利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.03 秒)

    ELECTRICAL DEVICE HAVING A LUBRICATED JOINT AND A METHOD FOR LUBRICATING SUCH A JOINT
    1.
    发明申请
    ELECTRICAL DEVICE HAVING A LUBRICATED JOINT AND A METHOD FOR LUBRICATING SUCH A JOINT 有权
    具有润滑接头的电气设备和用于润滑这种接头的方法

    公开(公告)号：US20090142942A1

    公开(公告)日：2009-06-04

    申请号：US12159326

    申请日：2006-12-11

    申请人： Eric Ochs ,  Ronny Ludwig ,  Florian Grabmaier ,  Stephan Henzler ,  Rainer Straub ,  Christian Voehringer ,  Patrick Wellner

    发明人： Eric Ochs ,  Ronny Ludwig ,  Florian Grabmaier ,  Stephan Henzler ,  Rainer Straub ,  Christian Voehringer ,  Patrick Wellner

    IPC分类号： H01R12/34 ,  B32B37/06

    CPC分类号： H05K3/306 ,  H01R4/024 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10977 ,  H05K2203/127

    摘要： An electrical device, particularly a control unit, having at least one joint having a first joining partner, especially a sleeve, and a second joining partner, especially a pin, the joint between the two joining partners having a junction ; at least at the junction an at least partially solidified lubricant being present. Furthermore, in a method for lubricating a joint of an electrical device, the joint having a first joining partner, particularly a sleeve, and a second joining partner, particularly a pin; in a step one of the joining partners being wetted with a lubricant, in a following step the joining partner wetted with the lubricant being joined to the other joining partner and the lubricant subsequently solidifying.

    摘要翻译： 一种具有至少一个接头的电气设备，特别是具有第一接合伙伴，特别是套筒的接头，以及具有连接点的两个连接件之间的接头，特别是销子， 至少在接合处存在至少部分固化的润滑剂。 此外，在一种用于润滑电气装置的接头的方法中，所述接头具有第一接合配合体，特别是套筒和第二接合配合体，特别是销; 在接合对象中的一个接合部件被润滑剂润湿的情况下，在接下来的步骤中，润滑剂润湿的接合部件被接合到另一接合部件，润滑剂随后固化。

    Micromechanical component having an anodically bonded cap and a manufacturing method
    6.
    发明申请
    Micromechanical component having an anodically bonded cap and a manufacturing method 失效
    具有阳极接合盖的微机械部件和制造方法

    公开(公告)号：US20070087465A1

    公开(公告)日：2007-04-19

    申请号：US11512647

    申请日：2006-08-29

    申请人： Heiko Stahl ,  Nicolaus Ulbrich ,  Rainer Straub

    发明人： Heiko Stahl ,  Nicolaus Ulbrich ,  Rainer Straub

    IPC分类号： H01L21/00 ,  H01L29/76 ,  H01L29/94 ,  H01L31/00

    CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0109

    摘要： A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the functional wafer. The cap wafer is joined at the glass substrate to the functional wafer by anodic bonding. The electrical contact surface is disposed on a side of the functional wafer facing the cap wafer, and the cap wafer has at least one recess, such that an access is provided to the electrical contact surface. A method for encapsulating a micromechanical component having a cap wafer, by anodically bonding the cap wafer to a functional wafer.

    摘要翻译： 微机械部件包括由至少第一硅衬底和薄玻璃衬底构成的盖晶片，并且具有由至少第二硅衬底构成的功能晶片，至少一个电接触表面设置在功能晶片上。 盖玻片通过阳极接合在玻璃基板上连接到功能晶片。 电接触表面设置在面向盖晶片的功能晶片的一侧，并且盖晶片具有至少一个凹部，使得向电接触表面提供通路。 一种用于封装具有盖晶片的微机械部件的方法，通过将盖晶片阳极结合到功能晶片。

    Micromechanical component having an anodically bonded cap and a manufacturing method
    8.
    发明授权
    Micromechanical component having an anodically bonded cap and a manufacturing method 失效
    具有阳极接合盖的微机械部件和制造方法

    公开(公告)号：US07436076B2

    公开(公告)日：2008-10-14

    申请号：US11512647

    申请日：2006-08-29

    申请人： Heiko Stahl ,  Nicolaus Ulbrich ,  Rainer Straub

    发明人： Heiko Stahl ,  Nicolaus Ulbrich ,  Rainer Straub

    IPC分类号： H01L23/29 ,  H01L23/58 ,  H01L23/28

    CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0109

    摘要： A micromechanical component includes a cap wafer made up of at least a first silicon substrate and a thin glass substrate, and having a functional wafer made up of at least a second silicon substrate, at least one electrical contact surface being disposed on the functional wafer. the cap wafer is joined at the glass substrate to the functional wafer by anodic bonding. the electrical contact surface is disposed on a side of the functional wafer facing the cap wafer, and the cap wafer has at least one recess, such that an access is provided to the electrical contact surface. A method for encapsulating a micromechanical component having a cap wafer, by anodically bonding the cap wafer to a functional wafer.

    摘要翻译： 微机械部件包括由至少第一硅衬底和薄玻璃衬底构成的盖晶片，并且具有由至少第二硅衬底构成的功能晶片，至少一个电接触表面设置在功能晶片上。 盖玻片通过阳极接合在玻璃基板上连接到功能晶片。 电接触表面设置在面向盖晶片的功能晶片的一侧，并且盖晶片具有至少一个凹部，使得对电接触表面提供通路。 一种用于封装具有盖晶片的微机械部件的方法，通过将盖晶片阳极结合到功能晶片。