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    ELECTRICAL DEVICE HAVING A LUBRICATED JOINT AND A METHOD FOR LUBRICATING SUCH A JOINT
    1.
    发明申请
    ELECTRICAL DEVICE HAVING A LUBRICATED JOINT AND A METHOD FOR LUBRICATING SUCH A JOINT 有权
    具有润滑接头的电气设备和用于润滑这种接头的方法

    公开(公告)号：US20090142942A1

    公开(公告)日：2009-06-04

    申请号：US12159326

    申请日：2006-12-11

    申请人： Eric Ochs ,  Ronny Ludwig ,  Florian Grabmaier ,  Stephan Henzler ,  Rainer Straub ,  Christian Voehringer ,  Patrick Wellner

    发明人： Eric Ochs ,  Ronny Ludwig ,  Florian Grabmaier ,  Stephan Henzler ,  Rainer Straub ,  Christian Voehringer ,  Patrick Wellner

    IPC分类号： H01R12/34 ,  B32B37/06

    CPC分类号： H05K3/306 ,  H01R4/024 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10977 ,  H05K2203/127

    摘要： An electrical device, particularly a control unit, having at least one joint having a first joining partner, especially a sleeve, and a second joining partner, especially a pin, the joint between the two joining partners having a junction ; at least at the junction an at least partially solidified lubricant being present. Furthermore, in a method for lubricating a joint of an electrical device, the joint having a first joining partner, particularly a sleeve, and a second joining partner, particularly a pin; in a step one of the joining partners being wetted with a lubricant, in a following step the joining partner wetted with the lubricant being joined to the other joining partner and the lubricant subsequently solidifying.

    摘要翻译： 一种具有至少一个接头的电气设备，特别是具有第一接合伙伴，特别是套筒的接头，以及具有连接点的两个连接件之间的接头，特别是销子， 至少在接合处存在至少部分固化的润滑剂。 此外，在一种用于润滑电气装置的接头的方法中，所述接头具有第一接合配合体，特别是套筒和第二接合配合体，特别是销; 在接合对象中的一个接合部件被润滑剂润湿的情况下，在接下来的步骤中，润滑剂润湿的接合部件被接合到另一接合部件，润滑剂随后固化。

    Microphone package and method for manufacturing same
    5.
    发明授权
    Microphone package and method for manufacturing same 有权
    麦克风包装及其制造方法

    公开(公告)号：US08705776B2

    公开(公告)日：2014-04-22

    申请号：US13306017

    申请日：2011-11-29

    申请人： Michael Knauss ,  Scott Naugle ,  Andy Doller ,  Eric Ochs

    发明人： Michael Knauss ,  Scott Naugle ,  Andy Doller ,  Eric Ochs

    IPC分类号： H04R1/02 ,  H04R19/00 ,  H04R19/04 ,  H04R1/28

    CPC分类号： H04R19/005 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/086 ,  H04R1/2807 ,  H04R1/406 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A System and method to provide a cost-effective implementation of a microphone package, very good microphone performance being achieved even with a high degree of miniaturization. A microphone package includes a MEMS microphone component having a microphone diaphragm, and a housing having a housing base and a housing cover, the housing enclosing the back-side volume of the microphone component, and an acoustic access channel to the microphone diaphragm being provided in the housing which is closed off with respect to the back-side volume and which connects at least one sound opening in the housing to one side of the microphone diaphragm. An interposer is mounted inside the housing which defines the acoustic access channel to the microphone diaphragm in that the interposer is coupled to the sound opening in the housing, and has at least one exit opening above which the microphone component together with the microphone diaphragm is mounted.

    摘要翻译： 一种提供麦克风封装的成本有效的实现的系统和方法，即使在高度小型化的情况下也能实现非常好的麦克风性能。 麦克风封装包括具有麦克风隔膜的MEMS麦克风组件，以及具有壳体底座和壳体盖的壳体，该壳体包围麦克风组件的背面体积，以及提供到麦克风隔膜的声学通道 所述壳体相对于后侧体积被封闭，并且将所述壳体中的至少一个声音开口连接到所述麦克风隔膜的一侧。 插入器安装在壳体内部，其限定到麦克风隔膜的声学通道，因为插入器耦合到壳体中的声音开口，并且具有至少一个出口，在该出口处，麦克风组件与麦克风隔膜一起被安装 。

    MEMS CHIP SCALE PACKAGE
    7.
    发明申请
    MEMS CHIP SCALE PACKAGE 审中-公开
    MEMS芯片尺寸包装

    公开(公告)号：US20130147040A1

    公开(公告)日：2013-06-13

    申请号：US13316119

    申请日：2011-12-09

    申请人： Eric Ochs ,  Jay S. Salmon ,  Ricardo Ehrenpfordt

    发明人： Eric Ochs ,  Jay S. Salmon ,  Ricardo Ehrenpfordt

    IPC分类号： H01L23/498 ,  H01L21/50

    CPC分类号： B81C1/0023 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/07 ,  B81B2207/095 ,  B81C2203/0136 ,  B81C2203/0792 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

    摘要： A flip-chip manufactured MEMS device. The device includes a substrate and a MEMS die. The substrate has a plurality of bumps, a plurality of connection points configured to electrically connect the MEMS device to another device, and a plurality of vias electrically connecting the bumps to the connections points. The MEMS die is attached to the substrate using flip-chip manufacturing techniques, but the MEMS die is not subjected to processing normally associated with creating bumps for flip-chip manufacturing.

    摘要翻译： 一种倒装芯片制造的MEMS器件。 该器件包括衬底和MEMS管芯。 衬底具有多个凸块，多个连接点被配置为将MEMS器件电连接到另一个器件，以及多个通孔将电极连接到连接点。 使用倒装芯片制造技术将MEMS芯片附接到基板，但是MEMS管芯不经受通常与用于倒装芯片制造的凸块相关联的处理。

    Electronic circuit unit
    8.
    发明授权
    Electronic circuit unit 有权
    电子电路单元

    公开(公告)号：US07772688B2

    公开(公告)日：2010-08-10

    申请号：US11631559

    申请日：2005-06-30

    申请人： Eric Ochs ,  Christoph Ruf

    发明人： Eric Ochs ,  Christoph Ruf

    IPC分类号： H01L23/04

    CPC分类号： H01L23/49833 ,  H01L23/057 ,  H01L23/3677 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention relates to an electronic circuit unit having at least one semiconductor (15), that is situated on a substrate, and whose electrical connections are in electrical contact with printed circuit traces of the substrate, and having a housing, that accommodates the substrate, which has contact paths which are connected to the printed circuit traces of the substrate using electrical connections. It is provided that the electrical connections (20) each have a contact surface (17) situated on the substrate (12) which, when the substrate (12) and the housing (2) are joined together, comes to lie in an opposing position to the counter-contact surfaces (19) of the contact paths (21). The present invention also relates to a corresponding manufacturing method.

    摘要翻译： 本发明涉及一种电子电路单元，其具有位于基板上的至少一个半导体（15），并且其电连接与基板的印刷电路迹线电接触，并具有容纳基板的壳体 ，其具有使用电连接连接到基板的印刷电路迹线的接触路径。 设置电连接（20）各自具有位于基板（12）上的接触表面（17），当基板（12）和壳体（2）接合在一起时，它们位于相对位置 到接触路径（21）的反接触表面（19）。 本发明还涉及相应的制造方法。

    Electronic Circuit Unit
    10.
    发明申请
    Electronic Circuit Unit 有权
    电子电路单元

    公开(公告)号：US20080061426A1

    公开(公告)日：2008-03-13

    申请号：US11631559

    申请日：2006-01-12

    申请人： Eric Ochs ,  Christoph Ruf

    发明人： Eric Ochs ,  Christoph Ruf

    IPC分类号： H01L23/488 ,  H01L21/58

    CPC分类号： H01L23/49833 ,  H01L23/057 ,  H01L23/3677 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention relates to an electronic circuit unit having at least one semiconductor (15), that is situated on a substrate, and whose electrical connections are in electrical contact with printed circuit traces of the substrate, and having a housing, that accommodates the substrate, which has contact paths which are connected to the printed circuit traces of the substrate using electrical connections. It is provided that the electrical connections (20) each have a contact surface (17) situated on the substrate (12) which, when the substrate (12) and the housing (2) are joined together, comes to lie in an opposing position to the counter-contact surfaces (19) of the contact paths (21). The present invention also relates to a corresponding manufacturing method.

    摘要翻译： 本发明涉及一种电子电路单元，其具有位于基板上的至少一个半导体（15），并且其电连接与基板的印刷电路迹线电接触，并具有容纳基板的壳体 ，其具有使用电连接连接到基板的印刷电路迹线的接触路径。 设置电连接（20）各自具有位于基板（12）上的接触表面（17），当基板（12）和壳体（2）接合在一起时，它们位于相对位置 到接触路径（21）的反接触表面（19）。 本发明还涉及相应的制造方法。