ADAPTIVE CONTROL OF OPERATING AND BODY BIAS VOLTAGES
    1.
    发明申请
    ADAPTIVE CONTROL OF OPERATING AND BODY BIAS VOLTAGES 有权
    操作和体位偏置电压的自适应控制

    公开(公告)号:US20140013127A1

    公开(公告)日:2014-01-09

    申请号:US13731491

    申请日:2012-12-31

    IPC分类号: G06F1/26

    摘要: Adaptive control of operating and body bias voltages. In accordance with a first embodiment of the present invention, a desirable operating frequency for the microprocessor is determined. Information stored within and specific to the microprocessor is accessed. The information can comprise coefficients of a quadratic approximation of a frequency-voltage characteristic of the microprocessor for a set of body biasing conditions. An efficient voltage for operating the microprocessor at the desirable operating frequency is computed. The microprocessor is operated at the efficient voltage and the set of body biasing conditions.

    摘要翻译: 操作和体偏置电压的自适应控制。 根据本发明的第一实施例,确定微处理器的理想工作频率。 存储在微处理器内并专用于微处理器的信息被访问。 信息可以包括用于一组身体偏置条件的微处理器的频率 - 电压特性的二次近似的系数。 计算用于以期望的工作频率操作微处理器的有效电压。 微处理器在高效电压和身体偏置条件下运行。

    ADAPTIVE CONTROL OF OPERATING AND BODY BIAS VOLTAGES
    2.
    发明申请
    ADAPTIVE CONTROL OF OPERATING AND BODY BIAS VOLTAGES 有权
    操作和体位偏置电压的自适应控制

    公开(公告)号:US20100257389A1

    公开(公告)日:2010-10-07

    申请号:US12502902

    申请日:2009-07-14

    IPC分类号: G06F1/32 G06F1/26

    摘要: Adaptive control of operating and body bias voltages. In accordance with a first embodiment of the present invention, a desirable operating frequency for the microprocessor is determined. Information stored within and specific to the microprocessor is accessed. The information can comprise coefficients of a quadratic approximation of a frequency-voltage characteristic of the microprocessor for a set of body biasing conditions. An efficient voltage for operating the microprocessor at the desirable operating frequency is computed. The microprocessor is operated at the efficient voltage and the set of body biasing conditions.

    摘要翻译: 操作和体偏置电压的自适应控制。 根据本发明的第一实施例,确定微处理器的理想工作频率。 存储在微处理器内并专用于微处理器的信息被访问。 信息可以包括用于一组身体偏置条件的微处理器的频率 - 电压特性的二次近似的系数。 计算用于以期望的工作频率操作微处理器的有效电压。 微处理器在高效电压和身体偏置条件下运行。

    Adaptive control of operating and body bias voltages
    4.
    发明授权
    Adaptive control of operating and body bias voltages 有权
    操作和体偏置电压的自适应控制

    公开(公告)号:US07562233B1

    公开(公告)日:2009-07-14

    申请号:US10874772

    申请日:2004-06-22

    IPC分类号: G06F1/00 G06F1/32 H03K3/01

    摘要: Adaptive control of operating and body bias voltages. In accordance with a first embodiment of the present invention, a desirable operating frequency for the microprocessor is determined. Information stored within and specific to the microprocessor is accessed. The information can comprise coefficients of a quadratic approximation of a frequency-voltage characteristic of the microprocessor for a set of body biasing conditions. An efficient voltage for operating the microprocessor at the desirable operating frequency is computed. The microprocessor is operated at the efficient voltage and the set of body biasing conditions.

    摘要翻译: 操作和体偏置电压的自适应控制。 根据本发明的第一实施例,确定微处理器的理想工作频率。 存储在微处理器内并专用于微处理器的信息被访问。 信息可以包括用于一组身体偏置条件的微处理器的频率 - 电压特性的二次近似的系数。 计算用于以期望的工作频率操作微处理器的有效电压。 微处理器在高效电压和身体偏置条件下运行。

    System and method for reducing temperature variation during burn in
    5.
    发明授权
    System and method for reducing temperature variation during burn in 有权
    烧伤过程中降低温度变化的系统和方法

    公开(公告)号:US07248988B2

    公开(公告)日:2007-07-24

    申请号:US10791099

    申请日:2004-03-01

    IPC分类号: G06F15/00

    摘要: Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

    摘要翻译: 老化测试中降低温度变化的系统和方法。 在一个实施例中,测量被测集成电路消耗的功率。 测量与集成电路相关的环境温度。 通过调整集成电路的体偏置电压来实现集成电路的期望结温。 通过控制各个集成电路的温度,可以降低老化试验期间的温度变化。

    System and method for controlling temperature during burn-in
    6.
    发明授权
    System and method for controlling temperature during burn-in 有权
    老化期间控制温度的系统和方法

    公开(公告)号:US07463050B1

    公开(公告)日:2008-12-09

    申请号:US11139116

    申请日:2005-05-26

    IPC分类号: G01R31/26

    CPC分类号: G01R31/2879 G01R31/2817

    摘要: Systems and methods for reducing temperature dissipation during burn-in testing are described. Devices under test are each subject to a body bias voltage. The body bias voltage can be used to control junction temperature (e.g., temperature measured at the device under test). The body bias voltage applied to each device under test can be adjusted device-by-device to achieve essentially the same junction temperature at each device.

    摘要翻译: 描述了在老化测试期间降低温度耗散的系统和方法。 被测器件每个都受到体偏置电压的影响。 体偏置电压可用于控制结温(例如,在被测器件测量的温度)。 施加到每个待测器件的体偏置电压可以逐个设备调整,以在每个器件上达到基本上相同的结温。

    SYSTEM AND METHOD FOR REDUCING TEMPERATURE VARIATION DURING BURN IN
    8.
    发明申请
    SYSTEM AND METHOD FOR REDUCING TEMPERATURE VARIATION DURING BURN IN 审中-公开
    燃烧过程中降低温度变化的系统和方法

    公开(公告)号:US20090316750A1

    公开(公告)日:2009-12-24

    申请号:US12488379

    申请日:2009-06-19

    IPC分类号: G01K13/00

    摘要: Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

    摘要翻译: 老化测试中降低温度变化的系统和方法。 在一个实施例中,测量被测集成电路消耗的功率。 测量与集成电路相关的环境温度。 通过调整集成电路的体偏置电压来实现集成电路的期望结温。 通过控制各个集成电路的温度,可以降低老化试验期间的温度变化。

    System and method for reducing temperature variation during burn in
    10.
    发明授权
    System and method for reducing temperature variation during burn in 有权
    烧伤过程中降低温度变化的系统和方法

    公开(公告)号:US08843344B2

    公开(公告)日:2014-09-23

    申请号:US12506070

    申请日:2009-07-20

    IPC分类号: G01K1/08 G01K7/42 G01R31/28

    摘要: Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

    摘要翻译: 老化测试中降低温度变化的系统和方法。 在一个实施例中,测量被测集成电路消耗的功率。 测量与集成电路相关的环境温度。 通过调整集成电路的体偏置电压来实现集成电路的期望结温。 通过控制各个集成电路的温度,可以降低老化试验期间的温度变化。