公开(公告)号：US20060050440A1

公开(公告)日：2006-03-09

申请号：US11046413

申请日：2005-01-28

申请人： Edward Pong Lee ,  David Seagle

发明人： Edward Pong Lee ,  David Seagle

IPC分类号： G11B5/147

CPC分类号： G11B5/584 ,  G11B5/00826 ,  G11B5/3116

摘要： The structure for a narrow pitch tape head array is disclosed. Narrow pitch is obtained by offsetting the location of the write gaps of successively stacked coplanar head arrays. A compact structure with lower fabrication cost is obtained by sharing magnetic pole layers between the stacked co-planar arrays.

公开(公告)号：US20050219748A1

公开(公告)日：2005-10-06

申请号：US10816062

申请日：2004-03-31

申请人： Hung-Chin Guthrie ,  Edward Pong Lee ,  Aron Pentek

发明人： Hung-Chin Guthrie ,  Edward Pong Lee ,  Aron Pentek

IPC分类号： G11B5/147 ,  G11B5/187 ,  G11B5/23 ,  G11B5/31

CPC分类号： G11B5/23 ,  G11B5/187 ,  G11B5/3116 ,  G11B5/313

摘要： A method for manufacturing an inductive write head having a metal write gap layer. The method reduces the number of necessary process steps and avoids corrosion of other write head elements such as magnetic back gap.

摘要翻译： 一种用于制造具有金属写入间隙层的电感写入头的方法。 该方法减少了必要的处理步骤的数量，并避免了其他写头元件（如磁背隙）的腐蚀。

公开(公告)号：US20050160586A1

公开(公告)日：2005-07-28

申请号：US11090087

申请日：2005-03-24

申请人： Ashok Lahiri ,  Edward Pong Lee ,  Eric Lee ,  Hong Xu

发明人： Ashok Lahiri ,  Edward Pong Lee ,  Eric Lee ,  Hong Xu

IPC分类号： G11B5/012 ,  G11B5/31 ,  G11B5/127 ,  G11B5/147

CPC分类号： G11B5/313 ,  G11B5/012 ,  G11B5/3116 ,  Y10T29/49032 ,  Y10T29/49041 ,  Y10T29/49043 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052

摘要： A thin film magnetic head that includes an improved P2 pole tip/yoke interface. The process for forming the P2 pole tip/yoke interface includes a CMP polishing step that is performed on the surface of the wafer subsequent to the plating of the P2 pole tip. This CMP step utilizes a relatively soft polishing pad and an acidic polishing slurry which preferentially attacks the P2 pole tip material, such that the CMP step results in the recession of the upper surface of the P2 pole tip relative to the dielectric layer surrounding it, as well as the significant rounding of the upper edges of the dielectric trench in which the P2 pole tip is formed. Thereafter, when the yoke is plated onto the P2 pole tip the rounded upper edges of the dielectric trench result in a concave curved interface between the yoke and the P2 pole tip.

摘要翻译： 一种薄膜磁头，包括改进的P 2极尖/磁轭接口。 用于形成P 2极尖/轭接口的工艺包括在P 2极尖的电镀之后在晶片的表面上执行的CMP抛光步骤。 该CMP步骤使用相对软的抛光垫和优先攻击P 2极尖材料的酸性抛光浆料，使得CMP步骤导致P 2极尖端的上表面相对于围绕其的介电层的凹陷 ，以及形成有P 2极尖的电介质沟槽的上边缘的显着的四舍五入。 此后，当轭被镀在P 2极尖上时，电介质沟槽的圆形上边缘导致轭和P 2极尖之间的凹形弯曲界面。

公开(公告)号：US20060099890A1

公开(公告)日：2006-05-11

申请号：US11313070

申请日：2005-12-20

申请人： Florence Eschbach ,  Eric Lee ,  Peter Powell Phipps ,  Amanda Baer ,  Edward Pong Lee ,  Francisco Martin

发明人： Florence Eschbach ,  Eric Lee ,  Peter Powell Phipps ,  Amanda Baer ,  Edward Pong Lee ,  Francisco Martin

IPC分类号： B24B7/30

CPC分类号： G11B5/1276 ,  B24B37/044 ,  C09G1/02 ,  Y10T29/49032 ,  Y10T29/49041 ,  Y10T29/49048

摘要： A method for simultaneously planarizing to relatively equal smoothness a thin film magnetic head hardbaked resist structure having relatively low surface energy and one or more additional thin film magnetic head structures containing other materials having comparatively higher surface energy, such as copper, hardbaked resist, alumina and NiFe. The method begins with preparation of a chemical mechanical polishing (CMP) slurry targeted at equaling the removal rate of the materials to be planarized. The CMP slurry includes a liquid vehicle, an abrasive, and a surfactant. The CMP slurry is applied to the surface of the structures to be planarized and the structures are simultaneously planarized using a CMP planarization technique.

公开(公告)号：US20050286169A1

公开(公告)日：2005-12-29

申请号：US10881196

申请日：2004-06-29

申请人： Amanda Baer ,  Tsung Chen ,  David Druist ,  Edward Pong Lee

发明人： Amanda Baer ,  Tsung Chen ,  David Druist ,  Edward Pong Lee

IPC分类号： G11B5/17 ,  G11B5/39

CPC分类号： G11B5/3967 ,  G11B5/17 ,  Y10T29/49034 ,  Y10T29/49041 ,  Y10T29/49043 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052

摘要： A slider is disclosed having a continuous coil including front coils, back coils, and a center tab, a write head including upper and lower poles which sandwich at least a portion of the front coils of the continuous coil, and at least one underpass lead, which passes under a portion of the back coils of the continuous coil to make electrical connection with the center tab of the continuous coil. Also disclosed are first and second variations of methods for fabricating the slider with underpass leads.

摘要翻译： 公开了一种具有包括前线圈，后线圈和中心突片的连续线圈的滑块，包括夹持连续线圈的前线圈的至少一部分的上极和下极的写头以及至少一个地下通道引线， 其在连续线圈的后线圈的一部分下方通过以与连续线圈的中心突片电连接。 还公开了用于制造具有底通道引线的滑块的方法的第一和第二变型。

公开(公告)号：US20050068665A1

公开(公告)日：2005-03-31

申请号：US10672896

申请日：2003-09-26

申请人： Quang Le ,  Edward Pong Lee ,  Jiu-Lung Li ,  Aron Pentek ,  Nian-Xiang Sun

发明人： Quang Le ,  Edward Pong Lee ,  Jiu-Lung Li ,  Aron Pentek ,  Nian-Xiang Sun

IPC分类号： G11B5/012 ,  G11B5/11 ,  G11B5/127 ,  G11B5/33

CPC分类号： G11B5/1278 ,  G11B5/112 ,  Y10T29/49021 ,  Y10T29/49032 ,  Y10T29/49041 ,  Y10T29/49043 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052 ,  Y10T29/49067

摘要： A method and materials to fabricate a trailing shield write pole that resolve the problems of controlling the write gap and preventing damages to the write gap or pole during fabrication of the subsequent structure. This process also introduces a CMP assisted lift-off process to remove re-deposition and fencing (increase yields) and a method to create dishing in the top of the write pole. Moreover, also included in this disclosure are suitable materials that can function as an ion mill transfer layer, CMP layer, and RIEable layer.

摘要翻译： 一种用于制造后屏蔽写入极的方法和材料，其解决了在后续结构的制造期间控制写入间隙并防止对写入间隙或极的损坏的问题。 该过程还引入CMP辅助剥离过程以去除再沉积和栅栏（增加产量）以及在写柱顶部产生凹陷的方法。 此外，本公开中还包括可用作离子磨转移层，CMP层和可分离层的合适材料。