摘要:
The present invention relates to liquid stable thiol-acrylate and thiol-vinyl ether compositions. More particularly, in accordance with some embodiments, the compositions may include a (meth)acrylate, a thiol component, an organic acid stabilizer, and a curing initiator. In other embodiments, the compositions may include a curable component selected from a (meth)acrylate, vinyl ether and/or alkenyl ether, a reactive diluent having vinyl ether and acrylate functionality, a thiol component and a stabilizer selected from an organic acid, a hemiacetal ester derivative of an organic acid and/or a phenol acetal.
摘要:
The present invention provides visible light curing systems, methods for reducing health risks to individuals exposed to radiation curing systems, methods for bonding substrates and visible light curing compositions.
摘要:
The present invention provides anaerobic adhesive compositions, reaction products of which demonstrate controlled-strength at ambient temperature conditions and enhanced resistance to thermal degradation at elevated temperature conditions. The compositions are (meth)acrylate- and/or polyorganosiloxane-based and may include one or more of a variety of other components, such as certain coreactants, a maleimide component, a diluent component reactive at elevated temperature conditions, mono- or poly-hydroxyalkane components, and other components.
摘要:
An adhesive composition capable of post-cure expansion comprising a multifunctional (meth)acrylate and a maleimide capable of effectuating expansion upon post-cure. A homogeneous mixture of a monomer and maleimide are subjected to a first cure heat stage wherein a rigid partially-cured plastic is formed and a post-cure heart stage to effectuate permanent expansion of the cured adhesive composition.
摘要:
The present invention provides visible light curing systems, methods for reducing health risks to individuals exposed to radiation curing systems, methods for bonding substrates and visible light curing compositions.
摘要:
This invention relates to (meth)acrylate based polymerizable compositions and multipart adhesive systems prepared therefrom, which include an aziridine-containing compound in a carrier material with which the aziridine-containing compound is unreactive. The inventive composition demonstrates a flash point above 140° F., desirably above 200° F., for each of the parts of the adhesive system. To achieve the physical properties of the inventive compositions and adhesive systems, it is desirable for the carrier material to have such flash points; however, provided that in their entirety the inventive compositions and adhesive systems have such flash points, it is not necessary for the carrier material itself to have such flash points. The inventive compositions and adhesive systems also include a package for controlling the rate of cure and indicating the extent of cure. The inventive compositions and adhesive systems are particularly well suited to bonding applications which involve at least one low energy bonding surface, for example, polyolefin, polyethylene, and polypropylene surfaces.
摘要:
The present invention is directed to (meth)acrylate compositions useful for bonding substrates including metals, plastics, and glass to similar or different substrates, in particular, low energy surfaces. The invention also provides an initiator system for (meth)acrylate based adhesives; a kit for bonding substrates, at least one of which includes a low energy surface; a resultant bonded assembly; and a method of bonding low energy substrates. A (meth)acrylate composition within the present invention includes a (meth)acrylate component and an initiator system including an organometallic compound, a peroxy compound, an aziridine functionalized compound, and a compound having an acid functional group.
摘要:
A curable composition, having utility for threadlocking engageable members of a threaded mechanical fastener, comprising: a reactive silicone (meth)acrylate emulsified in an aqueous medium, optionally further comprising a polymerizable non-silicone (meth)acrylate monomer or oligomer; and a microencapsulated peroxy initiator which is initiatingly effective for cure of the reactive silicone (meth)acrylate. The curable composition may be usefully employed for adhesively bonding engageable structural parts, by applying the aqueous emulsion of the reactive silicone (meth)acrylate, containing a microencapsulated peroxy initiator, to at least a portion of an engagement surface of a matable part which is matably engageable with a complimentary engagement structure, to yield an emulsion-coated engagement surface, drying the emulsion-coated engagement surface to form a dried coating thereon; and thereafter engaging the surface having the dried coating thereon, with the complimentary engagement structure, to release the microencapsulated peroxy initiator and bond the matable part and complimentary engagement structure.
摘要:
An adhesive composition capable of post-cure expansion comprising a multifunctional methacrylate and a maleimide capable of effectuating expansion upon post-cure. A homogeneous mixture of a monomer and maleimide are subjected to a first cure heat stage wherein a rigid partially-cured plastic is formed and a post-cure heat stage to effectuate permanent expansion of the cured adhesive composition.
摘要:
This invention relates to (meth)acrylate based polymerizable compositions and adhesive systems prepared therefrom, which include an initiator system comprising a complex of an organoborane with a complexing agent, an aziridine-containing compound, and a carrier material with which the initiator system is unreactive and which renders the composition having a flash point above 140° F. The inventive compositions desirably have a flash point above 200° F., for each of the parts of the adhesive system. To achieve the physical properties of the inventive compositions and adhesive systems, it is desirable for the carrier material to have such flash points; however, provided that in their entirety the inventive compositions and adhesive systems have such flash points, it is not necessary for the carrier material itself to have such flash points. The inventive compositions and adhesive systems also include a package for controlling the rate of cure and indicating the extent of cure. The inventive compositions and adhesive systems are particularly well suited to bonding applications which involve at least one low energy bonding surface, for example, polyolefin, polyethylene, and polypropylene surfaces.