摘要:
A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the damaged beam is removed from the probe card. The beam panel is aligned with the probe card. After the beam panel is aligned, the aligned beam panel is temporarily affixed to the probe card. After the beam panel is temporarily affixed to the probe card, the replacement beam is affixed at a location previously occupied by the damaged beam. After the replacement beam is affixed at the location, the beam panel is removed from the probe card.
摘要:
A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the damaged beam is removed from the probe card. The beam panel is aligned with the probe card. After the beam panel is aligned, the aligned beam panel is temporarily affixed to the probe card. After the beam panel is temporarily affixed to the probe card, the replacement beam is affixed at a location previously occupied by the damaged beam. After the replacement beam is affixed at the location, the beam panel is removed from the probe card.
摘要:
A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location for a probe is compared with the actual horizontal position for the probe to determine a horizontal correction distance and a horizontal correction direction to correct a horizontal alignment for the probe. A first tool automatically corrects the horizontal alignment for the probe based on the horizontal correction distance and the horizontal correction direction. Upon determining that an actual vertical position of the probe is closer to the probe card than a desired vertical position, a second tool automatically changes the actual vertical position of the probe to the desired vertical position. Upon determining that the actual vertical position of the probe is farther from the probe card than the desired vertical position, a third tool automatically changes the actual vertical position of the probe to the desired vertical position.
摘要:
An approach for fabricating cantilever probes for a probe card assembly includes forming posts on conductive traces on a substrate. A beam panel having beam elements formed therein is aligned to the substrate so that the beam elements are in contact with the plurality of posts. Each beam element is in contact with a post at a portion of the beam element so that both a first end portion and a second end portion overhang the post element. Each beam element is also attached to the beam panel by the first end portion. The beam elements are bonded to the plurality of posts. The first end portion of each beam element is cut, for example using an electrode, laser ablation or by dicing, to release the beam element from the beam panel. The beam panel is then removed, leaving the beam elements attached to the posts.
摘要:
A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location for a probe is compared with the actual horizontal position for the probe to determine a horizontal correction distance and a horizontal correction direction to correct a horizontal alignment for the probe. A first tool automatically corrects the horizontal alignment for the probe based on the horizontal correction distance and the horizontal correction direction. Upon determining that an actual vertical position of the probe is closer to the probe card than a desired vertical position, a second tool automatically changes the actual vertical position of the probe to the desired vertical position. Upon determining that the actual vertical position of the probe is farther from the probe card than the desired vertical position, a third tool automatically changes the actual vertical position of the probe to the desired vertical position.
摘要:
A method for fabricating beams for a probe card includes dividing a large beam panel into smaller sub-panels before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of beams to test several devices under test. The beam sub-panels may be aligned to the space transformer using alignment fiducials on the beam sub-panels that correspond to opposing alignment features formed in the space transformer or other substrate. Special tie-bars may be formed between: (1) rows, for example, of beams and the frame/frame splines (i.e., quadrant tie-bars); and (2) adjacent beams within any such rows on the beam panel (i.e., beam tie-bars). The approach may also include the use of tip tie-bars and/or tail tie-bars.
摘要:
A method for fabricating beams for a probe card includes dividing a large beam panel into smaller sub-panels before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of beams to test several devices under test. The beam sub-panels may be aligned to the space transformer using alignment fiducials on the beam sub-panels that correspond to opposing alignment features formed in the space transformer or other substrate. Special tie-bars may be formed between: (1) rows, for example, of beams and the frame/frame splines (i.e., quadrant tie-bars); and (2) adjacent beams within any such rows on the beam panel (i.e., beam tie-bars). The approach may also include the use of tip tie-bars and/or tail tie-bars.
摘要:
An approach for fabricating cantilever probes for a probe card assembly includes forming posts on conductive traces on a substrate. A beam panel having beam elements formed therein is aligned to the substrate so that the beam elements are in contact with the plurality of posts. Each beam element is in contact with a post at a portion of the beam element so that both a first end portion and a second end portion overhang the post element. Each beam element is also attached to the beam panel by the first end portion. The beam elements are bonded to the plurality of posts. The first end portion of each beam element is cut, for example using an electrode, laser ablation or by dicing, to release the beam element from the beam panel. The beam panel is then removed, leaving the beam elements attached to the posts.
摘要:
A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.
摘要:
An invisible indicia or encoded information is imprinted on a substrate using a compound which produces a fluorescence at a wavelength greater than about 650 nm when exposed to near infrared radiation. The information covered by a layer of material that reflects or absorbs a substantial amount of the visible and UV radiation illuminating its surface.