公开(公告)号：US08735920B2

公开(公告)日：2014-05-27

申请号：US11496922

申请日：2006-07-31

申请人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

发明人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.

摘要翻译： 一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。 内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。 在基板和透镜之间布置粘合剂以将透镜保持在基板上并补偿透镜与封装的其余部分之间的不同热膨胀系数（CTE）。 一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。 内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。 通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

公开(公告)号：US20080023711A1

公开(公告)日：2008-01-31

申请号：US11496922

申请日：2006-07-31

申请人： Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller ,  James Ibbetson

发明人： Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller ,  James Ibbetson

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.

摘要翻译： 一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。 内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。 在基板和透镜之间布置粘合剂以将透镜保持在基板上并且补偿透镜与封装的其余部分之间的不同的热膨胀系数（CTE）。 一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。 内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。 通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

公开(公告)号：US20070228387A1

公开(公告)日：2007-10-04

申请号：US11398214

申请日：2006-04-04

申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。

公开(公告)号：US08969908B2

公开(公告)日：2015-03-03

申请号：US11398214

申请日：2006-04-04

申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/48

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。

公开(公告)号：US07804147B2

公开(公告)日：2010-09-28

申请号：US11496918

申请日：2006-07-31

申请人： Eric Tarsa ,  Thomas C. Yuan ,  Maryanne Becerra ,  Praveen Yadev

发明人： Eric Tarsa ,  Thomas C. Yuan ,  Maryanne Becerra ,  Praveen Yadev

IPC分类号： H01L31/0203 ,  H01L31/0232 ,  H01L31/00 ,  H01L51/00 ,  H01L33/00

CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a portion having a radius of curvature larger than the liquid encapsulant. The larger radius of curvature portion of the optical element is brought into contact with the liquid encapsulant. The optical element is then moved closer to the LED chip, growing the contact area between said optical element and said liquid encapsulant. The liquid encapsulant is then cured. A light emitting diode comprising a substrate with an LED chip mounted to it. A meniscus ring is on the substrate around the LED chip with the meniscus ring having a meniscus holding feature. An inner encapsulant is provided over the LED chip with the inner encapsulant having a contacting surface on the substrate, with the meniscus holding feature which defines the edge of the contacting surface. An optical element is included having a bottom surface with at least a portion that is concave. The optical element is arranged on the substrate with the concave portion over the LED chip. A contacting encapsulant is included between the inner encapsulant and optical element.

摘要翻译： 一种用于制造发光二极管（LED）封装的方法，包括提供LED芯片并且用具有曲率半径的液体密封剂覆盖所述LED芯片的至少一部分。 提供一种具有底表面的光学元件，其具有至少一部分具有比液体密封剂大的曲率半径的部分。 光学元件的较大的曲率半径部分与液体密封剂接触。 然后将光学元件移动到更靠近LED芯片，增加所述光学元件和所述液体密封剂之间的接触面积。 然后固化液体密封剂。 一种发光二极管，包括安装有LED芯片的基板。 半月板环位于LED芯片周围的基板上，弯液面具有弯月面保持特征。 内部密封剂设置在LED芯片上，内部密封剂在基底上具有接触表面，其中弯月面保持特征限定接触表面的边缘。 包括具有至少一部分凹陷的底表面的光学元件。 光学元件布置在基板上，其中凹部在LED芯片上。 内密封剂和光学元件之间包括接触密封剂。

公开(公告)号：US20080026498A1

公开(公告)日：2008-01-31

申请号：US11496918

申请日：2006-07-31

申请人： Eric Tarsa ,  Thomas C. Yuan ,  Maryanne Becerra ,  Praveen Yadev

发明人： Eric Tarsa ,  Thomas C. Yuan ,  Maryanne Becerra ,  Praveen Yadev

IPC分类号： H01L21/00

CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a portion having a radius of curvature larger than the liquid encapsulant. The larger radius of curvature portion of the optical element is brought into contact with the liquid encapsulant. The optical element is then moved closer to the LED chip, growing the contact area between said optical element and said liquid encapsulant. The liquid encapsulant is then cured. A light emitting diode comprising a substrate with an LED chip mounted to it. A meniscus ring is on the substrate around the LED chip with the meniscus ring having a meniscus holding feature. An inner encapsulant is provided over the LED chip with the inner encapsulant having a contacting surface on the substrate, with the meniscus holding feature which defines the edge of the contacting surface. An optical element is included having a bottom surface with at least a portion that is concave. The optical element is arranged on the substrate with the concave portion over the LED chip. A contacting encapsulant is included between the inner encapsulant and optical element.

摘要翻译： 一种用于制造发光二极管（LED）封装的方法，包括提供LED芯片并且用具有曲率半径的液体密封剂覆盖所述LED芯片的至少一部分。 提供一种具有底表面的光学元件，其具有至少一部分具有比液体密封剂大的曲率半径的部分。 光学元件的较大的曲率半径部分与液体密封剂接触。 然后将光学元件移动到更靠近LED芯片，增加所述光学元件和所述液体密封剂之间的接触面积。 然后固化液体密封剂。 一种发光二极管，包括安装有LED芯片的基板。 半月板环位于LED芯片周围的基板上，弯液面具有弯月面保持特征。 内部密封剂设置在LED芯片上，内部密封剂在基底上具有接触表面，其中弯月面保持特征限定接触表面的边缘。 包括具有至少一部分凹陷的底表面的光学元件。 光学元件布置在基板上，其中凹部在LED芯片上。 内密封剂和光学元件之间包括接触密封剂。

公开(公告)号：US20090014736A1

公开(公告)日：2009-01-15

申请号：US11827626

申请日：2007-07-11

申请人： James Ibbetson ,  Kristi Wong ,  Maryanne Becerra

发明人： James Ibbetson ,  Kristi Wong ,  Maryanne Becerra

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/508 ,  H01L33/44 ,  H01L33/54 ,  H01L2933/0041

摘要： Methods for fabricating a semiconductor devices, and in particular light emitting diodes (LEDS) comprising providing a plurality of semiconductor devices on a substrate and forming a contact on at least some of the semiconductor devices. A containment structure is formed on at least some of the semiconductor devices having a contact with each containment structure defining a deposition area excluding the contact. A coating material is deposited then within the deposition area, with the coating material not covering the contact. A light emitting diode (LED) chip wafer comprising a plurality of LEDs on a substrate wafer with at least some of the LEDs having a contact. A plurality of containment structures are included, each of which is associated with a respective one of the plurality of LEDs. Each of the containment structures at least partially on its respective one of the LEDs and defining a deposition area on its respective one of the LEDs. The deposition area excludes the contact. A coating is included in each of the deposition areas.

摘要翻译： 制造半导体器件的方法，特别是包括在衬底上提供多个半导体器件并在至少一些半导体器件上形成接触的发光二极管（LEDS）。 在至少一些半导体器件上形成容纳结构，该半导体器件与限定除接触之外的沉积区域的每个容纳结构接触。 然后在沉积区域内沉积涂层材料，涂层材料不覆盖接触。 一种发光二极管（LED）芯片晶片，其在衬底晶片上包括多个LED，其中至少一些LED具有接触。 包括多个容纳结构，每个包含结构与多个LED中的相应一个LED相关联。 每个容纳结构至少部分地在其相应的一个LED上并且在其相应的一个LED上限定沉积区域。 沉积区不包括接触。 在每个沉积区域中包括涂层。

公开(公告)号：US07799586B2

公开(公告)日：2010-09-21

申请号：US12398626

申请日：2009-03-05

申请人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

发明人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

IPC分类号： H01L29/207 ,  H01L21/00

CPC分类号： H01L33/507 ,  H01L33/52 ,  H01L33/58 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.

摘要翻译： 包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。 空腔中的第一量的密封剂材料被处理以形成具有选定形状的硬化的上表面。 在被处理的第一量的密封剂材料的上表面上设置发光转换元件。 发光转换元件包括波长转换材料，并且在腔的中间区域处的厚度大于靠近腔的侧壁的厚度。

公开(公告)号：US08039859B2

公开(公告)日：2011-10-18

申请号：US12886001

申请日：2010-09-20

申请人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

发明人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/52 ,  H01L33/58 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.

摘要翻译： 包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。 将空腔中的第一量的密封材料进行处理以形成具有形状的硬化的上表面。 在被处理的第一量的密封剂材料的上表面上设置发光转换元件。 发光转换元件包括波长转换材料，并且在空腔的中间区域处的厚度大于靠近空腔侧壁的厚度。

公开(公告)号：US20110006330A1

公开(公告)日：2011-01-13

申请号：US12886001

申请日：2010-09-20

申请人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

发明人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

IPC分类号： H01L33/52 ,  H01L33/50

CPC分类号： H01L33/507 ,  H01L33/52 ,  H01L33/58 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.

摘要翻译： 包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。 将空腔中的第一量的密封材料进行处理以形成具有形状的硬化的上表面。 在被处理的第一量的密封剂材料的上表面上设置发光转换元件。 发光转换元件包括波长转换材料，并且在腔的中间区域处的厚度大于靠近腔的侧壁的厚度。