摘要:
A sensor apparatus for an inkjet printing device is provided. The sensor apparatus may include 1) at least one print head adapted to deposit ink on a top surface of a substrate, wherein the substrate is in motion relative to the print head, 2) at least one sensor adapted to detect the distance of the at least one sensor from the top surface of the substrate, and 3) a controller adapted to determine the substrate to nozzle distance based on the distance of the sensor to the top surface of the substrate, and adjust the trajectory of the ink being deposited on the substrate based on the substrate to nozzle distance. Numerous other aspects are provided.
摘要:
Methods and apparatus for inkjet inkjet drop positioning are provided. A first method includes determining an intended deposition location of an ink drop on a substrate, depositing the ink drop on the substrate using an inkjet printing system, detecting a deposited location of the deposited ink drop on the substrate, comparing the deposited location to the intended location, determining a difference between the deposited location and the intended location, and compensating for the difference between the deposited location and the intended location by adjusting a parameter of an inkjet printing system. Numerous other aspects are provided.
摘要:
An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.
摘要:
A system and method for provisioning a virtual network is provided. Virtual networks can be automatically formed including switches in networks, such as local and private networks. Once the virtual networks are formed, virtual computing devices can be provisioned in place of physical computing devices that are connected to the switches. A system for provisioning a virtual network including a first virtual subnet and a second virtual subnet is provided. The system includes a first switch; a second switch; a first software process associated with first switch for provisioning the first virtual subnet; a second software process associated with the second switch for provisioning the second virtual subnet; and a communication link connecting the first switch and the second switch.
摘要:
A system and method for provisioning a virtual network is provided. Virtual networks can be automatically formed including switches in networks, such as local and private networks. Once the virtual networks are formed, virtual computing devices can be provisioned in place of physical computing devices that are connected to the switches. A system for provisioning a virtual network including a first virtual subnet and a second virtual subnet is provided. The system includes a first switch; a second switch; a first software process associated with first switch for provisioning the first virtual subnet; a second software process associated with the second switch for provisioning the second virtual subnet; and a communication link connecting the first switch and the second switch.
摘要:
A chair includes a base, a seat, a backrest pivotally connected to a rear end of a seat frame of the seat, and a transmission mechanism including a motor, a telescopic rod actuated by the motor to move in a retracting direction and an extending direction, and a transmission plate. A connecting rod is pivotally connected between a lower end of the backrest frame and the transmission plate. The telescopic rod is directed to a position below a central portion of the seat. The transmission plate is pivoted to the central portion of the seat, the second end of the connecting rod, and the telescopic rod at different portions thereof. When the telescopic rod is retracted, the top support portion of the transmission plate presses against the seat frame to make the rear end of the seat frame move upward and forward.
摘要:
A system and method for provisioning a virtual network is provided. Virtual networks can be automatically formed including switches in networks, such as local and private networks. Once the virtual networks are formed, virtual computing devices can be provisioned in place of physical computing devices that are connected to the switches. A system for provisioning a virtual network including a first virtual subnet and a second virtual subnet is provided. The system includes a first switch; a second switch; a first software process associated with first switch for provisioning the first virtual subnet; a second software process associated with the second switch for provisioning the second virtual subnet; and a communication link connecting the first switch and the second switch.
摘要:
An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.
摘要:
A crank for bicycles or other cycling facilities includes an elongate shank having an orifice formed in one end, and a chamber formed by an upper wall and a lower wall, a gasket is engaged into the chamber via the orifice of the shank. The gasket is engaged between the walls of the shank, and a fastener may be engaged through the orifice of the shank and may be engaged through a bore of the gasket. The shank includes an aperture having an inner diameter smaller than that of the orifice, a second gasket may be engaged into the chamber via the orifice of the shank and includes a bore aligned with the aperture of the shank.