh ,  Dov Chartarifsky

    发明人： Edward Laurent ,  Edward Malantonio ,  Richard Sadler ,  Bahadir Tunaboylu ,  Brian McHugh ,  Dov Chartarifsky

    IPC分类号： G01R31/02

    CPC分类号： G01R1/06733 ,  G01R1/06761 ,  G01R1/07342

    摘要： A probe for a probe card assembly is provided. The probe has a post structure supported by a substrate, a plurality of stacked beam elements disposed on the post structure, and a tip attached to a surface of a top beam element, of the plurality of stacked beam elements, that opposes the substrate. The tip is configured to be electrically connected to a semiconductor device to be tested. The probe may be bent so that the tip is further away from the substrate than the height the post structure. The effective maximum force exerted by the tips of a multi-beamed probe against, for example, DUT pads may be increased when compared to prior probes.

    摘要翻译： 提供探针卡组件的探头。 该探针具有由衬底支撑的柱结构，设置在柱结构上的多个堆叠的梁元件以及与该衬底相对的多个堆叠的梁元件的顶部梁元件的表面的尖端。 尖端构造成电连接到待测试的半导体器件。 探针可以被弯曲，使得尖端比柱结构的高度远离衬底。 当与以前的探针相比时，可以增加由多射束探针的尖端相对于例如DUT垫施加的有效最大力。

    Approach for fabricating cantilever probes
    2.
    发明申请
    Approach for fabricating cantilever probes 有权
    制造悬臂探头的方法

    公开(公告)号：US20070256299A1

    公开(公告)日：2007-11-08

    申请号：US11709547

    申请日：2007-02-21

    申请人： Dov Chartarifsky ,  Edward Laurent ,  Edward Malantonio ,  Richard Sadler ,  Bahadir Tunaboylu

    发明人： Dov Chartarifsky ,  Edward Laurent ,  Edward Malantonio ,  Richard Sadler ,  Bahadir Tunaboylu

    IPC分类号： H01R43/00 ,  G01R31/02

    CPC分类号： G01R3/00 ,  B33Y80/00 ,  G01R1/06727 ,  G01R1/07342 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222

    摘要： An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attaching the cantilever probe to a carrier structure by clamping the cantilever probe to the carrier structure, bonding the cantilever probe to the carrier structure via a post feature on the cantilever probe, or applying a material on the carrier structure and substantially around and in contact with the cantilever probe to affix the cantilever probe to the carrier structure. A probe tip can then be formed on the cantilever probe while the cantilever probe is attached or affixed to the carrier structure. The cantilever probe can then be removed and bonded to a probe substrate.

    摘要翻译： 提供了一种用于制造悬臂探针的方法。 该方法通常包括使用各种技术来以允许在悬臂探头上形成尖端的方式来固定悬臂探针。 例如，本发明的实施例包括通过将悬臂探头夹持到载体结构上来将悬臂式探针附接到载体结构，通过悬臂式探针上的柱特征将悬臂式探针结合到载体结构上，或将载体施加在载体上 结构并且基本上围绕并与悬臂探针接触以将悬臂探针固定到载体结构。 然后可以在悬臂探头上形成探针尖端，同时将悬臂探头附接或固定到载体结构上。 然后可以将悬臂探针去除并结合到探针基底上。

    Prefabricated and attached interconnect structure
    10.
    发明申请
    Prefabricated and attached interconnect structure 有权
    预制和连接的互连结构

    公开(公告)号：US20050052194A1

    公开(公告)日：2005-03-10

    申请号：US10964316

    申请日：2004-10-12

    申请人： January Kister ,  David Beatson ,  Edward Laurent

    发明人： January Kister ,  David Beatson ,  Edward Laurent

    IPC分类号： G01R1/073 ,  G01R31/02

    CPC分类号： G01R1/07357 ,  Y10T29/49117

    摘要： A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and separate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.

    摘要翻译： 互连组件具有冶金结合到更大结构的端子的预制互连结构。 互连结构的独立结构和较大结构的制造使得能够使用为微型钣金零件而众所周知的经济大规模制造技术。 在制造，定位和附接期间，每个互连结构与载体结构组合和/或保持在载体结构中，在附接到终端之后，载体结构被分离。 互连结构被配置成使得附接工具可以靠近互连结构和端子之间的连接接口，以便将粘合能量短暂且直接地传递到附接界面上。 连接接口提供了导电和弯曲应力，该互连结构与端子之间的机械连接相反。 互连组件优选地是探针装置的一部分。